JPS6158557B2 - - Google Patents
Info
- Publication number
- JPS6158557B2 JPS6158557B2 JP5091678A JP5091678A JPS6158557B2 JP S6158557 B2 JPS6158557 B2 JP S6158557B2 JP 5091678 A JP5091678 A JP 5091678A JP 5091678 A JP5091678 A JP 5091678A JP S6158557 B2 JPS6158557 B2 JP S6158557B2
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- plating bath
- acid
- solution
- platinum plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 70
- IXSUHTFXKKBBJP-UHFFFAOYSA-L azanide;platinum(2+);dinitrite Chemical compound [NH2-].[NH2-].[Pt+2].[O-]N=O.[O-]N=O IXSUHTFXKKBBJP-UHFFFAOYSA-L 0.000 claims description 12
- 229910052783 alkali metal Inorganic materials 0.000 claims description 8
- 150000007522 mineralic acids Chemical class 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 6
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 239000012266 salt solution Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 description 35
- 238000007747 plating Methods 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- -1 alkali metal salt Chemical class 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000003057 platinum Chemical class 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 2
- 235000019798 tripotassium phosphate Nutrition 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 229960004109 potassium acetate Drugs 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 1
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 description 1
- 229940039790 sodium oxalate Drugs 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000001433 sodium tartrate Substances 0.000 description 1
- 229960002167 sodium tartrate Drugs 0.000 description 1
- 235000011004 sodium tartrates Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】
本発明は白金めつき浴の改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in platinum plating baths.
白金は、優れた耐蝕性や化学的性質を有するの
で、従来より装飾品はもとより接点材料、電解用
電極、触媒等に広く利用されている。 Since platinum has excellent corrosion resistance and chemical properties, it has been widely used not only in decorative items but also in contact materials, electrodes for electrolysis, catalysts, and the like.
この白金の優れた性質を経済的に利用している
のが白金めつきであり、特に最近では電解技術の
分野で、チタン又はタンタル材等の表面に白金め
つきを施したものが不溶性陽極として注目されて
いる。 Platinum plating is an economical way to take advantage of the excellent properties of platinum. Especially recently, in the field of electrolytic technology, platinum plating on the surface of titanium or tantalum materials is being used as an insoluble anode. Attention has been paid.
然し乍ら、白金は金属としての安定性が極めて
高い為還元され易く、また極めて錯体を作り易い
為に液中で不溶性の沈澱が生じ易く、従つて白金
めつき浴は安定性に乏しいものであつた。 However, because platinum is extremely stable as a metal, it is easily reduced, and because it is extremely easy to form complexes, insoluble precipitates are likely to form in the solution, so platinum plating baths have poor stability. .
このようなことから近時安定性を高めた白金め
つき浴として、ジニトロ・ジアンミン白金系の浴
にアンモニウム塩を添加してなる白金めつき浴が
提供されているが、アンモニウム塩の添加は、浴
の安定化の反面、白金の還元を阻害する為に、め
つき時の陰極析出効率が低いという欠点が有る。 For this reason, recently, a platinum plating bath with improved stability has been provided, which is made by adding an ammonium salt to a dinitro diammine platinum bath. Although it stabilizes the bath, it has the disadvantage that the cathodic deposition efficiency during plating is low because it inhibits the reduction of platinum.
そこで本発明者等は、上記欠点を解消すべく鋭
意攻究の結果、有機酸又は無機酸のアルカリ金属
塩がジニトロ・ジアンミン白金を良く溶解し、そ
の溶解液が白金めつき浴として極めて安定してい
て、陰極析出効率も在来のものに比し極めて高い
ことを見い出した。 Therefore, the inventors of the present invention made intensive efforts to solve the above drawbacks and found that an alkali metal salt of an organic or inorganic acid dissolves dinitro-diammine platinum well, and that the solution is extremely stable as a platinum plating bath. It was found that the cathodic deposition efficiency was also extremely high compared to conventional methods.
本発明の白金めつき浴は、ジニトロ・ジアンミ
ン白金〔Pt（NH3）2（NO2）2〕を有機酸又は無機酸
のアルカリ金属塩溶液で溶解して成るものであ
る。 The platinum plating bath of the present invention is formed by dissolving dinitrodiammine platinum [Pt(NH 3 ) 2 (NO 2 ) 2 ] in an alkali metal salt solution of an organic acid or an inorganic acid.
