JPS617742B2 - - Google Patents
Info
- Publication number
- JPS617742B2 JPS617742B2 JP51159513A JP15951376A JPS617742B2 JP S617742 B2 JPS617742 B2 JP S617742B2 JP 51159513 A JP51159513 A JP 51159513A JP 15951376 A JP15951376 A JP 15951376A JP S617742 B2 JPS617742 B2 JP S617742B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15951376A JPS5384466A (en) | 1976-12-29 | 1976-12-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15951376A JPS5384466A (en) | 1976-12-29 | 1976-12-29 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5384466A JPS5384466A (en) | 1978-07-25 |
| JPS617742B2 true JPS617742B2 (ko) | 1986-03-08 |
Family
ID=15695405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15951376A Granted JPS5384466A (en) | 1976-12-29 | 1976-12-29 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5384466A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001351940A (ja) * | 2000-04-10 | 2001-12-21 | Agere Systems Guardian Corp | Ｉｃチップにおいて銅相互接続配線 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5524414A (en) * | 1978-08-09 | 1980-02-21 | Hitachi Ltd | Electrode forming process |
| KR910006967B1 (ko) * | 1987-11-18 | 1991-09-14 | 가시오 게이상기 가부시기가이샤 | 반도체 장치의 범프 전극 구조 및 그 형성 방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492482A (ko) * | 1972-04-18 | 1974-01-10 |
-
1976
- 1976-12-29 JP JP15951376A patent/JPS5384466A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492482A (ko) * | 1972-04-18 | 1974-01-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001351940A (ja) * | 2000-04-10 | 2001-12-21 | Agere Systems Guardian Corp | Ｉｃチップにおいて銅相互接続配線 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5384466A (en) | 1978-07-25 |