JPH05109809A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPH05109809A
JPH05109809A JP3264640A JP26464091A JPH05109809A JP H05109809 A JPH05109809 A JP H05109809A JP 3264640 A JP3264640 A JP 3264640A JP 26464091 A JP26464091 A JP 26464091A JP H05109809 A JPH05109809 A JP H05109809A
Authority
JP
Japan
Prior art keywords
wire
tip
ball
discharge
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3264640A
Other languages
Japanese (ja)
Inventor
Noriyasu Kashima
規安 加島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3264640A priority Critical patent/JPH05109809A/en
Publication of JPH05109809A publication Critical patent/JPH05109809A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Abstract

PURPOSE:To form a favorable ball at a tip of a wire by a method wherein a pair of opposing electrodes are provided while sandwiching a wire tip, and a discharge is performed between the electrodes. CONSTITUTION:In the vicinity of a tip of a capillary 1 through which a wire 5 introduced from a wire pool 4 is inserted, a pair of electrodes 11, 11 are provided oppositely with a wire 5 being interposed. A high voltage is applied from a power supply 9 and a spark discharge is performed between tips of the electrodes 11, 11, whereby the tip of the wire 5 is melted with heat to form a ball. As a high voltage is not supplied to the wire 5, insufficient discharge due to insufficient contact between a clamper 10 and the wire 5 and oxidation due to the discharge on the clamp plane can be prevented, and wire bonding can be performed in a favorable condition.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明はワイヤボンディング装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding device.

【０００２】[0002]

【従来の技術】半導体装置の製造工程の一つに、ＩＣペ
レットの電極パッドと基板の配線パタ−ンとをワイヤで
結線するワイヤボンディング工程がある。2. Description of the Related Art One of the processes for manufacturing a semiconductor device is a wire bonding process for connecting an electrode pad of an IC pellet and a wiring pattern of a substrate with a wire.

【０００３】従来、このワイヤボンディング工程は図４
（ａ）、（ｂ）に示すようにして行われている。図中１
はキャピラリである。このキャピラリは図５（ａ）に２
で示すワイヤボンディング装置本体２によって超音波ホ
−ン３を介して上下方向移動自在に保持されている。そ
して、このワイヤボンディング装置本体２の上部にはワ
イヤスプ−ル４が配置され、このワイヤスプ−ル４から
導出されたワイヤ５は上記キャピラリ１に挿通され、こ
のキャピラリ１の下端から下方に導出されている。Conventionally, this wire bonding process is shown in FIG.
This is performed as shown in (a) and (b). 1 in the figure
Is a capillary. This capillary is shown in FIG.
The wire bonding apparatus main body 2 shown in FIG. Then, a wire spool 4 is arranged on the upper part of the wire bonding apparatus main body 2, and a wire 5 led out from the wire spool 4 is inserted into the capillary 1 and led out downward from the lower end of the capillary 1. There is.

【０００４】ワイヤボンディング装置は、まずこのワイ
ヤ５の先端部にボ−ルを形成する。それには、図４
（ａ）に示すように、上記電極６と上記ワイヤ５の先端
部との間（図にＡで示す部分）で放電を行わせ、この放
電により上記ワイヤ５を溶融する。このことにより図４
（ｂ）に示すように、上記ワイヤ５の先端部の溶融され
たワイヤ５は表面張力によって球状になり、ボ−ル５ａ
を形成する。The wire bonding apparatus first forms a ball at the tip of the wire 5. To that end,
As shown in (a), electric discharge is caused between the electrode 6 and the tip of the wire 5 (the portion indicated by A in the figure), and the wire 5 is melted by this electric discharge. As a result,
As shown in (b), the melted wire 5 at the tip of the wire 5 becomes spherical due to surface tension, and the ball 5a
To form.

【０００５】上記ワイヤ５の先端部にボ−ル５ａが形成
されたならば、このワイヤボンディング装置は、上記電
極６の先端部を上記キャピラリの下方から退避させる。
そして、上記ワイヤボンディング装置は、上記キャピラ
リ１を下降駆動し、上記ボ−ル５ａを第１のボンディン
グ点であるＩＣペレット７の電極パッド７ａ（被ボンデ
ィング部材）に圧着してボンディングする。When the ball 5a is formed at the tip of the wire 5, the wire bonding apparatus retracts the tip of the electrode 6 from below the capillary.
Then, the wire bonding apparatus drives the capillary 1 downward to bond the ball 5a to the electrode pad 7a (bonding target member) of the IC pellet 7 which is the first bonding point.

【０００６】そして、このワイヤボンディング装置は、
上記キャピラリ１をＸＹＺ方向に駆動すると共にワイヤ
５を繰出し、そのワイヤ５を第２のボンディング点であ
るリ−ドフレ−ム８側にボンディングした後、余ったワ
イヤ５を切断する。And, this wire bonding apparatus is
After driving the capillary 1 in the XYZ directions and feeding out the wire 5, and bonding the wire 5 to the lead frame 8 side which is the second bonding point, the excess wire 5 is cut.

