JPS6157532U - - Google Patents

Info

Publication number

JPS6157532U

JPS6157532U JP14110484U JP14110484U JPS6157532U JP S6157532 U JPS6157532 U JP S6157532U JP 14110484 U JP14110484 U JP 14110484U JP 14110484 U JP14110484 U JP 14110484U JP S6157532 U JPS6157532 U JP S6157532U

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

sandwiched

substrate

semiconductor element

Prior art date

1984-09-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims 2
• 239000000758 substrate Substances 0.000 claims 2
• 238000005452 bending Methods 0.000 claims 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 229910052782 aluminium Inorganic materials 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 239000008188 pellet Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1