JPS6173155A - Peeling developing device - Google Patents

Peeling developing device

Info

Publication number
JPS6173155A
JPS6173155A JP19614984A JP19614984A JPS6173155A JP S6173155 A JPS6173155 A JP S6173155A JP 19614984 A JP19614984 A JP 19614984A JP 19614984 A JP19614984 A JP 19614984A JP S6173155 A JPS6173155 A JP S6173155A
Authority
JP
Japan
Prior art keywords
peeling
substrate
width
developing device
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19614984A
Other languages
Japanese (ja)
Inventor
Akio Tsumura
昭雄 津村
Shunichi Hayashi
俊一 林
Noriharu Miyaake
宮明 稚晴
Kazuo Ouchi
一男 大内
Takashi Yamamura
隆 山村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP19614984A priority Critical patent/JPS6173155A/en
Priority to BE0/215395A priority patent/BE902962A/en
Priority to GB08518791A priority patent/GB2165369A/en
Priority to DE19853526696 priority patent/DE3526696A1/en
Priority to US06/758,985 priority patent/US4631110A/en
Publication of JPS6173155A publication Critical patent/JPS6173155A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004Component parts, details or accessories; Auxiliary operations
    • B29C63/0013Removing old coatings
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0537Transfer of pre-fabricated insulating pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To keep a peeling force per unit length of a peeling part constant, and to peel off uniformly the overall length in the width direction of a transparent supporting body, along a peeling bar, by detecting a peeling width of a substrate with which the peeling bar comes into linear contact and controlling a receiving tension of a receiving pinch roll in proportion to said peeling width. CONSTITUTION:A DC motor of receiving pinch rolls 7, 7 is controlled by a peeling force control system so that the pinch rolls 7, 7 generate a tensile force corresponding to a peeling width from a substrate 2 on which a transparent supporting body 4 comes into linear contact with a peeling bar 6, and a peeling force per unit length of a peeling part running along the peeling bar 6 becomes constant. The peeling force control system is obtained, for instance, due to a fact that a DC motor 13 is brought to speed control by a seed controlling closed loop circuit of the DC motor 13.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明は、印刷回路等の製造の用に供される剥離現像
装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a peeling and developing device used for manufacturing printed circuits and the like.

〈従来の技術〉 印刷回路の製造等のために、画像形成用基板の表面に透
明支持体と、この支持体上に被着された光重合性組成物
層とからなる画像形成材料の上記光重合性組成物層側を
貼着し、この光重合性組成物心を画像状に露光して硬化
領域を形成し、更に必要に応じて上記画像成形材料を加
温した後、上記支持体および光重合性組成物層の未露光
部を基板から剥離して該基板上に画像状のレジストを形
成する画像形成手段がすでに提案されている。
<Prior Art> For the production of printed circuits, etc., the above-mentioned photo-coating of an image-forming material consisting of a transparent support and a photopolymerizable composition layer coated on the support is applied to the surface of an image-forming substrate. The polymerizable composition layer side is adhered, and the photopolymerizable composition is imagewise exposed to light to form a cured area, and if necessary, the image forming material is heated, and then the support and the light Image forming means has already been proposed in which an unexposed portion of a polymerizable composition layer is peeled off from a substrate to form an image-like resist on the substrate.

上記のような剥離現像方法において、シャープな仕上が
りの良好な画像を得るための重要なポイントは、画像成
形材料の剥離工程にあるといっても過言ではない。
It is no exaggeration to say that in the peeling development method as described above, the important point for obtaining a good image with a sharp finish is the peeling step of the image forming material.

