JPS6153936B2 - - Google Patents

Info

Publication number
JPS6153936B2
JPS6153936B2 JP3128882A JP3128882A JPS6153936B2 JP S6153936 B2 JPS6153936 B2 JP S6153936B2 JP 3128882 A JP3128882 A JP 3128882A JP 3128882 A JP3128882 A JP 3128882A JP S6153936 B2 JPS6153936 B2 JP S6153936B2
Authority
JP
Japan
Prior art keywords
thin plate
synthetic resin
resin material
pin
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3128882A
Other languages
Japanese (ja)
Other versions
JPS58147330A (en
Inventor
Tadashi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3128882A priority Critical patent/JPS58147330A/en
Publication of JPS58147330A publication Critical patent/JPS58147330A/en
Publication of JPS6153936B2 publication Critical patent/JPS6153936B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1635Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 本発明はインサート成形法に関するものであ
り、その目的とするところは、放熱性や耐熱性等
の向上のためにインサートする薄板を変形させる
ことなく所定の位置に埋設することのできるイン
サート成形法を提供することにある。
[Detailed description of the invention] The present invention relates to an insert molding method, and its purpose is to embed a thin plate to be inserted in a predetermined position without deforming it in order to improve heat dissipation, heat resistance, etc. The purpose of the present invention is to provide an insert molding method that can be used for insert molding.

電気かみそりのような小物家電商品は、小型、
薄型化のために制御回路や充電回路等の電子回路
やモータ等を高密度で実装しているが、電子回路
やモータ等の内部発熱により合成樹脂材でできた
ハウジング内の温度が高くなり、放熱性が低いと
個々の電子部品の信頼性が低下するとともに、手
でふれるハウジングの表面温度が部分的に高くな
り使用者に不安感を与えたり、ハウジングが変形
したり、変色するという問題が生じた。
Small household appliances such as electric razors are small,
Electronic circuits such as control circuits and charging circuits, motors, etc. are mounted with high density in order to make the product thinner, but internal heat generation from the electronic circuits, motors, etc. increases the temperature inside the housing made of synthetic resin. Poor heat dissipation reduces the reliability of individual electronic components, and also causes problems such as the surface temperature of the housing that is touched by hands becoming high in some areas, giving the user a sense of anxiety, and causing the housing to deform or discolor. occured.

このような問題を解決する方法として、第8図
に示すように2分割のハウジングアの内面にアル
ミニウムのような熱伝導材よりなる薄板イを載置
して放熱効果を高めるとともに、薄板イと導電部
(図示せず)との間にプレスボードのような絶縁
板ウを挾み込む方法があるが、ハウジングアの内
面にはモータ(図示せず)、電池(図示せず)、充
電部を固定するためのリブエが突出しており、薄
板イや絶縁板ウにはこれらのリブエを避けるため
の切欠オを設ける必要があり、放熱面積が小さく
なつて熱の放散が悪くなるという問題があり、更
には、ハウジングアの内面に薄板イや絶縁板ウを
取着するには接着剤を用いて貼着するが、形状の
複雑な薄板イや絶縁板ウを全面に亘つて完全に貼
着することは困難であり、放熱にばらつきが生じ
るという問題があつた。
As a way to solve this problem, as shown in Figure 8, a thin plate made of a thermally conductive material such as aluminum is placed on the inner surface of the two-part housing to increase the heat dissipation effect. There is a method of inserting an insulating board such as pressboard between the conductive part (not shown), but the inner surface of the housing has a motor (not shown), a battery (not shown), and a charging part. There are protruding ribs for fixing the parts, and it is necessary to provide cutouts in the thin plate A and insulating board C to avoid these ribs, which causes the problem that the heat dissipation area becomes smaller and the heat dissipation becomes worse. Furthermore, adhesive is used to attach the thin plate A and the insulating plate C to the inner surface of the housing, but it is difficult to completely adhere the thin plate A and the insulating plate C, which have complex shapes, over the entire surface. It was difficult to do so, and there was a problem that heat dissipation varied.

