JPS6183052U - - Google Patents
Info
- Publication number
- JPS6183052U JPS6183052U JP16731784U JP16731784U JPS6183052U JP S6183052 U JPS6183052 U JP S6183052U JP 16731784 U JP16731784 U JP 16731784U JP 16731784 U JP16731784 U JP 16731784U JP S6183052 U JPS6183052 U JP S6183052U
- Authority
- JP
- Japan
- Prior art keywords
- grinders
- lead
- gap
- polish
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
第１図は、本考案の一実施例を示す側面図、第
２図は同平面図である。 １…グラインダー、２…モーター、３…固定台
、４…支持台、５…ネジ、６…半導体素子のリー
ド。
２図は同平面図である。 １…グラインダー、２…モーター、３…固定台
、４…支持台、５…ネジ、６…半導体素子のリー
ド。
Claims (1)
- ２台のグラインダーを、その間に一定間隔の空
隙をあけて向い合せに設置し、研摩したい半導体
素子のリードを空隙に入れることにより、リード
の両面から２台のグライダーにて研摩可能とした
ことを特徴とする半導体素子の研摩装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16731784U JPS6183052U (ja) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16731784U JPS6183052U (ja) | 1984-11-02 | 1984-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183052U true JPS6183052U (ja) | 1986-06-02 |
Family
ID=30725117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16731784U Pending JPS6183052U (ja) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183052U (ja) |
-
1984
- 1984-11-02 JP JP16731784U patent/JPS6183052U/ja active Pending
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