【０００７】このワイヤボンディング装置は、このよう
な動作を上記ＩＣペレット７のすべての電極パッド７ａ
について行い、上記ＩＣペレット７と上記リ−ドフレ−
ム８の配線パタ−ンを電気的に接続する。This wire bonding apparatus performs such an operation for all the electrode pads 7a of the IC pellet 7.
The IC pellet 7 and the lead frame.
The wiring pattern of the frame 8 is electrically connected.

【０００８】ところで、上記ワイヤ５の先端部にボ−ル
５ａを形成するために、上記ワイヤ５の先端部と電極６
との間で放電を起こすには、上記電極６およびワイヤ５
に高電圧を供給しなければならない。この給電方法とし
て、従来、図５（ａ）および（ｂ）に示す方法がある。By the way, in order to form the ball 5a at the tip of the wire 5, the tip of the wire 5 and the electrode 6 are formed.
In order to generate a discharge between the electrode 6 and the wire 5
Must be supplied with a high voltage. Conventionally, as a method for supplying the electric power, there is a method shown in FIGS.

【０００９】図５（ａ）に示す方法は上記ワイヤスプ−
ル４に巻回されたワイヤ５と上記電極６とに電源９の出
力端子をそれぞれ接続する方法である。図５（ｂ）に示
す方法は、上記ワイヤ５にバックテンションをかけるた
めのクランパ１０と上記電極６とに上記電源９の出力端
子をそれぞれ接続する方法である。この方法では、上記
クランパ１０がワイヤ５をクランプすることで上記ワイ
ヤ５に高電圧を供給する。The method shown in FIG.
In this method, the output terminal of the power supply 9 is connected to the wire 5 wound around the reel 4 and the electrode 6 respectively. The method shown in FIG. 5B is a method of connecting the output terminal of the power supply 9 to the clamper 10 for applying back tension to the wire 5 and the electrode 6. In this method, the clamper 10 clamps the wire 5 to supply a high voltage to the wire 5.

【００１０】[0010]

【発明が解決しようとする課題】しかし、図５（ａ）に
示す方法の場合、ワイヤスプ−ル４を交換する度に電源
９との結線をやりなおす必要があり作業効率が悪いとい
うことがある。However, in the case of the method shown in FIG. 5 (a), it is necessary to reconnect the wire 9 with the power source 9 every time the wire spool 4 is replaced, which may result in poor work efficiency.

【００１１】また図５（ｂ）に示す方法では、上記クラ
ンパ１０のワイヤ５をクランプする力が約５０グラムと
軽いため十分な接触が得られずクランパ１０とワイヤ５
との間で微小放電が起こったり電流による温度上昇等の
ため、長時間使用すると上記クランパ１０のクランプ面
に酸化物などの汚れが付着しクランプ力の低下や放電ミ
スなどが発生するということがある。Further, in the method shown in FIG. 5 (b), since the force for clamping the wire 5 of the clamper 10 is as light as about 50 grams, sufficient contact cannot be obtained and the clamper 10 and the wire 5 cannot be obtained.
When a long time use, a stain such as oxide adheres to the clamp surface of the clamper 10 due to a minute discharge between the clamp and the temperature rise due to the current, etc., resulting in a decrease in the clamp force or a discharge error. is there.

【００１２】この発明は、このような事情に鑑みて成さ
れたもので、作業性が良くかつ上記ワイヤの先端部に良
好なボ−ルを形成することができるワイヤボンディング
装置を提供することを目的とするものである。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a wire bonding apparatus which has good workability and can form a good ball at the tip of the wire. It is intended.

【００１３】[0013]

【課題を解決するための手段】この発明は、ワイヤの先
端を溶融してボ−ルを形成し、このボ−ルを被ボンディ
ング部材に熱圧着してワイヤの接続を行うワイヤボンデ
ィング装置において、電圧を発生する電源と、この電源
に接続されると共に上記ワイヤの先端部を挟んで離間対
向して設けられ、電圧が印加されることで放電を発生し
上記ワイヤの先端部を溶融してボ−ルを形成する一対の
電極とを具備することを特徴とする。SUMMARY OF THE INVENTION The present invention relates to a wire bonding apparatus for melting a tip of a wire to form a ball, and thermocompressing the ball to a member to be bonded to connect the wire. It is connected to the power source that generates a voltage, and is provided so as to be separated and opposed to each other with the tip of the wire sandwiched therebetween. When voltage is applied, discharge is generated to melt the tip of the wire and And a pair of electrodes forming a ring.

