JPS6181146U - - Google Patents

Info

Publication number
JPS6181146U
JPS6181146U JP1984166736U JP16673684U JPS6181146U JP S6181146 U JPS6181146 U JP S6181146U JP 1984166736 U JP1984166736 U JP 1984166736U JP 16673684 U JP16673684 U JP 16673684U JP S6181146 U JPS6181146 U JP S6181146U
Authority
JP
Japan
Prior art keywords
recess
lead
package body
bent part
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984166736U
Other languages
English (en)
Other versions
JPH0217484Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984166736U priority Critical patent/JPH0217484Y2/ja
Publication of JPS6181146U publication Critical patent/JPS6181146U/ja
Application granted granted Critical
Publication of JPH0217484Y2 publication Critical patent/JPH0217484Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Description

【図面の簡単な説明】
第１図はこの考案の一実施例のケラツトパツケ
ージのキヤツプを除いた平面図で、第２図は第１
図の−線に対応する断面図である。第３図は
従来のフラツトパツケージのキヤツプを除いた平
面図で、第４図は第３図の−線に対応する断
面図である。第５図はキヤツプのシール方法につ
いて説明するためのシール前の分解断面図である
。 ２……底板、２ａ……凹部、４……ガラス、５
，６……リード、５ａ，６ａ……屈曲部、７……
キヤツプ、８……低融点ガラス。

Claims (1)

  1. 【実用新案登録請求の範囲】 ガラスを介してリードをシールしてなるパツケ
    ージ本体とこのパツケージ本体に低融点ガラスを
    介してシールされたキヤツプとで構成されたフラ
    ツトパツケージにおいて、 前記パツケージ本体の底板に凹部を形成すると
    ともに、この凹部に対応して前記リードに屈曲部
    を形成し、この屈曲部を前記凹部に熱的に結合し
    たことを特徴とするフラツトパツケージ。
JP1984166736U 1984-10-31 1984-10-31 Expired JPH0217484Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984166736U JPH0217484Y2 (ja) 1984-10-31 1984-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984166736U JPH0217484Y2 (ja) 1984-10-31 1984-10-31

Publications (2)

Publication Number Publication Date
JPS6181146U true JPS6181146U (ja) 1986-05-29
JPH0217484Y2 JPH0217484Y2 (ja) 1990-05-16

Family

ID=30724545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984166736U Expired JPH0217484Y2 (ja) 1984-10-31 1984-10-31

Country Status (1)

Country Link
JP (1) JPH0217484Y2 (ja)

Also Published As

Publication number Publication date
JPH0217484Y2 (ja) 1990-05-16

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