本発明は上述の問題点に鑑みてなされたもので
あり、以下本発明の実施例を示す図面を参照して
説明する。第1図及び第2図において、ハウジン
グ1は2分割に形成されており、該ハウジング1
の内部にはモータ2、電池3、及び充電部4が収
容されており、該モータ2により駆動される内刃
5に摺接する外刃6が着脱自在に設けられてい
る。ハウジング1には複数の小孔7を有するアル
ミニウムのような熱伝導材よりなる薄板8がモー
タ2や電池3や充電部4の収納位置の略全体に埋
設されている。ハウジング1は内面層を形成する
電気絶縁性を有した第1の合成樹脂材1aと、薄
板8と、外面層を形成する第2の合成樹脂材1b
とで3層構造に形成されている。充電部4はプリ
ント配線板9と該プリント配線板9に実装される
電子部品10とで構成されており、ハウジング1
の内壁で支持されている。スイツチハンドル11
は一方のハウジング1に摺動自在に配設されてお
り、該スイツチハンドル11を操作することによ
り、モータ2に電池3からの電気を供給してモー
タ2を回転駆動させるのである。
The present invention has been made in view of the above-mentioned problems, and will be described below with reference to the drawings showing embodiments of the present invention. In FIGS. 1 and 2, the housing 1 is formed into two parts.
A motor 2, a battery 3, and a charging section 4 are housed inside, and an outer cutter 6 that slides in contact with an inner cutter 5 driven by the motor 2 is detachably provided. In the housing 1, a thin plate 8 made of a thermally conductive material such as aluminum and having a plurality of small holes 7 is embedded in substantially the entire housing position of the motor 2, battery 3, and charging section 4. The housing 1 includes a first synthetic resin material 1a having electrical insulation properties forming an inner surface layer, a thin plate 8, and a second synthetic resin material 1b forming an outer surface layer.
It is formed into a three-layer structure. The charging section 4 is composed of a printed wiring board 9 and an electronic component 10 mounted on the printed wiring board 9.
supported by the inner wall of switch handle 11
is slidably disposed in one housing 1, and by operating the switch handle 11, electricity from the battery 3 is supplied to the motor 2 to rotate the motor 2.

