JPS6172843U - - Google Patents
Info
- Publication number
- JPS6172843U JPS6172843U JP15751084U JP15751084U JPS6172843U JP S6172843 U JPS6172843 U JP S6172843U JP 15751084 U JP15751084 U JP 15751084U JP 15751084 U JP15751084 U JP 15751084U JP S6172843 U JPS6172843 U JP S6172843U
- Authority
- JP
- Japan
- Prior art keywords
- paste
- semiconductor pellet
- mounting portion
- lead frame
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15751084U JPS6172843U (enrdf_load_stackoverflow) | 1984-10-18 | 1984-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15751084U JPS6172843U (enrdf_load_stackoverflow) | 1984-10-18 | 1984-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6172843U true JPS6172843U (enrdf_load_stackoverflow) | 1986-05-17 |
Family
ID=30715502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15751084U Pending JPS6172843U (enrdf_load_stackoverflow) | 1984-10-18 | 1984-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172843U (enrdf_load_stackoverflow) |
-
1984
- 1984-10-18 JP JP15751084U patent/JPS6172843U/ja active Pending