ところで、この発明者等は、画像形成材料の剥離手段と
して、連続した粘着テープを基板上の支持体に順次貼着
しながら剥離する装置、即ち第1図ないし第4図のよう
に、幅の狭い粘着テープ1を方形基板2のコ・−すにか
かるように画像形成材料3の透明支持体4上に貼合わせ
、上記基板2を上下一対の搬送用ピンチロール5,5で
挾んで斜めに送り、粘着テープ1と画像形成相1313
を介して基板2に線化するよう配置した剥離バー6に沿
って、粘着テープ1と支持体4を、一対の引取用ピンチ
ロール7.7による引取りによって方形基板2のコーナ
部分から剥離し、支持体と未り光の光重合性組成物層8
aを基板より剥離し、露光さtした光重合性組成物心8
bを基板2上に残存させるようにしたものを提案してい
る。
By the way, as a means for peeling off the image forming material, the inventors have developed an apparatus that sequentially attaches and peels off a continuous adhesive tape to a support on a substrate, that is, as shown in FIGS. A narrow adhesive tape 1 is pasted on the transparent support 4 of the image forming material 3 so as to cover the corner of the rectangular substrate 2, and the substrate 2 is held diagonally between a pair of upper and lower conveying pinch rolls 5, 5. Feeding, adhesive tape 1 and image forming phase 1313
The adhesive tape 1 and the support 4 are peeled off from the corners of the rectangular substrate 2 by a pair of pinch rolls 7.7 along the peeling bar 6 arranged so as to form a line on the substrate 2 through the peeling bar 6. , a support and a luminescent photopolymerizable composition layer 8
The photopolymerizable composition core 8 was peeled off from the substrate and exposed to light.
It is proposed that b remains on the substrate 2.

〈発明が解決しようとする問題3(n 〉ところで、基
板2を斜めにして搬送し、粘着テープ1と透明支持体4
を引取用ピンチロール7.7により均一な速度で引張り
、剥離バー6に沿って剥離する装置は、剥離バー6にi
aう透明支持体4の線化長さ、即ち剥離時における基板
2からの支持体剥離幅が刻々と変化し、引取用ピンチロ
ール7.7が一定の引張力であると、剥離部中位長さあ
たりの剥mt力も変化する。
<Problem 3 (n) to be solved by the invention> By the way, the substrate 2 is conveyed obliquely, and the adhesive tape 1 and the transparent support 4 are
A device that pulls the material at a uniform speed with a pinch roll 7.7 for peeling and peels it along the peeling bar 6 is attached to the peeling bar 6.
If the line length of the transparent support 4 (a), that is, the peel width of the support from the substrate 2 during peeling, changes from moment to moment, and the pulling pinch rolls 7. Peeling force per length also changes.

このため、引取用ピンチロール7.7による引取力が弱
く、剥離力が不足した場合、透明支持体を基板から剥離
することができず、逆に剥離力が強すぎると透明支持体
のピックアップの確率が低下するという問題がある。
Therefore, if the pulling force by the picking-up pinch roll 7.7 is weak and the peeling force is insufficient, the transparent support cannot be peeled off from the substrate, and conversely, if the peeling force is too strong, the transparent support cannot be picked up. The problem is that the probability decreases.

また、このとき剥離力の変動で透明支持体が剥離バーに
沿わなくなり、いわゆるビビリ現象が生じ、これが原因
となって以下のような問題が発生する。
Further, at this time, due to fluctuations in peeling force, the transparent support does not follow the peeling bar, resulting in a so-called chatter phenomenon, which causes the following problems.

fI)  未露光部が部分的に取れ残る。fI) Partial unexposed areas remain.

fl[)  露光部が部分的に剥がれる。fl[) The exposed area is partially peeled off.

(3)露光部の画線がぎざつぎ解懺度が落ちる。(3) The image lines in the exposed area are jagged and the resolution is reduced.

■ 基板内のスルーホールをエツチングスプレー液から
保護する、いわゆるテンティング法で製造したスルーホ
ール基板の場合、テンティング皮膜が破損する。
■ In the case of through-hole substrates manufactured by the so-called tenting method, which protects the through-holes in the substrate from etching spray liquid, the tenting film is damaged.

M 透明支持体のピックアップミスが多く、特に薄い基
板に対するピックアップミスが顕著である。
M There are many pickup errors for transparent supports, and pickup errors for thin substrates are particularly noticeable.

この発明は、上記のような各種問題点を解決するために
なされたものであり、剥離現像時に透明支持体のいわゆ
るビビリ現象の発生がなく、剥離が安定し、基板全面に
わたって良好な画像を得ることができる剥離現像装置を
提供することを目的とする。
This invention was made in order to solve the various problems mentioned above, and eliminates the so-called chatter phenomenon of the transparent support during peel development, stabilizes peeling, and provides a good image over the entire surface of the substrate. It is an object of the present invention to provide a peeling and developing device that can perform the following steps.

