JPS6163838U - - Google Patents
Info
- Publication number
- JPS6163838U JPS6163838U JP1984148082U JP14808284U JPS6163838U JP S6163838 U JPS6163838 U JP S6163838U JP 1984148082 U JP1984148082 U JP 1984148082U JP 14808284 U JP14808284 U JP 14808284U JP S6163838 U JPS6163838 U JP S6163838U
- Authority
- JP
- Japan
- Prior art keywords
- mesh member
- adhesive
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984148082U JPS6163838U (enFirst) | 1984-09-29 | 1984-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984148082U JPS6163838U (enFirst) | 1984-09-29 | 1984-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6163838U true JPS6163838U (enFirst) | 1986-04-30 |
Family
ID=30706302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984148082U Pending JPS6163838U (enFirst) | 1984-09-29 | 1984-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163838U (enFirst) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5674932A (en) * | 1979-11-22 | 1981-06-20 | Hitachi Ltd | Semiconductor device and preparation method thereof |
-
1984
- 1984-09-29 JP JP1984148082U patent/JPS6163838U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5674932A (en) * | 1979-11-22 | 1981-06-20 | Hitachi Ltd | Semiconductor device and preparation method thereof |