JPS6185007U - - Google Patents
Info
- Publication number
- JPS6185007U JPS6185007U JP1984170363U JP17036384U JPS6185007U JP S6185007 U JPS6185007 U JP S6185007U JP 1984170363 U JP1984170363 U JP 1984170363U JP 17036384 U JP17036384 U JP 17036384U JP S6185007 U JPS6185007 U JP S6185007U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- light emitting
- large number
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170363U JPS6346972Y2 (en:Method) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170363U JPS6346972Y2 (en:Method) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185007U true JPS6185007U (en:Method) | 1986-06-04 |
| JPS6346972Y2 JPS6346972Y2 (en:Method) | 1988-12-05 |
Family
ID=30728070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984170363U Expired JPS6346972Y2 (en:Method) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6346972Y2 (en:Method) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116510U (en:Method) * | 1990-03-08 | 1991-12-03 | ||
| JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Ｌｅｄ照明装置 |
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
| JP2006128265A (ja) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| JP2006332234A (ja) * | 2005-05-25 | 2006-12-07 | Hitachi Aic Inc | 反射機能を有するｌｅｄ装置 |
| JP2006344771A (ja) * | 2005-06-09 | 2006-12-21 | Hitachi Aic Inc | Ｌｅｄ装置用反射体およびその製造方法 |
-
1984
- 1984-11-12 JP JP1984170363U patent/JPS6346972Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116510U (en:Method) * | 1990-03-08 | 1991-12-03 | ||
| JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Ｌｅｄ照明装置 |
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
| JP2006128265A (ja) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| JP2006332234A (ja) * | 2005-05-25 | 2006-12-07 | Hitachi Aic Inc | 反射機能を有するｌｅｄ装置 |
| JP2006344771A (ja) * | 2005-06-09 | 2006-12-21 | Hitachi Aic Inc | Ｌｅｄ装置用反射体およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6346972Y2 (en:Method) | 1988-12-05 |