【００１４】[0014]

【作用】このような構成によれば、このワイヤの先端部
を挟んで対向する一対の電極間で放電を行わせ、この放
電の熱によりワイヤの先端部を溶融しボ−ルを形成する
ことができる。According to this structure, a discharge is generated between a pair of electrodes facing each other with the tip of the wire sandwiched therebetween, and the heat of the discharge melts the tip of the wire to form a ball. You can

【００１５】[0015]

【実施例】以下、この発明の一実施例を図１〜図３を参
照して説明する。なお、従来例と同一の構成要素には同
一記号を付してその説明は省略する。図中１はキャピラ
リである。このキャピラリにはワイヤスプ−ル４から導
出されたワイヤ５が挿通されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same components as those of the conventional example are designated by the same reference numerals, and the description thereof will be omitted. In the figure, 1 is a capillary. A wire 5 led out from the wire spool 4 is inserted through this capillary.

【００１６】このキャピラリ１が上昇している状態（図
１の状態）で、このキャピラリ１の先端部の近傍には、
一対の電極１１、１１が上記キャピラリ１の先端部から
延出されたワイヤ５を挟んで対向する位置に設けられて
いる。In the state where the capillary 1 is raised (state of FIG. 1), near the tip of the capillary 1,
A pair of electrodes 11, 11 are provided at positions facing each other with the wire 5 extending from the tip of the capillary 1 interposed therebetween.

【００１７】この一対の電極１１、１１は電源９の出力
端子にそれぞれ接続されている。そして、図２に示すよ
うに、この電源９から高電圧が印加されることで、上記
一対の電極１１、１１の先端部間で火花放電を行う。こ
のことによって、上記ワイヤ５の先端部は上記火花放電
の熱によって溶融し、ボ−ル５ａが形成される。The pair of electrodes 11, 11 are connected to the output terminals of the power source 9, respectively. Then, as shown in FIG. 2, when a high voltage is applied from the power source 9, a spark discharge is generated between the tip portions of the pair of electrodes 11, 11. As a result, the tip of the wire 5 is melted by the heat of the spark discharge, and the ball 5a is formed.

【００１８】このような構成によれば、図５（ａ）に示
す従来例と異なりワイヤスプ−ル４を交換した場合でも
あらためて電源９とワイヤ５とを結線しなおす必要はな
い。また、図５（ｂ）に示す従来例のように、クランパ
１０とワイヤ５との接触不良によって放電不良が発生し
たり、クランパ１０とワイヤ５の間に放電が発生してク
ランプ面が酸化してしまうということはない。According to this structure, unlike the conventional example shown in FIG. 5A, it is not necessary to reconnect the power source 9 and the wire 5 even when the wire spool 4 is replaced. Further, as in the conventional example shown in FIG. 5B, a defective discharge occurs due to a defective contact between the clamper 10 and the wire 5, or a discharge occurs between the clamper 10 and the wire 5 to oxidize the clamp surface. It does not happen.

【００１９】すなわち、この発明のワイヤボンディング
装置はワイヤ５に高電圧を供給するのではなく、対向す
る一対の電極１１、１１間に起こる放電により上記ワイ
ヤ５の先端部にボ−ル５ａを形成するようにしたので、
従来に比べより良好な状態でワイヤボンディングを行う
ことができる。That is, the wire bonding apparatus of the present invention does not supply a high voltage to the wire 5, but forms a ball 5a at the tip of the wire 5 by the discharge generated between the pair of electrodes 11 facing each other. I decided to do so,
Wire bonding can be performed in a better condition than in the past.

【００２０】また、図４、図５に示す従来の電極と異な
りキャピラリ９を下降させる際に上記電極１１を後退さ
せるということが必要ないので、その分構成が簡略化さ
れ、より高速でワイヤボンディングを行うことができ
る。なお、この発明は上記一実施例に限定されるもので
はなく、発明の要旨を変更しない範囲で種々変形可能で
ある。Further, unlike the conventional electrodes shown in FIGS. 4 and 5, it is not necessary to retract the electrode 11 when lowering the capillary 9, so that the structure is simplified accordingly, and wire bonding is performed at higher speed. It can be performed. It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified without changing the gist of the invention.

【００２１】例えば、上記一実施例では、空気中で放電
が行われていたが、図３に示すように、上記電極１１の
回りに還元ガスを噴出する供給管１２を配置し、還元ガ
ス雰囲気中Ｂで行うようにしてもよい。For example, in the above-mentioned one embodiment, the electric discharge was performed in the air, but as shown in FIG. 3, the supply pipe 12 for ejecting the reducing gas is arranged around the electrode 11 and the reducing gas atmosphere is provided. It may be performed in the middle B.

