JPS6159370U - - Google Patents
Info
- Publication number
- JPS6159370U JPS6159370U JP14460484U JP14460484U JPS6159370U JP S6159370 U JPS6159370 U JP S6159370U JP 14460484 U JP14460484 U JP 14460484U JP 14460484 U JP14460484 U JP 14460484U JP S6159370 U JPS6159370 U JP S6159370U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive
- outline
- pen
- watu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図a,bは、従来の設計用ワツペンの斜視
図および側面図、第2図a,bは、本考案の第1
の実施例による設計用ワツペンの斜視図および側
面図、第3図は、本考案の設計用ワツペンを用い
た作業フローを示す図である。
1…接着層、2…透明シート、12…半透明シ
ート、12a…粗化面、3…部品外形形状、4…
円形形状、5…接着材、6,16,26…設計用
ワツペン、7…基板外形。
Figures 1a and b are a perspective view and a side view of a conventional design watz pen, and Figures 2a and b are the first design pen of the present invention.
FIG. 3 is a perspective view and a side view of the design emblem according to the embodiment, and FIG. 3 is a diagram showing a work flow using the design emblem of the present invention. DESCRIPTION OF SYMBOLS 1...Adhesive layer, 2...Transparent sheet, 12...Semi-transparent sheet, 12a...Roughened surface, 3...Part external shape, 4...
Circular shape, 5... Adhesive material, 6, 16, 26... Design emblem, 7... Board outline.
Claims (1)
リード脚部の取付孔位置を示す外形枠を有し、か
つ裏面に20〜70g/cm2の接着力を有する接
着材を付着させた半透明シートからなる印刷配線
板設計用ワツペン。 From a translucent sheet that has an outline frame on the front surface that indicates the planar outline of the electronic component and the mounting hole position of the electronic component lead leg, and has an adhesive with an adhesive strength of 20 to 70 g/cm 2 attached to the back surface. Watu pen for designing printed wiring boards.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14460484U JPS6159370U (en) | 1984-09-25 | 1984-09-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14460484U JPS6159370U (en) | 1984-09-25 | 1984-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6159370U true JPS6159370U (en) | 1986-04-21 |
Family
ID=30702877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14460484U Pending JPS6159370U (en) | 1984-09-25 | 1984-09-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6159370U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124323U (en) * | 1974-07-29 | 1976-02-23 | ||
JPS5635632B2 (en) * | 1973-04-19 | 1981-08-18 |
-
1984
- 1984-09-25 JP JP14460484U patent/JPS6159370U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5635632B2 (en) * | 1973-04-19 | 1981-08-18 | ||
JPS5124323U (en) * | 1974-07-29 | 1976-02-23 |
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