JPS617020B2 - - Google Patents
Info
- Publication number
- JPS617020B2 JPS617020B2 JP10962078A JP10962078A JPS617020B2 JP S617020 B2 JPS617020 B2 JP S617020B2 JP 10962078 A JP10962078 A JP 10962078A JP 10962078 A JP10962078 A JP 10962078A JP S617020 B2 JPS617020 B2 JP S617020B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10962078A JPS5538002A (en) | 1978-09-08 | 1978-09-08 | Dicing line monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10962078A JPS5538002A (en) | 1978-09-08 | 1978-09-08 | Dicing line monitoring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5538002A JPS5538002A (en) | 1980-03-17 |
| JPS617020B2 true JPS617020B2 (pl) | 1986-03-03 |
Family
ID=14514899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10962078A Granted JPS5538002A (en) | 1978-09-08 | 1978-09-08 | Dicing line monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5538002A (pl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371607U (pl) * | 1989-11-15 | 1991-07-19 | ||
| CN103522434A (zh) * | 2013-10-30 | 2014-01-22 | 华进半导体封装先导技术研发中心有限公司 | 基于红外技术的晶圆切割在线检测系统 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2627913B2 (ja) * | 1988-02-17 | 1997-07-09 | 株式会社デイスコ | 加工装置 |
| JP5505790B2 (ja) * | 2010-04-13 | 2014-05-28 | 株式会社東京精密 | ダイシング装置による検査方法 |
-
1978
- 1978-09-08 JP JP10962078A patent/JPS5538002A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371607U (pl) * | 1989-11-15 | 1991-07-19 | ||
| CN103522434A (zh) * | 2013-10-30 | 2014-01-22 | 华进半导体封装先导技术研发中心有限公司 | 基于红外技术的晶圆切割在线检测系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5538002A (en) | 1980-03-17 |