〈問題点を解決するための手段〉 上記の問題点を解決するため、この発明は、透明支持体
が剥離バーに線化する長さに等しい基板剥離幅を検出し
、一対の引取用ピンチロールに、この基板剥離幅に応じ
た引取張力を51生させる剥離力制御系を具備したもの
である。
<Means for Solving the Problems> In order to solve the above problems, the present invention detects a substrate peeling width equal to the length of a transparent support lined into a peeling bar, and uses a pair of pinch rolls for taking off. The device is also equipped with a peeling force control system that generates a take-off tension according to the substrate peeling width.

く作  用〉 画像形成材料にパターン状の露光を行なった後、方形基
板のコーナにかかるように粘着テープを重ねて貼合せ、
この基板を搬送用ビンブーロール間に送り込み、続いて
粘着テープと透明支持体を引取用ピンチロールで引張り
、剥離バーに沿って粘るテープと同時に透明支持体を基
板のコーナ部分から引き剥がず。
Function: After exposing the image forming material to light in a pattern, adhesive tape is laminated so as to cover the corners of the rectangular substrate.
This substrate is sent between transporting bimboo rolls, and then the adhesive tape and transparent support are pulled with a pick-up pinch roll, and the transparent support is not peeled off from the corner of the substrate at the same time as the tape sticks along the peeling bar.

このとき、剥離バーか線化づるIJ仮剥離幅を検出し、
この剥離幅に比例して引取用ピンチロールの引取張力を
制すロし、剥離部分の単位長さあたりの剥離力を一定に
して透明支Hj体の幅方向全長を剥離バーに沿って均一
に剥朗ザる。
At this time, the peeling bar detects the IJ temporary peeling width,
By controlling the pulling tension of the pinch roll for pulling in proportion to the peeling width, the peeling force per unit length of the peeled portion is kept constant and the entire widthwise length of the transparent support body is peeled uniformly along the peeling bar. Recite.

〈実 施 例〉 以下、この発明の実施例を添付図面にもとづいて説明す
る。
<Embodiments> Hereinafter, embodiments of the present invention will be described based on the accompanying drawings.

剥離装置は、第1図と第2図で示しIζように、基板2
の搬送路を挾む上下に配置した一対の搬送用ピンチロー
ル5.5と上位ピンチロール5の送り方向の前方位置に
このピンチロール5と平行するよう配置した剥離バー6
と、剥離バー6の上方に配置した一対の引取用ピンチロ
ール7.7とで構成され、搬送用ピンチロール5.5は
直流モータで駆動され、基板2を一定の速度で搬送する
ようになっている。
As shown in FIGS. 1 and 2, the peeling device removes the substrate 2.
A pair of conveyance pinch rolls 5.5 are placed above and below the conveyance path, and a peeling bar 6 is placed in front of the upper pinch roll 5 in the feeding direction so as to be parallel to the pinch roll 5.
and a pair of pick-up pinch rolls 7.7 arranged above the peeling bar 6. The conveyance pinch rolls 5.5 are driven by a DC motor and convey the substrate 2 at a constant speed. ing.

引取用ピンチロール7.7も同じく直流モータで駆動さ
れ、粘着テープ1と透明支持体4とを引取り、これを剥
離バー6に沿って基板2から引き剥がすものである。
The pick-up pinch roll 7.7 is also driven by a DC motor and serves to pick up the adhesive tape 1 and the transparent support 4 and peel them off from the substrate 2 along the peeling bar 6.

前記引取用ピンチロール7.1の直流モータは、透明支
持体4が剥離バー6に線接する基板2からの剥離幅に応
じた引取張力をピンチロール7.7が発生するよう剥離
力制御系によって制御され、剥離バー6に沿う剥離部分
の単Kt長さあたつの剥離力を一定にしている。
The DC motor of the picking-up pinch roll 7.1 is operated by a peeling force control system so that the pinch roll 7.7 generates a pulling tension corresponding to the peeling width from the substrate 2 where the transparent support 4 is in line contact with the peeling bar 6. The peeling force applied to the single Kt length of the peeling portion along the peeling bar 6 is controlled to be constant.

