JPS615817Y2 - - Google Patents
Info
- Publication number
- JPS615817Y2 JPS615817Y2 JP5022679U JP5022679U JPS615817Y2 JP S615817 Y2 JPS615817 Y2 JP S615817Y2 JP 5022679 U JP5022679 U JP 5022679U JP 5022679 U JP5022679 U JP 5022679U JP S615817 Y2 JPS615817 Y2 JP S615817Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5022679U JPS615817Y2 (en) | 1979-04-16 | 1979-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5022679U JPS615817Y2 (en) | 1979-04-16 | 1979-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55149958U JPS55149958U (en) | 1980-10-29 |
| JPS615817Y2 true JPS615817Y2 (en) | 1986-02-21 |
Family
ID=28937297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5022679U Expired JPS615817Y2 (en) | 1979-04-16 | 1979-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS615817Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5714916B2 (en) * | 2011-01-12 | 2015-05-07 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
-
1979
- 1979-04-16 JP JP5022679U patent/JPS615817Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55149958U (en) | 1980-10-29 |