JPS6156425A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS6156425A
JPS6156425A JP59259151A JP25915184A JPS6156425A JP S6156425 A JPS6156425 A JP S6156425A JP 59259151 A JP59259151 A JP 59259151A JP 25915184 A JP25915184 A JP 25915184A JP S6156425 A JPS6156425 A JP S6156425A
Authority
JP
Japan
Prior art keywords
tip
aluminum wire
wire
bonding
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59259151A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
吉田　恒
Tomio Kobayashi
十三男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59259151A priority Critical patent/JPS6156425A/en
Publication of JPS6156425A publication Critical patent/JPS6156425A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01007—Nitrogen [N]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable nail-head bonding with aluminum wires by a method wherein a ball is formed at the tip of an aluminum wire by generating discharge between an electrode in the state of covering said tip with an inactive atmosphere. CONSTITUTION:When current is passed from a power source 8 and discharged from the tip of the electrode piece 7 toward the aluminum wire 2 with the flow of nitrogen gas out of an inactive gas supply tube 6 through a hole 3 to the neighborhood of the tip of a capillery 1, the aluminum wire 2 fuses by a generating spark, resulting in the formation of a ball 9 at the tip. Nail-head wire bonding is carried out by keeping the electrode piece 7 away from the capillery 1 and then reciprocating it between the electrode on the bonded side and the lead. At every finish of a time of bonding between the electrode and the lead, the ball 9 is formed at the tip of the aluminum wire 2 by making the electrode piece 7 close to the capillery 1. Since the neighborhood of the part of spark generation is prevented from oxidation by inactivation with nitrogen gas, the nail-head bonding of aluminum wires is enabled.

Description

【発明の詳細な説明】 本発明はボンディング装置に関し、特に電気的スパーク
でアルミニウム線を溶かしボールを成形スルボンディン
グ装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding device, and more particularly to a bonding device that melts aluminum wire using an electric spark and forms a ball.

従来、アルミニウム線をネールへラドボンディングで使
うことができなかった。その理由として、アルミニウム
線は水素トーチで熱してもボールができないこと、加熱
したときに酸化し、素子表面を汚すこと、これを防ぐた
め窒素雰囲気中で加熱しようとしてもトーチが点火しな
いことが上げられる。Previously, aluminum wire could not be used for rad bonding to nails. The reasons for this are that aluminum wire does not form a ball even when heated with a hydrogen torch, that it oxidizes when heated and contaminates the element surface, and that the torch does not ignite even if you try to heat it in a nitrogen atmosphere to prevent this. It will be done.

本発明はこのような従来の方法の欠点を解消するもので
あって、その目的とするところはアルミニウム線をつか
ってネールへラドボンディングができるボンディング装
置を提供するにある。以下図面に関連して本発明の実施
例について説明する。The present invention aims to eliminate the drawbacks of the conventional methods, and its purpose is to provide a bonding device that can perform rad bonding to nails using aluminum wire. Embodiments of the present invention will be described below with reference to the drawings.

第１図は本発明に従ったボンディング装置の一部を断面
し一部を省略した正面図である。同図において、ネイル
ヘッドボンディング用のキャピラ＋Ｊ　１は軸線にそっ
てアルミニウム線２を通す穴３を有し、アルミニウム線
２はワイヤ・ボビン４にかなりの長さ巻き付けられてい
て、必要に応じて穴３を通してキャピラリ１の先端から
引き出される。またキャピラリ１とワイヤ・ポビン４の
間にワイヤ・クランパ５を配置し適宜にアルミニウム線
２を把持するようにするとともに、これらの間にはキャ
ピラリ１の広部に延長させて窒素（Ｎ２）などの不活性
ガスを穴３を通してキャピラリ１の先端に供給できるよ
う不活性ガス供給管６を設けている。さらにキャピラリ
１の近接位置に折曲した電極片７を配置し、キャピラリ
１の先端からたとえば１馴程度離れた低い位置にその一
端があるように設け、他端は電源８に接続し、やはり電
源８と接続させたアルミニウム線２との間で電ｆｉ的回
路を構成させて、電極片７とアルミニウム線２の先端と
の間で、放電によるスパークを生じるようにしている。FIG. 1 is a partially sectional and partially omitted front view of a bonding apparatus according to the present invention. In the same figure, a capillar +J 1 for nail head bonding has a hole 3 along the axis through which an aluminum wire 2 is passed, and the aluminum wire 2 is wound around a wire bobbin 4 for a considerable length, and the aluminum wire 2 is wound around a wire bobbin 4 for a considerable length. It is drawn out from the tip of the capillary 1 through the hole 3. In addition, a wire clamper 5 is arranged between the capillary 1 and the wire pobbin 4 to appropriately grip the aluminum wire 2, and between these, a nitrogen (N2) etc. An inert gas supply pipe 6 is provided so that an inert gas can be supplied to the tip of the capillary 1 through the hole 3. Further, a bent electrode piece 7 is placed close to the capillary 1 so that one end thereof is at a low position, for example, about 1 inch away from the tip of the capillary 1, and the other end is connected to a power source 8, which is also a power source. An electric circuit is constructed between the electrode piece 7 and the aluminum wire 2 connected to the aluminum wire 2, so that a spark is generated by discharge between the electrode piece 7 and the tip of the aluminum wire 2.

