JPS6155124A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPS6155124A JPS6155124A JP17609984A JP17609984A JPS6155124A JP S6155124 A JPS6155124 A JP S6155124A JP 17609984 A JP17609984 A JP 17609984A JP 17609984 A JP17609984 A JP 17609984A JP S6155124 A JPS6155124 A JP S6155124A
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- resin
- prepreg
- water
- paper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、銀移行性の防止に有効なフェノール樹脂積層
板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for producing a phenolic resin laminate that is effective in preventing silver migration.
従来の技術
近年、電気、電子機器産業の発展に伴い高度の電気特性
を有する積層板が開発さ几て来た。BACKGROUND OF THE INVENTION In recent years, with the development of the electrical and electronic equipment industries, laminates with advanced electrical properties have been developed.
特に良性用電子機器分野に於いては、フェノール樹脂積
層板を使用した印刷配線板の低コスト化、及び高密度配
線化が必至である。印刷配線板の製造に於いては、フェ
ノール樹脂積層板に銀を主成分とする導電性塗料を印刷
し電気導通回路を形成する事によp高密度配線化を実施
している。現在、印刷配線板の銀印刷による導通回路間
隔は2.5mピッチ以下になりつつある。Particularly in the field of benign electronic devices, it is essential to reduce the cost of printed wiring boards using phenolic resin laminates and to increase wiring density. In manufacturing printed wiring boards, high-density wiring is achieved by printing a conductive paint containing silver as a main component on a phenolic resin laminate to form an electrically conductive circuit. Currently, the spacing between conductive circuits printed with silver on printed wiring boards is becoming less than 2.5 m pitch.
発明が解決しようとする問題点
従来のフェノール樹脂積層板は、紙基材を水溶性フェノ
ール樹脂で下処理し、油変性フェノール樹脂を含浸乾燥
して得たプリプレグを積層成形したものである。しかし
、上述のように、銀印刷による導通回路間隔が2.5m
ピッチ以下に狭くなってくると、銀移行を完全に防止す
ることができない。Problems to be Solved by the Invention Conventional phenolic resin laminates are made by laminating and molding prepregs obtained by pre-treating a paper base material with a water-soluble phenolic resin, impregnating it with an oil-modified phenolic resin and drying it. However, as mentioned above, the conductive circuit interval due to silver printing is 2.5 m.
When the width becomes narrower than the pitch, silver migration cannot be completely prevented.
本発明に、紙基材のフェノール樹脂積層板において、銀
移行性を抑制することを目的とする。An object of the present invention is to suppress silver migration in a paper-based phenolic resin laminate.
問題点を解決するための手段
本発明は、前記問題点を解決する為、鋭意検討した結果
、紙基材を水溶性フェノール樹脂で下処理乾燥後、油変
性フェノール樹脂を含浸乾燥したプリプレグを適当枚数
重ね中間層とし、紙基材を水溶性フェノール樹脂で下処
理乾燥後、エポキシ樹脂を含浸乾燥したプリプレグ1枚
を表面層として積層成形することを特徴とするものであ
る。エポキシ樹脂に、ビスフェノール型エポキシ、ノボ
ラック型エポキシ等が使用出来るO
紙基材は、本来銀移性防止に悪影響を及ぼす△
のであるが、銀印刷による回路を形成する積層板表面を
上記エポキシ樹脂プリプレグで構成することにより、銀
移行を効果的に抑制できる。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention, as a result of intensive studies, has developed a paper base material which has been pretreated with a water-soluble phenol resin and dried, and then impregnated with an oil-modified phenol resin and dried. It is characterized by stacking a number of sheets to form an intermediate layer, and after pre-treating and drying a paper base material with a water-soluble phenol resin, a single sheet of prepreg impregnated and dried with an epoxy resin is laminated and molded as a surface layer. Bisphenol-type epoxy, novolac-type epoxy, etc. can be used as the epoxy resin. Paper base materials originally have a negative effect on preventing silver migration. By comprising, silver migration can be effectively suppressed.
実施例 次に、本発明の詳細な説明する。Example Next, the present invention will be explained in detail.
実施例1
水溶性フェノール樹脂として次のものを用いた。まず、
フェノール9401、パラホルムアルデヒド900?を
トリメチルアミン触媒下でムアルデヒド初期縮合物を樹
脂固型が重量で15%になる様に水とメタノールの混合
溶媒にて稀釈したフェスとする。Example 1 The following water-soluble phenolic resin was used. first,
Phenol 9401, paraformaldehyde 900? The initial condensate of maldehyde was diluted with a mixed solvent of water and methanol under a trimethylamine catalyst so that the resin solids amounted to 15% by weight.
一方、油変性フェノール樹脂は、メタクレゾール500
f、桐油60(lをパラトルエンスルホン酸触媒下で8
0℃、1時間反応させ、次にフェノール450 F、バ
ラホルムアルデヒド3852.25%アンモニア水27
.5Fを添加し80℃、4時間反応し、脱水した後樹脂
固型が重量で50%になる様に溶剤で稀釈したフェスを
用いる。On the other hand, oil-modified phenolic resin is metacresol 500
f, tung oil 60 (l) under para-toluenesulfonic acid catalyst
React at 0°C for 1 hour, then add phenol 450F, rose formaldehyde 3852.25% ammonia water 27%
.. 5F was added, reacted at 80°C for 4 hours, dehydrated, and then diluted with a solvent so that the resin solid content was 50% by weight.
