JPS6185894U - - Google Patents
Info
- Publication number
- JPS6185894U JPS6185894U JP1984171489U JP17148984U JPS6185894U JP S6185894 U JPS6185894 U JP S6185894U JP 1984171489 U JP1984171489 U JP 1984171489U JP 17148984 U JP17148984 U JP 17148984U JP S6185894 U JPS6185894 U JP S6185894U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- utility
- carrying members
- bendable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171489U JPH0132066Y2 (en:Method) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171489U JPH0132066Y2 (en:Method) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185894U true JPS6185894U (en:Method) | 1986-06-05 |
| JPH0132066Y2 JPH0132066Y2 (en:Method) | 1989-10-02 |
Family
ID=30729173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984171489U Expired JPH0132066Y2 (en:Method) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132066Y2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121808A (ja) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | Ｌｅｄ表示用デバイス |
-
1984
- 1984-11-12 JP JP1984171489U patent/JPH0132066Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121808A (ja) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | Ｌｅｄ表示用デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0132066Y2 (en:Method) | 1989-10-02 |