JPS6171954A - Grinding method with cup-shaped grinding wheel - Google Patents
Grinding method with cup-shaped grinding wheelInfo
- Publication number
- JPS6171954A JPS6171954A JP19157584A JP19157584A JPS6171954A JP S6171954 A JPS6171954 A JP S6171954A JP 19157584 A JP19157584 A JP 19157584A JP 19157584 A JP19157584 A JP 19157584A JP S6171954 A JPS6171954 A JP S6171954A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- wafer
- wheel
- cup
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、カップ型砥石を用いた研削方法に係り、特に
、シリコンウェハ等、脆性材料から成る被研削物の研削
に適した研削方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a grinding method using a cup-shaped grindstone, and particularly to a grinding method suitable for grinding objects to be ground made of brittle materials such as silicon wafers.
たとえば、シリコンウェハ(以下単にウェハという)の
表面を平面研削する場合、第4図ないし第6図に示すよ
うに研削している。For example, when surface-grinding the surface of a silicon wafer (hereinafter simply referred to as wafer), the surface is ground as shown in FIGS. 4 to 6.
すなわち、チャック1に保持されたウェハ2に対し、主
軸3に支持されたカップ型砥石(以下単に砥石という)
4を矢印A方向に送り、砥石4の外周刃5で研削を行っ
ている。In other words, a cup-shaped grindstone (hereinafter simply referred to as a grindstone) supported by the spindle 3 is attached to the wafer 2 held by the chuck 1.
4 is sent in the direction of arrow A, and grinding is performed with the outer peripheral edge 5 of the grindstone 4.
このとき、第6図に示すように、ウェハ2に対する砥石
4の切込位置におけるウェハ2の外周縁の接線aと、砥
石4の外周刃5の接線すの成す角度θが鋭角になると、
ウェハ2の外周縁に欠けや割れを生じ易くなる。また、
この傾向は、第5図に示すようにウェハ2の外周縁に面
取りCが施されている場合、あるいは研削代dが大きい
場合により顕著に現わわ、る。このため、1回当りの研
削量を少くして、研削代dを数回に分けて研削すると、
作業性が低下することになる。At this time, as shown in FIG. 6, if the angle θ formed by the tangent a to the outer peripheral edge of the wafer 2 at the cutting position of the grinding wheel 4 to the wafer 2 and the tangent to the outer peripheral edge 5 of the grinding wheel 4 becomes an acute angle,
Chips and cracks are likely to occur at the outer peripheral edge of the wafer 2. Also,
This tendency becomes more noticeable when the outer peripheral edge of the wafer 2 is chamfered C as shown in FIG. 5, or when the grinding allowance d is large. For this reason, if you reduce the amount of grinding per time and divide the grinding allowance d into several times,
This will reduce work efficiency.
また、研削点に研削液を供給するとき、砥石4の外側よ
り研削液を供給した場合、砥石4の回転による遠心力で
研削液が振り飛され、砥石4の内側から研削液を供給し
た場合、砥石4が遮弊物となり、研削点に十分な研削液
を供給することができない。このため1作業性を低下さ
せて研削しなければならない欠点があった。Also, when supplying the grinding fluid to the grinding point, if the grinding fluid is supplied from the outside of the grinding wheel 4, or if the grinding fluid is shaken off by the centrifugal force due to the rotation of the grinding wheel 4, and then the grinding fluid is supplied from the inside of the grinding wheel 4. , the grindstone 4 becomes an obstruction and it is not possible to supply sufficient grinding fluid to the grinding point. For this reason, there was a drawback that the grinding had to be performed with reduced workability.
本発明の目的は、上記した従来技術の欠点をなくし、作
業性を低下させることなく研削し得るようにしたカップ
形砥石による研削方法を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a grinding method using a cup-shaped grindstone that eliminates the drawbacks of the prior art described above and enables grinding without reducing workability.
前記目的を達成するため、本発明においては、研削を砥
石の内周刃によって行うことを特徴とする。In order to achieve the above object, the present invention is characterized in that grinding is performed by an inner peripheral edge of a grindstone.
以下、本発明の一実施例を図面にしたがって説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第1図ないし第3図は、本発明の一実施例を示すもので
、同図において、チャック1上には、ウェハ2が固定さ
れている。主軸3の下端には、砥石4が支持されている
。1 to 3 show an embodiment of the present invention, in which a wafer 2 is fixed on a chuck 1. FIG. A grindstone 4 is supported at the lower end of the main shaft 3.
