JPS6183080U - - Google Patents
Info
- Publication number
- JPS6183080U JPS6183080U JP16964284U JP16964284U JPS6183080U JP S6183080 U JPS6183080 U JP S6183080U JP 16964284 U JP16964284 U JP 16964284U JP 16964284 U JP16964284 U JP 16964284U JP S6183080 U JPS6183080 U JP S6183080U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- terminals
- external
- shape
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16964284U JPS6183080U (ru) | 1984-11-07 | 1984-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16964284U JPS6183080U (ru) | 1984-11-07 | 1984-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183080U true JPS6183080U (ru) | 1986-06-02 |
Family
ID=30727360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16964284U Pending JPS6183080U (ru) | 1984-11-07 | 1984-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183080U (ru) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6342364A (ja) * | 1986-08-08 | 1988-02-23 | Semiconductor Energy Lab Co Ltd | 光加工方法 |
| JPH01137581A (ja) * | 1988-04-21 | 1989-05-30 | Casio Comput Co Ltd | Ｉｃチップリードの接合方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59163893A (ja) * | 1983-03-08 | 1984-09-14 | 富士通株式会社 | セラミツク配線板への部品実装構造 |
-
1984
- 1984-11-07 JP JP16964284U patent/JPS6183080U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59163893A (ja) * | 1983-03-08 | 1984-09-14 | 富士通株式会社 | セラミツク配線板への部品実装構造 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6342364A (ja) * | 1986-08-08 | 1988-02-23 | Semiconductor Energy Lab Co Ltd | 光加工方法 |
| JPH01137581A (ja) * | 1988-04-21 | 1989-05-30 | Casio Comput Co Ltd | Ｉｃチップリードの接合方法 |