JPS615804Y2 - - Google Patents

Info

Publication number
JPS615804Y2
JPS615804Y2 JP1980138794U JP13879480U JPS615804Y2 JP S615804 Y2 JPS615804 Y2 JP S615804Y2 JP 1980138794 U JP1980138794 U JP 1980138794U JP 13879480 U JP13879480 U JP 13879480U JP S615804 Y2 JPS615804 Y2 JP S615804Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980138794U
Other languages
Japanese (ja)
Other versions
JPS5761853U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980138794U priority Critical patent/JPS615804Y2/ja
Publication of JPS5761853U publication Critical patent/JPS5761853U/ja
Application granted granted Critical
Publication of JPS615804Y2 publication Critical patent/JPS615804Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Clocks (AREA)
JP1980138794U 1980-09-30 1980-09-30 Expired JPS615804Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980138794U JPS615804Y2 (enrdf_load_stackoverflow) 1980-09-30 1980-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980138794U JPS615804Y2 (enrdf_load_stackoverflow) 1980-09-30 1980-09-30

Publications (2)

Publication Number Publication Date
JPS5761853U JPS5761853U (enrdf_load_stackoverflow) 1982-04-13
JPS615804Y2 true JPS615804Y2 (enrdf_load_stackoverflow) 1986-02-21

Family

ID=29498789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980138794U Expired JPS615804Y2 (enrdf_load_stackoverflow) 1980-09-30 1980-09-30

Country Status (1)

Country Link
JP (1) JPS615804Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945929U (ja) * 1982-09-20 1984-03-27 富士電機株式会社 半導体素子の実装構造
US20090044967A1 (en) * 2006-03-14 2009-02-19 Sharp Kabushiki Kaisha Circuit board, electronic circuit device, and display device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS514904B2 (enrdf_load_stackoverflow) * 1971-11-30 1976-02-16
US3746973A (en) * 1972-05-05 1973-07-17 Ibm Testing of metallization networks on insulative substrates supporting semiconductor chips

Also Published As

Publication number Publication date
JPS5761853U (enrdf_load_stackoverflow) 1982-04-13

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