本発明の白金めつき浴は、有機酸又は無機酸の
アルカリ金属塩がジニトロ・ジアンミン白金を溶
解した際酸やアルカリで溶解した場合と同程度に
溶解するが、化学的に穏やかな溶解を行なう為に
白金が還元されることがなく、安定化するもので
ある。またジニトロ・ジアンミン白金中に含まれ
るアンモニアの他に、溶解させる塩にアンモニア
が含まれていないので、白金の析出が阻害され
ず、陰極析出効率が高いものである。さらに本発
明の白金めつき浴は、溶解に用いたアルカリ金属
塩が浴中において緩衝剤として働き、めつき時に
おけるPHの変化が殆んど見られないものである。 In the platinum plating bath of the present invention, when an alkali metal salt of an organic acid or an inorganic acid dissolves dinitro diammine platinum, it dissolves to the same extent as when it is dissolved with an acid or an alkali, but chemically it performs a gentle dissolution. Therefore, platinum is not reduced and is stabilized. Further, since the salt to be dissolved does not contain ammonia other than the ammonia contained in the dinitro diammine platinum, the precipitation of platinum is not inhibited and the cathodic deposition efficiency is high. Furthermore, in the platinum plating bath of the present invention, the alkali metal salt used for dissolution acts as a buffer in the bath, so that almost no change in pH is observed during plating.
次に本発明の白金めつき浴を建浴する方法につ
いて説明する。 Next, a method for preparing the platinum plating bath of the present invention will be explained.
酢酸、クエン酸、酒石酸、蓚酸などの有機酸
と、カリウム、ナトリウムなどのアルカリ金属と
の塩、例えば酢酸カリウム、酒石酸カリウム・ナ
トリウム（ロツセル塩）、蓚酸ナトリウムなど、
また硝酸、燐酸、硫酸などの無機酸と、カリウ
ム、ナトリウムなどのアルカリ金属との塩、例え
ば硝酸カリウム、硫酸ナトリウムなど、これらの
塩を脱イオン水又は蒸留水に溶解させる。この時
の溶液の塩濃度は、白金の濃度により異なるが、
白金10ｇ/の溶液を作る場合、通常0.2mol/〜
３mol/程度が適当である。この塩溶液を80〜
90℃前後に加熱してジニトロ・ジアンミン白金を
溶液１に対して４ｇ〜100ｇ程度撹拌しながら
混入する。ジニトロ・ジアンミン白金が完全に溶
解して透明な溶液になつたならば、これを2.5倍
程度に希釈して白金めつき浴とする。この時の白
金めつき浴の白金濃度は通常１ｇ/〜25ｇ/程
度である。 Salts of organic acids such as acetic acid, citric acid, tartaric acid, and oxalic acid with alkali metals such as potassium and sodium, such as potassium acetate, potassium and sodium tartrate (Rotssel salt), and sodium oxalate.
Further, salts of inorganic acids such as nitric acid, phosphoric acid, and sulfuric acid and alkali metals such as potassium and sodium, such as potassium nitrate and sodium sulfate, are dissolved in deionized or distilled water. The salt concentration of the solution at this time varies depending on the platinum concentration, but
When making a solution of 10g/platinum, usually 0.2mol/~
Approximately 3 mol/mole is appropriate. Add this salt solution to 80~
The solution is heated to around 90°C and about 4 to 100 g of dinitro diammine platinum is mixed into the solution 1 while stirring. Once the dinitro diammine platinum is completely dissolved and becomes a clear solution, dilute this to about 2.5 times and use it as a platinum plating bath. The platinum concentration in the platinum plating bath at this time is usually about 1 g/-25 g/.
この白金めつき浴のめつき条件は、めつき浴温
度約60〜100℃（最適80℃）、電流密度0.5A/dm2
〜1.5A/dm2（最適1.0A/dm2）で、撹拌できれば
好ましい。かかる条件で、ダングステン、モリブ
デン、チタン、ニオブ、タンタルやニツケル、銅
などの金属基板上にめつきすると陰極電流効率28
mg/A・min〜37mg/A・minで白金の析出が得られ
る。 The plating conditions for this platinum plating bath are: plating bath temperature of approximately 60 to 100℃ (optimum 80℃), current density of 0.5A/dm 2
It is preferable if stirring can be performed at ~1.5 A/dm 2 (optimally 1.0 A/dm 2 ). Under these conditions, when plating on a metal substrate such as dungsten, molybdenum, titanium, niobium, tantalum, nickel, or copper, the cathode current efficiency is 28.
Platinum precipitation can be obtained at mg/A・min to 37 mg/A・min.
以下本発明による白金メツキ浴の効果を明瞭な
らしめる為にその具体的な実施例と従来例につい
て説明する。 In order to clarify the effects of the platinum plating bath according to the present invention, specific examples and conventional examples thereof will be described below.
実施例 １
燐酸３カリウム100ｇを水400mlに溶解し、約80
〜90℃に加熱して、ジニトロ・ジアンミン白金
〔Pt（NH3）2（NO2）2〕を17ｇ撹拌しながら混入す
る。液が透明になるまで溶解したならば水で全量
を１に希釈して白金めつき浴とした。この時の
PHは約13であつた。Example 1 Dissolve 100 g of tripotassium phosphate in 400 ml of water, and dissolve approximately 80 g of tripotassium phosphate in 400 ml of water.