以下、ハウジング1の製造方法について第3図
乃至第7図に基づいて述べる。第4図において、
キヤビテイ12は可動金型13と、固定金型14
とで構成されている。。可動金型13にはキヤビ
テイ12内に突出自在なピン15が複数本設けら
れている。ピン15は突出状態で拘束することが
可能で可動金型13内に収納されており、薄板8
に当接した位置で係止される。ピン15の先端に
は周方向に突出する凸部18が8カ所等間隔に設
けられており、凸部18の底部16を結んだ仮想
線aの直径は小孔7の直径と同一となつている。
また、凸部18間の凹部17の長さl1は薄板8と
可動金型13との距離l2と等しく形成されてい
る。固定金型14のキヤビテイ12面にはピン1
5と対向する位置に小孔7を配列し、かつ表面に
接着剤が塗布された薄板8が載置され、キヤビテ
イ12内に突出されたピン15の端面が全ての小
孔7を閉塞するとともにピン15を拘束してピン
15の端面と固定金型14のキヤビテイ12面と
の間に薄板8が保持されている。この状態でキヤ
ビテイ12内に絶縁材でできた第1の合成樹脂材
1aを溶融させて注入するのであるが、薄板8は
小孔7の周縁がピン15の凸部18で固定されて
いるので第1の合成樹脂材1aの射出流により移
動することなく、第5図に示すように、第1の合
成樹脂材1aで薄板8の片面がモールドされ一体
的に同時成形されるのである。このとき、ピン1
5の凹部17が位置している小孔7の周縁は第1
の合成樹脂材1aによりモールドされ、、第1の
合成樹脂材1aで薄板8の小孔7の周縁が保持さ
れている。次に、型開きした後、ピン15の端部
に硬化した第1の合成樹脂材1aを取着したまま
で別の固定金型19に取り替えて第6図に示す大
きな容積のキヤビテイ20を形成し、該キヤビテ
イ20内に第2の合成樹脂材1bを溶融させて注
入する。このとき、ピン15の拘束状態を開放す
れば、樹脂圧によりピン15は可動金型13内に
収納されてキヤビテイ20面とピン15の端面と
が面一になつた状態で係止され、第2の合成樹脂
材1bは第7図に示すように全ての小孔7に充填
されるとともに薄板8の他面をモールドし、薄板
8は第1の合成樹脂材1a、及び第2の合成樹脂
材1bにより完全に包み込まれる。
Hereinafter, a method for manufacturing the housing 1 will be described based on FIGS. 3 to 7. In Figure 4,
The cavity 12 has a movable mold 13 and a fixed mold 14.
It is made up of. . The movable mold 13 is provided with a plurality of pins 15 that can freely protrude into the cavity 12. The pin 15 can be restrained in a protruding state and is housed in the movable mold 13.
It is locked at the position where it touches. At the tip of the pin 15, eight protrusions 18 protruding in the circumferential direction are provided at equal intervals, and the diameter of an imaginary line a connecting the bottoms 16 of the protrusions 18 is the same as the diameter of the small hole 7. There is.
Further, the length l 1 of the recessed part 17 between the convex parts 18 is formed to be equal to the distance l 2 between the thin plate 8 and the movable mold 13. There is a pin 1 on the 12th side of the cavity of the fixed mold 14.
A thin plate 8 with small holes 7 arranged in a position facing the holes 5 and coated with adhesive on the surface is placed, and the end face of the pin 15 protruding into the cavity 12 closes all the small holes 7. A thin plate 8 is held between the end surface of the pin 15 and the cavity 12 surface of the fixed mold 14 by restraining the pin 15. In this state, the first synthetic resin material 1a made of an insulating material is melted and injected into the cavity 12; As shown in FIG. 5, one side of the thin plate 8 is molded and integrally molded with the first synthetic resin material 1a without being moved by the injection flow of the first synthetic resin material 1a. At this time, pin 1
The circumference of the small hole 7 where the recess 17 of No. 5 is located is the first
The peripheral edge of the small hole 7 of the thin plate 8 is held by the first synthetic resin material 1a. Next, after opening the mold, the hardened first synthetic resin material 1a remains attached to the end of the pin 15 and is replaced with another fixed mold 19 to form a cavity 20 with a large volume as shown in FIG. Then, the second synthetic resin material 1b is melted and injected into the cavity 20. At this time, if the restraint state of the pin 15 is released, the pin 15 is housed in the movable mold 13 by the resin pressure and is locked in a state where the cavity 20 surface and the end surface of the pin 15 are flush with each other. The second synthetic resin material 1b fills all the small holes 7 and molds the other side of the thin plate 8, as shown in FIG. It is completely enveloped by the material 1b.

このようにしたものは、薄板8が第1の合成樹
脂材1aと第2の合成樹脂材1bによつて完全に
包み込むことができるので第1の合成樹脂材1a
と第2の合成樹脂材1bと薄板8との機械的結合
力を大きくすることができる上に薄板8に塗布し
た接着剤による結合力によつても強固に結合され
ハウジングの強度向上をはかることができ薄肉の
ものにすることができるのであり、更に、内面層
となる第1の合成樹脂材1aに弾力性を有する合
成樹脂材料を用いることによりハウジング1内に
収納するモータ2、電池3、及び充電部4等の緩
衝効果を持たせたり、吸音、防振材を使用するこ
とによりモータ2及び内刃5の駆動時の雑音や振
動を吸収させることもできるのである。
In this case, since the thin plate 8 can be completely wrapped by the first synthetic resin material 1a and the second synthetic resin material 1b, the first synthetic resin material 1a
The mechanical bonding force between the second synthetic resin material 1b and the thin plate 8 can be increased, and the bonding force of the adhesive applied to the thin plate 8 can also firmly bond the housing, thereby improving the strength of the housing. Furthermore, by using a synthetic resin material having elasticity for the first synthetic resin material 1a serving as the inner surface layer, the motor 2, battery 3, and It is also possible to absorb noise and vibration when the motor 2 and the inner cutter 5 are driven by providing a buffering effect to the charging part 4 and the like, and by using sound absorbing and vibration isolating materials.

