JPS6183045U - - Google Patents
Info
- Publication number
- JPS6183045U JPS6183045U JP16758284U JP16758284U JPS6183045U JP S6183045 U JPS6183045 U JP S6183045U JP 16758284 U JP16758284 U JP 16758284U JP 16758284 U JP16758284 U JP 16758284U JP S6183045 U JPS6183045 U JP S6183045U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded
- exposed
- semiconductor device
- support pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16758284U JPS6183045U (fr) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16758284U JPS6183045U (fr) | 1984-11-05 | 1984-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6183045U true JPS6183045U (fr) | 1986-06-02 |
Family
ID=30725372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16758284U Pending JPS6183045U (fr) | 1984-11-05 | 1984-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6183045U (fr) |
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1984
- 1984-11-05 JP JP16758284U patent/JPS6183045U/ja active Pending