JPS6183040U - - Google Patents
Info
- Publication number
- JPS6183040U JPS6183040U JP16832884U JP16832884U JPS6183040U JP S6183040 U JPS6183040 U JP S6183040U JP 16832884 U JP16832884 U JP 16832884U JP 16832884 U JP16832884 U JP 16832884U JP S6183040 U JPS6183040 U JP S6183040U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- tip
- clamping jig
- bonding arm
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16832884U JPS6183040U (pt) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16832884U JPS6183040U (pt) | 1984-11-06 | 1984-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6183040U true JPS6183040U (pt) | 1986-06-02 |
Family
ID=30726104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16832884U Pending JPS6183040U (pt) | 1984-11-06 | 1984-11-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6183040U (pt) |
-
1984
- 1984-11-06 JP JP16832884U patent/JPS6183040U/ja active Pending
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