上記剥離力制御系は、例えば第5図に示ず直流モータ1
3の速度υ[1用閉ル一プ回路により、直流モータ13
が速度制御されることで得られる。即ち、直流モータの
特性により、負荷、この場合は剥離バー6に線接する長
さ、即ち基板剥離幅に応じたトルクが発生し、そのトル
クで引取用ピンチロール7.7を駆動することになるの
で、館記基板剥鱈]幅に比例した引取張力にて透明支持
体4とともに未露光の光重合性組成物1iJ8aを塞板
2より引き剥がすことができる。
The above-mentioned peeling force control system is, for example, not shown in FIG.
3 speed υ[1 by closed loop circuit, DC motor 13
is obtained by controlling the speed. That is, due to the characteristics of the DC motor, a load, in this case a torque corresponding to the length tangential to the peeling bar 6, that is, the substrate peeling width, is generated, and this torque drives the take-off pinch roll 7.7. Therefore, the unexposed photopolymerizable composition 1iJ8a can be peeled off from the cover plate 2 together with the transparent support 4 with a pulling tension proportional to the width of the substrate.

なお、第5図は設定引取速度に応じた設定パルスvlP
 sと直流モータ13の回転軸に伝導しているパルスエ
ンコーダ11が検出する、検出パルスPを比較したのち
、演算器12で演算してモータ13を制御するようにな
っていることを示す。
In addition, Fig. 5 shows the setting pulse vlP according to the setting take-up speed.
s is compared with the detection pulse P detected by the pulse encoder 11 that is transmitted to the rotating shaft of the DC motor 13, and then the calculation unit 12 performs calculations to control the motor 13.

引取用ピンチロール1,1の引取張力制御は、直流モー
タ13を直接制御するだけでなく、例えばモータと引取
用ピンチロール7.1の動力伝導系の途中にパウダクラ
ッチを配設し、剥離幅の検出信号でパウダクラッチを制
御することにより引取張力を変化させるようにしてもよ
い。
To control the pulling tension of the pulling pinch rolls 1, 1, it is possible to control the peeling width by not only directly controlling the DC motor 13, but also by arranging a powder clutch between the motor and the power transmission system between the pulling pinch rolls 7.1. The take-up tension may be changed by controlling the powder clutch using the detection signal.

なお、両面に画像形成材料を積層した基板を処理する場
合、基板搬送路の上下両側に剥離装置を配置ずればよく
、また剥離効果を向上させるため搬送用ピンチロール5
,5や剥離バー6に加温手段を設けるようにしてもよい
Note that when processing a substrate with image forming materials laminated on both sides, peeling devices may be placed on both the upper and lower sides of the substrate conveyance path, and conveyance pinch rolls 5 may be installed to improve the peeling effect.
, 5 and the peeling bar 6 may be provided with heating means.

この発明は上記のような構成であり、画像形成材料3が
積層され、露光を終えた方形基板2を、第4図のように
、その先端コーナ部分に粘着テープ1をセットした状態
で搬送用ピンチロール5,5間に挿入すると、透明支持
体4上に粘着テープ1が貼付けられ、粘着テープ1は剥
離バー6の直下を通過した後、上yノの引取用ピンチロ
ール7.7で引かれる。
The present invention has the above-mentioned structure, and the rectangular substrate 2 on which the image forming material 3 is laminated and exposed is transported with the adhesive tape 1 set at the tip corner, as shown in FIG. When inserted between the pinch rolls 5, 5, the adhesive tape 1 is pasted on the transparent support 4, and after passing directly under the peeling bar 6, the adhesive tape 1 is pulled by the pick-up pinch roll 7.7 on the upper side. It will be destroyed.

搬送用ピンチロール5,5で斜め方向へ等速で送られる
方形基板2の剥離バー6に線接する幅方向の艮ざをセン
サで検出し、この検出信号により引取用ピンチロール7
.7の引取張力を制御する。
A sensor detects the cross-section in the width direction that is in contact with the peeling bar 6 of the rectangular substrate 2, which is conveyed diagonally at a constant speed by the conveying pinch rolls 5, 5, and based on this detection signal, the taking-off pinch roll 7
.. Control the take-up tension of 7.

第6図は方形基板2に対する透明支持体4の剥離幅長さ
の変化と、引取用ピンチロール7.7のモータ13に対
する電流供給の関係を示しており、同図から明らかな如
く、剥離幅長ざに対して電流を正比例的に変化させ、剥
離バー6に沿う剥離部分の単位長さあたりの剥離力を帛
に一定にしでいる。
FIG. 6 shows the relationship between the change in peel width length of the transparent support 4 with respect to the rectangular substrate 2 and the current supply to the motor 13 of the take-off pinch roll 7.7, and as is clear from the figure, the peel width The current is changed in direct proportion to the length, and the peeling force per unit length of the peeled portion along the peeling bar 6 is kept constant.