また、電極片７はアルミニウム線２にボール９をつくる
ときのみキャピラリ１の先端に対応されるよう動かせる
ように設けている。Further, the electrode piece 7 is provided so as to be movable so as to correspond to the tip of the capillary 1 only when forming the ball 9 on the aluminum wire 2.

１　　　　　　　　つぎに、この装置をっがってのアル
ミニウム線のポール成形方法を第２図で説明すれば、第
２図ｆａ）はアルミニウム線２にボールを形成する前の
状態であって、電極片７はその先端がキヤビンＩＪ　１
の先端から外れた位置にくるように動かされた位置ニあ
る。この状態から第２図（ｂｌのように、電極片７をキ
ャピラリｌに近づくように動かし、電極片７の先端内側
をキャピラリ１の先端に対応させて、同時に不活性ガス
供給管６かも窒素（Ｎ、）ガスを穴３を通してキャピラ
リ１先端付近に流しながう、電源８から任意の電流を流
して電極片７の先端からアルミニウム線２に向けて放電
すれば、これらの間にスパークが発生し、このスパーク
によりアルミニウム線２は溶けて先端にボール９ができ
る。1. Next, the method of forming a pole on an aluminum wire using this device will be explained with reference to FIG. 2. FIG. The tip of 7 is the cabin IJ 1
There is a position where it is moved so that it is located off the tip of the tip. From this state, as shown in FIG. N.) Gas flows through the hole 3 to the vicinity of the tip of the capillary 1. If an arbitrary current is applied from the power source 8 and discharged from the tip of the electrode piece 7 toward the aluminum wire 2, a spark will be generated between them. However, this spark melts the aluminum wire 2 and forms a ball 9 at the tip.

そこで、再び電極片７をキャピラリ１から遠ざけてかも
、図示しない被ボンデイング側の電極とリード線の間を
往来させてネイルヘッドワイヤボンディングを行なう。Therefore, even if the electrode piece 7 is moved away from the capillary 1 again, nail head wire bonding is performed by moving the electrode piece 7 back and forth between the electrode on the side to be bonded (not shown) and the lead wire.

そして電極とリード線間のボンディングを１回終る都度
、電極片７をキャピウＩＪＩＶｃ近づけアアヤオ＝ウェ
線２．）先端よ、−！ル９をつくる。Each time the bonding between the electrode and the lead wire is completed, the electrode piece 7 is brought closer to the cap. ) tip, -! Create 9.

なお、前記実施例においては不活性雰囲気をつくるため
のガスとして窒素（Ｎ、）ガスを用いたがアルゴン（Ａ
ｒ）ガスを用いてもよい。また装置全体を窒素（Ｎ、）
雰囲気中に置いて行ってもよい。また、電源８とアルミ
ニウム線２との電気的な接続は、第１図に示すようにワ
イヤ・ボビン４側から行うのでなく、第３図に示すよう
にワイヤ・ボビン４とクランパ５０間で接点１０を介し
てアルミニウム線２に接続を図る方法であってもよい。In the above examples, nitrogen (N,) gas was used as a gas to create an inert atmosphere, but argon (A) gas was used.
r) Gas may be used. In addition, the entire device is nitrogen (N,)
You can leave it in the atmosphere. Furthermore, the electrical connection between the power source 8 and the aluminum wire 2 is not made from the wire bobbin 4 side as shown in FIG. A method of connecting to the aluminum wire 2 via the aluminum wire 10 may also be used.

以上の説明から明らかなように本発明によれば、アルミ
ニウム線２の先端に電極片７を近づけて対応させ、この
電極片７かうアルミニウム線２の先端に向けて放電させ
ることによって生ずるスパークによりアルミニウム線２
を溶かしてアルミニウム線２の先端に任意の大きさのボ
ール９をつくることができ、かつ窒素（Ｎ２　）ガスな
どでスパーク発生付近を不活性化して酸化を防いでいる
ことから、従来では不可能であったアルミニウム線２の
ネールヘッドワイヤボンディングが可能となる。As is clear from the above description, according to the present invention, the electrode piece 7 is brought close to the tip of the aluminum wire 2 so that the electrode piece 7 corresponds to the tip, and the spark generated by discharging the electrode piece 7 toward the tip of the aluminum wire 2 causes the aluminum line 2
It is possible to create a ball 9 of any size at the tip of the aluminum wire 2 by melting the aluminum wire 2, and the area near the spark generation is inactivated with nitrogen (N2) gas to prevent oxidation, which is impossible with conventional methods. Nail head wire bonding of the aluminum wire 2 becomes possible.

