JPS6154686U - - Google Patents
Info
- Publication number
- JPS6154686U JPS6154686U JP14062184U JP14062184U JPS6154686U JP S6154686 U JPS6154686 U JP S6154686U JP 14062184 U JP14062184 U JP 14062184U JP 14062184 U JP14062184 U JP 14062184U JP S6154686 U JPS6154686 U JP S6154686U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- partition wall
- wall
- protrusion
- interposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims 1
Description
第1図は本考案と対比される従来ICソケツト
の斜視図、第2図以降は本考案の実施例を示し、
第2図はICソケツトの斜視図、第3図は同コン
タクト隔壁部の拡大斜視図、第4図は同隔壁部に
おける薄肉突片のIC接片間への介入状態を示す
同側面図、第5図は同平面図、第6図は薄肉突片
の他の例を示す拡大平面図である。
11……ソケツト基盤、12……コンタクト隔
壁、12a……薄肉突片、13……ICパツケー
ジ、14……IC搭載スペース、15……IC接
片、16……コンタクト。
Fig. 1 is a perspective view of a conventional IC socket in comparison with the present invention, and Fig. 2 and subsequent figures show embodiments of the present invention.
Fig. 2 is a perspective view of the IC socket, Fig. 3 is an enlarged perspective view of the contact partition, Fig. 4 is a side view of the same, showing how a thin protrusion in the partition wall is interposed between the IC contact pieces. 5 is a plan view of the same, and FIG. 6 is an enlarged plan view showing another example of the thin protrusion. DESCRIPTION OF SYMBOLS 11...Socket base, 12...Contact partition, 12a...Thin wall protrusion, 13...IC package cage, 14...IC mounting space, 15...IC contact piece, 16...Contact.
Claims (1)
搭載部に並設せるコンタクト隔壁に、該隔壁端面
より、突片を一体成形にて張り出させ、該突片を
コンタクト隔壁の肉厚より薄肉とし、該薄肉突片
をICパツケージの側部に並設されたIC接片間
に介入させ、該薄肉突片介入下で上記コンタクト
隔壁間に配置されたコンタクトIC接片との接触
を図る構成としたことを特徴とするICソケツト
。 A contact partition wall, which is arranged in parallel with the IC package mounting portion of a socket base made of an insulating material, is integrally molded with a projecting piece projecting from the end face of the partition wall, and the projecting piece is made thinner than the wall thickness of the contact partition wall, and the thin wall The protrusion is interposed between the IC contact pieces arranged in parallel on the side of the IC package, and the thin protrusion is interposed to make contact with the contact IC contact piece disposed between the contact partition walls. Features an IC socket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984140621U JPH0217430Y2 (en) | 1984-09-17 | 1984-09-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984140621U JPH0217430Y2 (en) | 1984-09-17 | 1984-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6154686U true JPS6154686U (en) | 1986-04-12 |
JPH0217430Y2 JPH0217430Y2 (en) | 1990-05-15 |
Family
ID=30698972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984140621U Expired JPH0217430Y2 (en) | 1984-09-17 | 1984-09-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0217430Y2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014087484A1 (en) * | 2012-12-04 | 2014-06-12 | 上野精機株式会社 | Test contact and electronic component conveyance device |
US8922302B2 (en) | 2011-08-24 | 2014-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator formed on a pedestal |
US9148117B2 (en) | 2011-02-28 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge and frame elements |
US9154112B2 (en) | 2011-02-28 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge |
US9203374B2 (en) | 2011-02-28 | 2015-12-01 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
US9243316B2 (en) | 2010-01-22 | 2016-01-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of fabricating piezoelectric material with selected c-axis orientation |
US9425764B2 (en) | 2012-10-25 | 2016-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having composite electrodes with integrated lateral features |
US9444426B2 (en) | 2012-10-25 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having integrated lateral feature and temperature compensation feature |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5389271U (en) * | 1976-12-23 | 1978-07-21 | ||
JPS542366U (en) * | 1977-06-08 | 1979-01-09 | ||
JPS5895580U (en) * | 1981-12-21 | 1983-06-29 | カシオ計算機株式会社 | Connection structure between electronic components and connectors |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS542366B2 (en) * | 1972-08-30 | 1979-02-06 |
-
1984
- 1984-09-17 JP JP1984140621U patent/JPH0217430Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5389271U (en) * | 1976-12-23 | 1978-07-21 | ||
JPS542366U (en) * | 1977-06-08 | 1979-01-09 | ||
JPS5895580U (en) * | 1981-12-21 | 1983-06-29 | カシオ計算機株式会社 | Connection structure between electronic components and connectors |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9243316B2 (en) | 2010-01-22 | 2016-01-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of fabricating piezoelectric material with selected c-axis orientation |
US9148117B2 (en) | 2011-02-28 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge and frame elements |
US9154112B2 (en) | 2011-02-28 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge |
US9203374B2 (en) | 2011-02-28 | 2015-12-01 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
US8922302B2 (en) | 2011-08-24 | 2014-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator formed on a pedestal |
US9425764B2 (en) | 2012-10-25 | 2016-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having composite electrodes with integrated lateral features |
US9444426B2 (en) | 2012-10-25 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having integrated lateral feature and temperature compensation feature |
WO2014087484A1 (en) * | 2012-12-04 | 2014-06-12 | 上野精機株式会社 | Test contact and electronic component conveyance device |
Also Published As
Publication number | Publication date |
---|---|
JPH0217430Y2 (en) | 1990-05-15 |
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