JPS55149958U - - Google Patents

Info

Publication number
JPS55149958U
JPS55149958U JP5022679U JP5022679U JPS55149958U JP S55149958 U JPS55149958 U JP S55149958U JP 5022679 U JP5022679 U JP 5022679U JP 5022679 U JP5022679 U JP 5022679U JP S55149958 U JPS55149958 U JP S55149958U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5022679U
Other languages
Japanese (ja)
Other versions
JPS615817Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5022679U priority Critical patent/JPS615817Y2/ja
Publication of JPS55149958U publication Critical patent/JPS55149958U/ja
Application granted granted Critical
Publication of JPS615817Y2 publication Critical patent/JPS615817Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP5022679U 1979-04-16 1979-04-16 Expired JPS615817Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5022679U JPS615817Y2 (en) 1979-04-16 1979-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5022679U JPS615817Y2 (en) 1979-04-16 1979-04-16

Publications (2)

Publication Number Publication Date
JPS55149958U true JPS55149958U (en) 1980-10-29
JPS615817Y2 JPS615817Y2 (en) 1986-02-21

Family

ID=28937297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5022679U Expired JPS615817Y2 (en) 1979-04-16 1979-04-16

Country Status (1)

Country Link
JP (1) JPS615817Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146803A (en) * 2011-01-12 2012-08-02 Renesas Electronics Corp Semiconductor device and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146803A (en) * 2011-01-12 2012-08-02 Renesas Electronics Corp Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JPS615817Y2 (en) 1986-02-21

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