したがって、アルミニウム線といった金（Ａｕ）などか
らみて安価な線材で所望のワイヤボンディングができ原
価低減が図れる上に、製品の信頼度の向上が図れかつ能
率向上の点においても寄与できる。Therefore, the desired wire bonding can be performed with a wire rod such as aluminum wire, which is cheaper than gold (Au), and the cost can be reduced, and the reliability of the product can be improved and efficiency can also be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明に従ったボンディング装置、第２図（ａ
ｔ　、　（ｂ）は第１図の装置によりボールを形成する
方法を説明するに用いる説明図、第３図は電源とアルミ
ニウム線の他の接続方法を示す説明図である。 １・・・キャピラリ、２・・・アルミニウム線、３・・
・穴、４・・・ワイヤ・ボビン、５・・・ワイヤ・クラ
ンパ、６・・・不活性ガス供給管、７・・・電極片、８
・・・電源、９・・・ボール、１０・・・接点。 第１図　　　　　　　第２図 第３図 手続補正書（方式） ％式％ 事件の表示 昭和　５９　年　特許願　第　２５９１５１　　号発明
の名称 ボンディング装置 補正をする者FIG. 1 shows a bonding apparatus according to the invention, FIG.
t, (b) is an explanatory diagram used to explain the method of forming a ball using the apparatus of FIG. 1, and FIG. 3 is an explanatory diagram showing another method of connecting the power supply and the aluminum wire. 1... Capillary, 2... Aluminum wire, 3...
- Hole, 4... Wire bobbin, 5... Wire clamper, 6... Inert gas supply pipe, 7... Electrode piece, 8
...power supply, 9...ball, 10...contact. Figure 1 Figure 2 Figure 3 Procedural amendment (method) % formula % Display of case 1982 Patent application No. 259151 Name of invention Bonding device Person who makes amendment

Claims (1)

【特許請求の範囲】[Claims] １、ボンディング用アルミニウム線を導出するキャピラ
リと、少くとも前記キャピラリから導出されるアルミニ
ウム線の先端部を不活性雰囲気で覆う不活性ガスを供給
するための不活性ガス供給部と、前記キャピラリから導
出されるアルミニウム線の先端部と所定距離離間して配
置される電極部と、前記電極部とアルミニウム線間に接
続される電源と、前記不活性ガス供給部から供給される
不活性ガスにより前記アルミニウム線の先端部を不活性
雰囲気で覆った状態で前記所定距離離間しているアルミ
ニウム線と電極部間で放電を生じさせ前記アルミニウム
線の先端にボールを形成する機構とを有することを特徴
とするボンディング装置。1. A capillary for leading out the aluminum wire for bonding, an inert gas supply unit for supplying an inert gas to cover at least the tip of the aluminum wire led out from the capillary with an inert atmosphere, and a capillary for leading out the aluminum wire from the capillary. an electrode section disposed at a predetermined distance from the tip of the aluminum wire, a power source connected between the electrode section and the aluminum wire, and an inert gas supplied from the inert gas supply section to It is characterized by having a mechanism that generates a discharge between the aluminum wire and the electrode part which are separated by a predetermined distance while the tip of the wire is covered with an inert atmosphere to form a ball at the tip of the aluminum wire. bonding equipment.
JP59259151A 1984-12-10 1984-12-10 Bonding device Pending JPS6156425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59259151A JPS6156425A (en) 1984-12-10 1984-12-10 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59259151A JPS6156425A (en) 1984-12-10 1984-12-10 Bonding device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8911476A Division JPS5314650A (en) 1976-07-28 1976-07-28 Ball forming of alminum wire

Publications (1)

Publication Number Publication Date
JPS6156425A true JPS6156425A (en) 1986-03-22

Family

ID=17330042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59259151A Pending JPS6156425A (en) 1984-12-10 1984-12-10 Bonding device

Country Status (1)

Country Link
JP (1) JPS6156425A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015120667A1 (en) * 2014-02-14 2015-08-20 北京中电科电子装备有限公司 Electronic sparking apparatus and communication method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157068A (en) * 1974-06-07 1975-12-18
JPS5119479A (en) * 1974-08-09 1976-02-16 Hitachi Ltd

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157068A (en) * 1974-06-07 1975-12-18
JPS5119479A (en) * 1974-08-09 1976-02-16 Hitachi Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015120667A1 (en) * 2014-02-14 2015-08-20 北京中电科电子装备有限公司 Electronic sparking apparatus and communication method therefor

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