JPS6158278B2 - - Google Patents
Info
- Publication number
- JPS6158278B2 JPS6158278B2 JP57230269A JP23026982A JPS6158278B2 JP S6158278 B2 JPS6158278 B2 JP S6158278B2 JP 57230269 A JP57230269 A JP 57230269A JP 23026982 A JP23026982 A JP 23026982A JP S6158278 B2 JPS6158278 B2 JP S6158278B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- wrapped
- supply plate
- claw
- wound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Nonmetal Cutting Devices (AREA)
- Adhesive Tape Dispensing Devices (AREA)
- Advancing Webs (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23026982A JPS59124599A (ja) | 1982-12-28 | 1982-12-28 | テ−プの送り込み切断巻付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23026982A JPS59124599A (ja) | 1982-12-28 | 1982-12-28 | テ−プの送り込み切断巻付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59124599A JPS59124599A (ja) | 1984-07-18 |
JPS6158278B2 true JPS6158278B2 (enrdf_load_stackoverflow) | 1986-12-10 |
Family
ID=16905148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23026982A Granted JPS59124599A (ja) | 1982-12-28 | 1982-12-28 | テ−プの送り込み切断巻付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59124599A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6327576U (enrdf_load_stackoverflow) * | 1986-08-05 | 1988-02-23 | ||
US6881615B2 (en) | 1988-09-28 | 2005-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6244866U (enrdf_load_stackoverflow) * | 1985-09-07 | 1987-03-18 | ||
JP2894933B2 (ja) * | 1993-12-08 | 1999-05-24 | 日特エンジニアリング株式会社 | テーピングユニット |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56793B2 (enrdf_load_stackoverflow) * | 1974-10-24 | 1981-01-09 |
-
1982
- 1982-12-28 JP JP23026982A patent/JPS59124599A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6327576U (enrdf_load_stackoverflow) * | 1986-08-05 | 1988-02-23 | ||
US6881615B2 (en) | 1988-09-28 | 2005-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air |
US7435635B2 (en) | 1988-09-28 | 2008-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material |
Also Published As
Publication number | Publication date |
---|---|
JPS59124599A (ja) | 1984-07-18 |
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