このような構成で、砥石4でウェハ2を覆うように砥石
4とウェハ2を位置決めし、砥石4を回転させると共に
、砥石4を矢印B方向へ移動させる。With this configuration, the grindstone 4 and the wafer 2 are positioned so that the grindstone 4 covers the wafer 2, and the grindstone 4 is rotated and moved in the direction of arrow B.
このとき、第3図に示すように、ウェハ2に対する砥石
4の切込位置におけるウェハ2の外周縁の接線aと、砥
石4の内周刃6の接線eの成す角度θは鈍角になる。し
たがって、ウェハ2の外周縁に欠けや割れが生じ難くな
り、研削代dを大きくすることができる。At this time, as shown in FIG. 3, the angle θ formed by the tangent a to the outer peripheral edge of the wafer 2 at the cutting position of the grindstone 4 to the wafer 2 and the tangent e to the inner peripheral edge 6 of the grindstone 4 becomes an obtuse angle. Therefore, chips and cracks are less likely to occur on the outer peripheral edge of the wafer 2, and the grinding allowance d can be increased.
また、主軸3から研削液を供給することにより研削点に
十分研削液を供給することができるので、作業性を低下
させることなく研削を行うことができる。Further, by supplying the grinding fluid from the main spindle 3, it is possible to sufficiently supply the grinding fluid to the grinding point, so that grinding can be performed without reducing workability.
以上述べた如く、本発明によれば、ウェハ等の脆性材料
で形成された被研削物を、能率良く研削することができ
、作業性を大巾に向上させることができる効果がある。As described above, according to the present invention, an object to be ground made of a brittle material such as a wafer can be efficiently ground, and workability can be greatly improved.
第1図は、本発明の一実施例である内周刃研削方法を示
す側面断面図、第2図は、第1図における研削状態を示
す要部の拡大図、第3図は、第2図の平面図、第4図は
、従来の外周刃研削方法を示す側面断面図、第5図は。
第4図における研削状態を示す要部の拡大図、第6図は
、第5図の平面図である。FIG. 1 is a side sectional view showing an inner peripheral blade grinding method according to an embodiment of the present invention, FIG. 2 is an enlarged view of main parts showing the grinding state in FIG. 1, and FIG. FIG. 4 is a plan view, FIG. 4 is a side cross-sectional view showing a conventional peripheral blade grinding method, and FIG. 5 is a plan view. FIG. 4 is an enlarged view of the main part showing the grinding state, and FIG. 6 is a plan view of FIG. 5.
Claims (1)
中央部に位置するように配置し、カップ型砥石を回転さ
せると共に、カップ型砥石と被研削物とを相対的に移動
させ、カップ型砥石の内周刃で被研削物を研削すること
を特徴とするカップ型砥石による研削方法。[Claims] A workpiece to be ground and a cup-shaped grindstone having an inner diameter larger than an outer diameter of the workpiece are arranged so that the workpiece to be ground is located in the center of the cup-type grindstone, and the cup-type grindstone is A grinding method using a cup-shaped grindstone, which is characterized in that the cup-shaped grindstone is rotated, the cup-shaped grindstone and the object to be ground are moved relative to each other, and the object to be ground is ground with the inner peripheral edge of the cup-shaped grindstone.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19157584A JPS6171954A (en) | 1984-09-14 | 1984-09-14 | Grinding method with cup-shaped grinding wheel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19157584A JPS6171954A (en) | 1984-09-14 | 1984-09-14 | Grinding method with cup-shaped grinding wheel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6171954A true JPS6171954A (en) | 1986-04-12 |
JPH0327341B2 JPH0327341B2 (en) | 1991-04-15 |
Family
ID=16276941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19157584A Granted JPS6171954A (en) | 1984-09-14 | 1984-09-14 | Grinding method with cup-shaped grinding wheel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6171954A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1082936C (en) * | 1994-10-18 | 2002-04-17 | 加利福尼亚大学董事会 | The combinatorial Synthesis of novel materials |
-
1984
- 1984-09-14 JP JP19157584A patent/JPS6171954A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1082936C (en) * | 1994-10-18 | 2002-04-17 | 加利福尼亚大学董事会 | The combinatorial Synthesis of novel materials |
Also Published As
Publication number | Publication date |
---|---|
JPH0327341B2 (en) | 1991-04-15 |
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