従って、粘着テープ1と透明支持体4および未露光の光
重合性組成物層8aが剥離バー6に沿って先端コーナ部
がら順次引き剥がされ剥離現像が完了する。
Accordingly, the adhesive tape 1, the transparent support 4, and the unexposed photopolymerizable composition layer 8a are sequentially peeled off along the peeling bar 6 from the leading edge corner to complete peeling development.

ここで、透明支持体4は、剥離部分の単位長さあたりの
剥離力が一定になるため、剥離幅が刻々変化しても剥離
幅全長にわたり剥離バー6からの浮上りがなく、いわゆ
るビビリ現象の発生がなくなる。
Here, the transparent support 4 has a constant peeling force per unit length of the peeled portion, so even if the peeling width changes every moment, there is no lifting from the peeling bar 6 over the entire peeling width, resulting in the so-called chatter phenomenon. will no longer occur.

また、透明支持体4を剥離バー6に沿って引剥がすため
、基板2に対する透明支持体4の引き剥がし角度が大き
くとれ、剥離部分の単位長さあたつの剥離力の一定化と
により、テンテ、rング法で製造したスルーホール基板
の場合でら、ズルーボ−ル部をテントした光重合性組成
物層の露光部が透明支持体4とともに剥がれるようなこ
とがない。
In addition, since the transparent support 4 is peeled off along the peeling bar 6, the peeling angle of the transparent support 4 with respect to the substrate 2 can be set large, and the peeling force per unit length of the peeled portion is constant, so that the tente, r Unlike in the case of a through-hole substrate manufactured by the printing method, the exposed portion of the photopolymerizable composition layer tenting the loose ball portion does not peel off together with the transparent support 4.

〈効  果〉 以上のように、この発明によると、画像形成材料の透明
支持体を剥離バーに沿って引き剥がす引取用ピンチロー
ルの引取張力を、支持体の剥離幅、長さに応じて制御す
るようにしたので、剥離バーに沿う支持体!ll離部分
の単位長さあたりの剥離力が常に一定にな゛す、支持体
の剥離幅が変動しても支持体が剥離バーから浮上ること
がなく、従って方形基板を斜めに搬送して剥離を行なっ
ても剥離時のビビリ現象の発生がなくなり、ビビリ現象
によって生じたすべての問題を解決し、基板全面にわた
って良好な画像が得られる。
<Effect> As described above, according to the present invention, the pulling tension of the pinch roll for peeling off the transparent support of the image forming material along the peeling bar can be controlled according to the peeling width and length of the support. So the support along the peel bar! The peeling force per unit length of the peeling portion is always constant, and even if the peeling width of the support changes, the support does not float up from the peeling bar. Therefore, it is possible to transport a square substrate diagonally. Even if peeling is performed, the occurrence of chatter phenomenon during peeling is eliminated, all problems caused by the chatter phenomenon are solved, and a good image can be obtained over the entire surface of the substrate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明に係る剥離現像装置の斜視図、第2図
は同側面図、第3図は同上要部の拡大断面図、第4図は
基板と粘着テープの関係を示す平面図、第5図は剥離力
tIIIgA系のブロック図、第6図は引取用ピンチロ
ールのモータに対する給電と基板幅の関係を示V説明図
である。 1・・・粘着テープ  2・・・方形基板3・・・画像
形成材料  4・・・透明支持体5・・・搬送用ピンチ
ロール  6・・・剥離バー7・・・引取用ピンチロー
ル 特許出願人  日東電気工業株式会社 代  理  人   弁理士  和  1)  昭第3
図 ↑
FIG. 1 is a perspective view of the peeling and developing device according to the present invention, FIG. 2 is a side view of the same, FIG. 3 is an enlarged sectional view of the same essential parts, and FIG. 4 is a plan view showing the relationship between the substrate and the adhesive tape. FIG. 5 is a block diagram of the peeling force tIIIgA system, and FIG. 6 is an explanatory diagram showing the relationship between power supply to the motor of the pick-up pinch roll and substrate width. DESCRIPTION OF SYMBOLS 1... Adhesive tape 2... Square substrate 3... Image forming material 4... Transparent support 5... Pinch roll for conveyance 6... Peeling bar 7... Pinch roll for collection Patent application Representative of Nitto Electric Industry Co., Ltd. Patent attorney Kazu 1) Showa 3
Figure↑

Claims (4)

