JPS6159379U - - Google Patents
Info
- Publication number
- JPS6159379U JPS6159379U JP14547784U JP14547784U JPS6159379U JP S6159379 U JPS6159379 U JP S6159379U JP 14547784 U JP14547784 U JP 14547784U JP 14547784 U JP14547784 U JP 14547784U JP S6159379 U JPS6159379 U JP S6159379U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- printed wiring
- lands
- applied area
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14547784U JPS6159379U (enrdf_load_stackoverflow) | 1984-09-25 | 1984-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14547784U JPS6159379U (enrdf_load_stackoverflow) | 1984-09-25 | 1984-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6159379U true JPS6159379U (enrdf_load_stackoverflow) | 1986-04-21 |
Family
ID=30703730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14547784U Pending JPS6159379U (enrdf_load_stackoverflow) | 1984-09-25 | 1984-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6159379U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018155584A1 (ja) * | 2017-02-24 | 2018-08-30 | 日本電産エレシス株式会社 | 回路基板、モータ、制御装置および電動ポンプ |
-
1984
- 1984-09-25 JP JP14547784U patent/JPS6159379U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018155584A1 (ja) * | 2017-02-24 | 2018-08-30 | 日本電産エレシス株式会社 | 回路基板、モータ、制御装置および電動ポンプ |
| CN110326368A (zh) * | 2017-02-24 | 2019-10-11 | 日本电产株式会社 | 电路板、马达、控制装置以及电动泵 |
| US11289982B2 (en) | 2017-02-24 | 2022-03-29 | Nidec Corporation | Circuit board, motor, controller, and electric pump |
| CN110326368B (zh) * | 2017-02-24 | 2023-02-21 | 日本电产株式会社 | 电路板、马达、控制装置以及电动泵 |