JPS6170994U - - Google Patents
Info
- Publication number
- JPS6170994U JPS6170994U JP15572084U JP15572084U JPS6170994U JP S6170994 U JPS6170994 U JP S6170994U JP 15572084 U JP15572084 U JP 15572084U JP 15572084 U JP15572084 U JP 15572084U JP S6170994 U JPS6170994 U JP S6170994U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- heat sink
- wiring board
- fixing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15572084U JPS6170994U (es) | 1984-10-17 | 1984-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15572084U JPS6170994U (es) | 1984-10-17 | 1984-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6170994U true JPS6170994U (es) | 1986-05-15 |
Family
ID=30713733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15572084U Pending JPS6170994U (es) | 1984-10-17 | 1984-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6170994U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0550103U (ja) * | 1991-12-06 | 1993-07-02 | 山商エンジニアリング株式会社 | 蓄圧式圧力容器 |
-
1984
- 1984-10-17 JP JP15572084U patent/JPS6170994U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0550103U (ja) * | 1991-12-06 | 1993-07-02 | 山商エンジニアリング株式会社 | 蓄圧式圧力容器 |