【特許請求の範囲】[Claims] (1)画像を形成すべき方形基板の表面に、透明支持体
および光重合性組成物層からなる画像形成材料を積層し
、パターン状の露光を行なった後、一対の基板搬送用ピ
ンチロールにより方形基板を斜めに搬送させながら方形
基板の先端コーナ部分にかかるように粘着テープを貼付
け、次いでこの粘着テープを、粘着テープと上記画像形
成材料を介して基板に線接するよう配置した剥離バーに
沿って、一対の引取用ピンチロールによる均一な剥離速
度で引き剥がすことにより、該粘着テープとともに上記
支持体と未露光の光重合性組成物層を基板より剥離し、
露光された光重合性組成物層を基板上に残存させる剥離
現像装置において、透明支持体が剥離バーに線接する長
さに等しい支持体剥離幅を検出し、一対の引取用ピンチ
ロールに、この支持体剥離幅に応じた引取張力を発生さ
せる剥離力制御系を具備していることを特徴とする剥離
現像装置。
(1) An image forming material consisting of a transparent support and a photopolymerizable composition layer is laminated on the surface of a rectangular substrate on which an image is to be formed, and after patterned exposure, a pair of pinch rolls for conveying the substrate is used. While conveying the rectangular substrate diagonally, an adhesive tape is applied so as to cover the tip corner of the rectangular substrate, and then this adhesive tape is applied along a peeling bar arranged so as to be in line contact with the substrate via the adhesive tape and the image forming material. Then, the support and the unexposed photopolymerizable composition layer are peeled off from the substrate along with the adhesive tape by peeling at a uniform peeling speed with a pair of pinch rolls for taking off,
In a peeling and developing device that leaves the exposed photopolymerizable composition layer on the substrate, a support peeling width equal to the length of the transparent support in line with the peeling bar is detected, and a pair of pinch rolls for take-off are used to detect this peeling width. A peeling developing device comprising a peeling force control system that generates a take-up tension according to the peeling width of the support.
(2)剥離力制御系が、引取用ピンチロールの駆動に直
流モータを使用している特許請求の範囲第1項に記載の
剥離現像装置。
(2) The peeling developing device according to claim 1, wherein the peeling force control system uses a DC motor to drive the take-off pinch roll.
(3)剥離力制御系が、基板幅をセンサーにて検出し、
この検出信号をコンピュータ処理することによって引取
用ピンチロールを制御する特許請求の範囲第1項に記載
の剥離現像装置。
(3) The peeling force control system detects the substrate width with a sensor,
The peeling developing device according to claim 1, wherein the picking-up pinch roll is controlled by computer processing this detection signal.
(4)剥離力制御系が、引取用ピンチロールの動力伝導
系にパウダクラッチを配設し、基板幅検出センサーの検
出信号に比例した電流を上記パウダクラッチに付勢する
ことによって剥離力を制御するようになっている特許請
求の範囲第1項に記載の剥離現像装置。
(4) The peeling force control system controls the peeling force by arranging a powder clutch in the power transmission system of the pick-up pinch roll and energizing the powder clutch with a current proportional to the detection signal of the substrate width detection sensor. A peeling and developing device according to claim 1, which is adapted to perform the following steps.
JP19614984A 1984-07-25 1984-09-19 Peeling developing device Pending JPS6173155A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP19614984A JPS6173155A (en) 1984-09-19 1984-09-19 Peeling developing device
BE0/215395A BE902962A (en) 1984-07-25 1985-07-24 PULL-OUT TYPE DEVELOPMENT METHOD AND APPARATUS
GB08518791A GB2165369A (en) 1984-07-25 1985-07-25 Peeling type developing method and apparatus
DE19853526696 DE3526696A1 (en) 1984-07-25 1985-07-25 DETERMINATION DEVELOPMENT METHOD AND DEVICE FOR IMPLEMENTING THE SAME
US06/758,985 US4631110A (en) 1984-07-25 1985-07-25 Peeling type developing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19614984A JPS6173155A (en) 1984-09-19 1984-09-19 Peeling developing device

Publications (1)

Publication Number Publication Date
JPS6173155A true JPS6173155A (en) 1986-04-15

Family

ID=16353027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19614984A Pending JPS6173155A (en) 1984-07-25 1984-09-19 Peeling developing device

Country Status (1)

Country Link
JP (1) JPS6173155A (en)

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