JPS6176967U - - Google Patents
Info
- Publication number
- JPS6176967U JPS6176967U JP16088584U JP16088584U JPS6176967U JP S6176967 U JPS6176967 U JP S6176967U JP 16088584 U JP16088584 U JP 16088584U JP 16088584 U JP16088584 U JP 16088584U JP S6176967 U JPS6176967 U JP S6176967U
- Authority
- JP
- Japan
- Prior art keywords
- bonding area
- semiconductor device
- inner lead
- uneven
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16088584U JPS6176967U (me) | 1984-10-24 | 1984-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16088584U JPS6176967U (me) | 1984-10-24 | 1984-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6176967U true JPS6176967U (me) | 1986-05-23 |
Family
ID=30718798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16088584U Pending JPS6176967U (me) | 1984-10-24 | 1984-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176967U (me) |
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1984
- 1984-10-24 JP JP16088584U patent/JPS6176967U/ja active Pending