JPS6170995U - - Google Patents

Info

Publication number
JPS6170995U
JPS6170995U JP15578384U JP15578384U JPS6170995U JP S6170995 U JPS6170995 U JP S6170995U JP 15578384 U JP15578384 U JP 15578384U JP 15578384 U JP15578384 U JP 15578384U JP S6170995 U JPS6170995 U JP S6170995U
Authority
JP
Japan
Prior art keywords
heat
conductive member
electronic device
component
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15578384U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15578384U priority Critical patent/JPS6170995U/ja
Publication of JPS6170995U publication Critical patent/JPS6170995U/ja
Pending legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の電子機器の放熱構造の要部斜視
図、第２図は第１図の断面図、第３図はこの考案
の第１実施例の断面図、第４図は第２実施例の断
面図、第５図は第３実施例の断面図である。 図中、１はパワートランジスタ、２は放熱部材
、４は外装ケース、５は放熱穴、６は熱伝導性部
材、７，１１は熱伝導性接着剤である。 Figure 1 is a perspective view of the main parts of a conventional heat dissipation structure for electronic equipment, Figure 2 is a sectional view of Figure 1, Figure 3 is a sectional view of the first embodiment of this invention, and Figure 4 is a second embodiment of the invention. FIG. 5 is a cross-sectional view of the third embodiment. In the figure, 1 is a power transistor, 2 is a heat dissipation member, 4 is an exterior case, 5 is a heat dissipation hole, 6 is a heat conductive member, and 7 and 11 are heat conductive adhesives.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外装ケースの中に発熱源となる部品を内蔵した
電子機器において、前記部品と放熱穴を有する外
装ケースとの間に、熱伝導性部材を熱伝導可能に
介装すると共に該熱伝導性部材により前記放熱穴
を塞ぐよう構成したことを特徴とする電子機器の
放熱構造。 In an electronic device in which a component that is a heat source is built into an exterior case, a thermally conductive member is interposed between the component and the exterior case having a heat radiation hole so that the heat can be conducted, and the thermally conductive member A heat dissipation structure for an electronic device, characterized in that the heat dissipation hole is configured to be closed.
JP15578384U 1984-10-17 1984-10-17 Pending JPS6170995U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15578384U JPS6170995U (en) 1984-10-17 1984-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15578384U JPS6170995U (en) 1984-10-17 1984-10-17

Publications (1)

Publication Number Publication Date
JPS6170995U true JPS6170995U (en) 1986-05-15

Family

ID=30713795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15578384U Pending JPS6170995U (en) 1984-10-17 1984-10-17

Country Status (1)

Country Link
JP (1) JPS6170995U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305392A (en) * 2001-04-06 2002-10-18 Sony Corp Radiating device and electronic apparatus with radiating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305392A (en) * 2001-04-06 2002-10-18 Sony Corp Radiating device and electronic apparatus with radiating device
JP4506023B2 (en) * 2001-04-06 2010-07-21 ソニー株式会社 Heat dissipation device and electronic device having heat dissipation device

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