エポキシ樹脂は、エポキシ樹脂(商品名ESA−001
、注文化学製)80重量部に硬化剤としてノボラック型
フェノール樹脂(商品名TD−2093、大日本インキ
製)20重置部、硬化促進剤ベンジルジメチルアミン0
.3重量部を配合したフェスを用いる。The epoxy resin is epoxy resin (product name ESA-001
, made by Custom Chemical Co., Ltd.), 20 parts by weight of novolac type phenol resin (trade name TD-2093, made by Dainippon Ink) as a curing agent, and 0 parts of benzyldimethylamine as a curing accelerator.
.. A fest containing 3 parts by weight is used.
まず、11ミルスのクラフト紙に上記水溶性フェノール
樹脂を15%含浸乾燥し、更に上記桐油変性フェノール
樹脂を含浸乾燥し、樹脂量48%のプリプレグを得た(
プリプレグ(A)とする)。次に11ミルスのクラフト
紙に水溶性フェノール樹脂2!−15%含浸乾燥し、更
に上記エポキシ樹脂を含浸乾燥し樹脂量48%のプリプ
レグを得た(プリプレグ(B)とする)。First, 11 mils kraft paper was impregnated with 15% of the water-soluble phenolic resin and dried, and then impregnated with the tung oil-modified phenolic resin and dried to obtain a prepreg with a resin content of 48% (
Prepreg (A)). Next, water-soluble phenolic resin 2 on 11 mils kraft paper! -15% impregnated and dried, and further impregnated and dried with the above epoxy resin to obtain a prepreg with a resin content of 48% (referred to as prepreg (B)).
上記プリプレグ(A)6枚を中間層とし、プリプレグ(
B)1枚を両表面層としてこ1f:100に9/m圧力
下で160tl::、30分間加熱成形し1.6 m厚
の積層板を得た(発明品1と称す)。Six sheets of the above prepreg (A) are used as an intermediate layer, and the prepreg (
B) One sheet was used as both surface layers and heat-formed at 1f:100 under a pressure of 9/m at 160 tl for 30 minutes to obtain a laminate with a thickness of 1.6 m (referred to as invention product 1).
実施例2
実施例1と同様のプリプレグ(A)、(B)の組合せで
更に片面に銅箔を載置し、100Kp/、−ylの圧力
下で160℃、30分間加熱成形し、L6■厚の銅張フ
積層板を得た(発明品2と称す)。Example 2 A combination of prepregs (A) and (B) similar to those in Example 1 was further placed with copper foil on one side, and heat-formed at 160°C for 30 minutes under a pressure of 100 Kp/, -yl, and L6■ A thick copper-clad laminate was obtained (referred to as invention product 2).
従来例
実施例1と同様のプリプレグ(A)を8枚重ね、100
K9/cdO)圧力下で160℃、30分間加熱成形
し1.6=厚の積層板を得た(従来品と称す)。Conventional Example 8 sheets of prepreg (A) similar to Example 1 were stacked and 100
K9/cdO) under pressure at 160° C. for 30 minutes to obtain a laminate with a thickness of 1.6 (referred to as a conventional product).
同、第1表において、銀移行の有無は、第1図に示すよ
うに積層板1上に銀を主成分とする導電性塗料でテスト
パターン2を印刷した試験片を用いて調査した。40℃
−95%RHの雰囲気中でテストパターン2の!極間に
DC50v?:印加し、1000時間処理後の様子を顕
微鏡(30〜100倍率)で観察して判定した。In Table 1, the presence or absence of silver migration was investigated using a test piece in which a test pattern 2 was printed on a laminate 1 with a conductive paint containing silver as a main component, as shown in FIG. 40℃
- Test pattern 2 in an atmosphere of 95% RH! DC50v between poles? : was applied, and the appearance after treatment for 1000 hours was observed with a microscope (30 to 100 magnification) and determined.
また、肥緑抵抗は、者沸2時間後の値をJIS規格に基
づいて測定した。Moreover, the fertility resistance was measured based on the JIS standard after 2 hours of boiling.
発明の効果
第1表の結果から明らかな様に、最表面にエポキシ樹脂
プリプレグを1枚重ねて成形する事により銀移行性防止
効果が顕著に見ら7′L電気絶縁材料としての工業的価
値は犬なるものである。Effects of the Invention As is clear from the results in Table 1, by molding a single layer of epoxy resin prepreg on the outermost surface, a remarkable effect of preventing silver migration can be seen. is a dog.
第1図は銀移行性試験片の平面図である。 FIG. 1 is a plan view of a silver migration test piece.
Claims (1)
ノール樹脂を含浸乾燥して得たプリプレグを中間層とし
、水溶性フェノール樹脂で下処理した紙基材にエポキシ
樹脂を含浸乾燥して得たプリプレグ1枚を表面層として
積層成形することを特徴とする積層板の製造法。A prepreg obtained by impregnating and drying an oil-modified phenol resin on a paper base material pretreated with a water-soluble phenolic resin was used as the intermediate layer, and a prepreg obtained by impregnating and drying an epoxy resin on a paper base material pretreated with a water-soluble phenolic resin was used as the intermediate layer. A method for manufacturing a laminate, characterized by laminating and molding one sheet of prepreg as a surface layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17609984A JPS6155124A (en) | 1984-08-24 | 1984-08-24 | Production of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17609984A JPS6155124A (en) | 1984-08-24 | 1984-08-24 | Production of laminated sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6155124A true JPS6155124A (en) | 1986-03-19 |
JPH0159290B2 JPH0159290B2 (en) | 1989-12-15 |
Family
ID=16007676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17609984A Granted JPS6155124A (en) | 1984-08-24 | 1984-08-24 | Production of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6155124A (en) |
-
1984
- 1984-08-24 JP JP17609984A patent/JPS6155124A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0159290B2 (en) | 1989-12-15 |
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