【００２２】この供給管１２の一端は上記ワイヤ５の方
に解放し、他端側は図示しない還元ガス供給源に接続さ
れている。そして、上記ワイヤ５の先端部に上記ボ−ル
５ａを形成する際には、上記還元ガス供給源はＯＮ状態
になって上記ワイヤ５の先端部を還元ガス雰囲気Ｂで覆
い、上記ボ−ル５ａの表面が酸化するのを防止する。One end of the supply pipe 12 is open toward the wire 5, and the other end is connected to a reducing gas supply source (not shown). When the ball 5a is formed at the tip of the wire 5, the reducing gas supply source is turned on to cover the tip of the wire 5 with the reducing gas atmosphere B, It prevents the surface of 5a from being oxidized.

【００２３】このことにより、ワイヤボンディングの際
に、上記ボ−ル５ａと上記半導体素子の電極の接合性が
悪くなるのを有効に防止することができる。これは、特
に、ワイヤ５が銅等の酸化しやすい材質で形成されてい
る場合に有効である。As a result, it is possible to effectively prevent the bondability between the ball 5a and the electrode of the semiconductor element from being deteriorated during wire bonding. This is particularly effective when the wire 5 is made of a material such as copper that easily oxidizes.

【００２４】[0024]

【発明の効果】上述のように、この発明のワイヤボンデ
ィング装置は、キャピラリに挿通されたワイヤの先端部
を挟んで対向する一対の電極を有し、この電極間で放電
をおこさせることにより、上記ワイヤの先端部を溶融し
てボ−ルを形成するようにしたものである。As described above, the wire bonding apparatus of the present invention has a pair of electrodes facing each other with the tip of the wire inserted in the capillary interposed therebetween, and discharge is generated between the electrodes. The tip of the wire is melted to form a ball.

【００２５】このような構成によれば、ワイヤに給電し
ないので、従来ワイヤに給電することにより生じていた
種々の問題点を解決し、より良好な状態でワイヤボンデ
ィングを行うことが可能である。According to this structure, since no electric power is supplied to the wire, it is possible to solve various problems that have been caused by supplying electric power to the wire and perform wire bonding in a better condition.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の一実施例を示す概略構成図。FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.

【図２】同じく、ワイヤの先端部にボ−ルが形成される
状態を示す概略構成図。FIG. 2 is a schematic configuration diagram showing a state in which a ball is formed at the tip of the wire.

【図３】同じく他の実施例を示す概略構成図。FIG. 3 is a schematic configuration diagram showing another embodiment of the same.

【図４】（ａ）、（ｂ）は従来例のボ−ル形成工程を示
す工程図。4A and 4B are process diagrams showing a ball forming process of a conventional example.

【図５】（ａ）、（ｂ）は従来例のワイヤおよび電極へ
の給電方法を示す概略構成図。5A and 5B are schematic configuration diagrams showing a method of supplying power to a wire and an electrode in a conventional example.

【符号の説明】[Explanation of symbols]

１…キャピラリ、５…ワイヤ、５ａ…ボ−ル、８…電
源、１１…電極、１２…供給管（還元ガス供給手段）。1 ... Capillary, 5 ... Wire, 5a ... Ball, 8 ... Power supply, 11 ... Electrode, 12 ... Supply pipe (reducing gas supply means).

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 ワイヤの先端を溶融してボ−ルを形成
し、このボ−ルを被ボンディング部材に熱圧着してワイ
ヤの接続を行うワイヤボンディング装置において、電圧
を発生する電源と、この電源に接続されると共に上記ワ
イヤの先端部を挟んで離間対向して設けられ、電圧が印
加されることで放電を発生し上記ワイヤの先端部を溶融
してボ−ルを形成する一対の電極とを具備することを特
徴とするワイヤボンディング装置。1. A wire bonding apparatus for melting a tip of a wire to form a ball and thermocompressing the ball to a member to be bonded for wire connection, and a power source for generating a voltage, A pair of electrodes that are connected to a power source and are spaced apart and opposed to each other with the tip of the wire sandwiched therebetween and generate a discharge when a voltage is applied to melt the tip of the wire to form a ball. A wire bonding apparatus comprising:
JP3264640A 1991-10-14 1991-10-14 Wire bonder Pending JPH05109809A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3264640A JPH05109809A (en) 1991-10-14 1991-10-14 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3264640A JPH05109809A (en) 1991-10-14 1991-10-14 Wire bonder

Publications (1)

Publication Number Publication Date
JPH05109809A true JPH05109809A (en) 1993-04-30

Family

ID=17406164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3264640A Pending JPH05109809A (en) 1991-10-14 1991-10-14 Wire bonder

Country Status (1)

Country Link
JP (1) JPH05109809A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040635A (en) * 2009-08-13 2011-02-24 Kaijo Corp Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040635A (en) * 2009-08-13 2011-02-24 Kaijo Corp Wire bonding device

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