Heat to ˜90° C. and stir in 17 g of dinitrodiammine platinum [Pt(NH 3 ) 2 (NO 2 ) 2 ]. When the solution was dissolved until it became transparent, the total amount was diluted to 1 with water to prepare a platinum plating bath. at this time
The pH was approximately 13.
この白金めつき浴を温度80℃、電流密度1.0A/
ｄm2、普通の撹拌状態でチタン及びニツケルにめ
つきしたところ、陰極析出効率37mg/A・minで白
金の析出が得られた。 This platinum plating bath was heated at a temperature of 80℃ and a current density of 1.0A/
When titanium and nickel were plated at dm 2 under normal stirring conditions, platinum was deposited with a cathodic deposition efficiency of 37 mg/A·min.
実施例 ２
蓚酸カリウム100ｇを水400mlに溶解し、約80〜
90℃に加熱して、ジニトロ・ジアンミン白金を17
ｇ撹拌しながら混入する。液が透明になるまで溶
解したならば水で全量を１に希釈して白金めつ
き浴とした、この時のPHは約10であつた。Example 2 Dissolve 100g of potassium oxalate in 400ml of water and dissolve approximately 80~
Heating to 90℃ dinitro diammine platinum 17
g Mix while stirring. Once the solution was dissolved until it became transparent, the total amount was diluted to 1 with water to prepare a platinum plating bath, and the pH at this time was about 10.
この白金めつき浴を温度80℃前後、電流密度
1.0A/dm2、中程度の撹拌でチタン及び金ストラ
イクをかけたニツケルにめつきしたところ、陰極
析出効率34mg/A・minで白金の析出が得られた。 This platinum plating bath is heated at a temperature of around 80℃ and a current density of
When plated on nickel with titanium and gold strikes applied at 1.0 A/dm 2 and moderate stirring, platinum was deposited with a cathodic deposition efficiency of 34 mg/A·min.
従来例
ジニトロ・ジアンミン白金20ｇ（白金12ｇ）
に、硫酸0.5mol（約30c.c.）と硫酸アンモニウム
1.2mol（約160ｇ）とからなるアンモニウム塩を
添加し、水で全量を１に希釈してなる白金めつ
き浴を、温度90℃、電流密度2.0A/dm2、中程度
の撹拌で金ストライクを施したニツケルにめつき
したところ、陰極析出効率12mg/A・minで白金の
析出が得られた。Conventional example Dinitro diammine platinum 20g (platinum 12g)
, 0.5 mol of sulfuric acid (approximately 30 c.c.) and ammonium sulfate
A platinum plating bath prepared by adding ammonium salt consisting of 1.2 mol (approximately 160 g) and diluting the total amount to 1 with water was plated with gold at a temperature of 90°C and a current density of 2.0 A/dm 2 with moderate stirring. When plated nickel coated with nickel, platinum was deposited at a cathodic deposition efficiency of 12 mg/A min.
以上の説明で判るように本発明の白金めつき浴
は、有機酸又は無機酸のアルカリ金属塩でジニト
ロ・ジアンミン白金を溶解して成るものであるか
ら、化学的に穏やに溶解されて白金が還元されて
いないので極めて安定しており、まためつきした
際白金の析出が阻害されず、陰極析出効率が極め
て高いという優れた作用効果が有る。 As can be seen from the above explanation, the platinum plating bath of the present invention is made by dissolving dinitro diammine platinum in an alkali metal salt of an organic acid or an inorganic acid. Since it is not reduced, it is extremely stable, and when it flashes again, the precipitation of platinum is not inhibited, and it has excellent effects such as extremely high cathodic deposition efficiency.
Claims (1)
（NO2）2〕を有機酸又は無機酸のアルカリ金属塩溶
液で溶解して成る白金めつき浴。[Claims] 1 Dinitro diammine platinum [Pt(NH 3 ) 2
(NO 2 ) 2 ] is dissolved in an alkali metal salt solution of an organic or inorganic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5091678A JPS54142136A (en) | 1978-04-28 | 1978-04-28 | Platinum plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5091678A JPS54142136A (en) | 1978-04-28 | 1978-04-28 | Platinum plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54142136A JPS54142136A (en) | 1979-11-06 |
| JPS6158557B2 true JPS6158557B2 (en) | 1986-12-12 |
Family
ID=12872105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5091678A Granted JPS54142136A (en) | 1978-04-28 | 1978-04-28 | Platinum plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54142136A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201200482D0 (en) * | 2012-01-12 | 2012-02-22 | Johnson Matthey Plc | Improvements in coating technology |
-
1978
- 1978-04-28 JP JP5091678A patent/JPS54142136A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54142136A (en) | 1979-11-06 |
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