以上説明したように、本発明によれば、熱伝導
材からなる薄板の片面から予め注入する第1の合
成樹脂材と該薄板の他面から注入する第2の合成
樹脂材で該薄板を埋設して成るインサート成形法
において、前記薄板に小孔を形成するとともに、
ピンの先端に周方向に突出する凸部を複数個形成
し、前記ピンの凸部で前記薄板の小孔の周縁を支
持して第1の合成樹脂材を注入し薄板の片面をモ
ールドした後、第2の合成樹脂材を注入して前記
小孔内に充填するとともに前記薄板の他面をモー
ルドしたので、ハウジング1の組立てと同時に放
熱板や耐熱板を装着することができ組込みが簡単
となり、従来のように放熱面積がリブのために小
さくなることがなくて放熱効果が大きくなるの
で、電子回路やモータ等の内部発熱によつて個々
の電子部品の信頼性が低下したりユーザーに不安
感を与えることがないという効果があり、また、
複雑な形状の金属板や絶縁板を接着する必要がな
くて放熱効果が均一となり、製品による放熱のば
らつきがなくなるという効果があり、更に、第1
の合成樹脂材の注入時にはピンの凸部で薄板の小
孔周縁を支持しているので、第1の合成樹脂材の
注入圧力により薄板が所定の位置からずれないよ
うになるとともに、ピンの凹部に注入された第1
の合成樹脂材で薄板の小孔周縁を部分的に支持す
るようにしているので、第2の合成樹脂材の注入
圧力により薄板がピン側に変形して薄板が第1の
合成樹脂材から剥離したり、合成樹脂材の表面と
薄板との間隔が不均一になるようなことはなく放
熱効果を均一にすることができるという効果があ
る。
As explained above, according to the present invention, a thin plate made of a thermally conductive material is embedded with a first synthetic resin material injected in advance from one side of the thin plate and a second synthetic resin material injected from the other side of the thin plate. In the insert molding method, a small hole is formed in the thin plate, and
After forming a plurality of convex portions protruding in the circumferential direction at the tip of the pin, supporting the periphery of the small hole in the thin plate with the convex portion of the pin, and injecting a first synthetic resin material and molding one side of the thin plate. Since the second synthetic resin material is injected and filled into the small hole and the other surface of the thin plate is molded, the heat sink and heat resistant plate can be attached at the same time as the housing 1 is assembled, making assembly easy. , the heat dissipation area is not reduced due to the ribs as in the past, and the heat dissipation effect is increased, so internal heat generation in electronic circuits, motors, etc. reduces the reliability of individual electronic components and creates concerns for users. It has the effect of not giving any impression, and
There is no need to bond complicatedly shaped metal plates or insulating plates, and the heat dissipation effect is uniform, eliminating variations in heat dissipation depending on the product.
When the synthetic resin material is injected, the convex part of the pin supports the periphery of the small hole in the thin plate, so the injection pressure of the first synthetic resin material prevents the thin plate from shifting from the predetermined position, and the concave part of the pin The first injected into
Since the periphery of the small hole in the thin plate is partially supported by the synthetic resin material, the injection pressure of the second synthetic resin material deforms the thin plate toward the pin, causing the thin plate to separate from the first synthetic resin material. Also, the spacing between the surface of the synthetic resin material and the thin plate does not become uneven, and the heat dissipation effect can be made uniform.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のインサート成形法で形成した
ハウジングを備えた電気かみそりの正面図、第2
図は同上の断面図、第3図はピンの形状を示すキ
ヤビテイの平面図、第4図、乃至第7図は第3図
のX−Xを断面してハウジングの製造方法を示す
断面図、第8図は従来例を示す分解斜視図であ
る。 1a……第1の合成樹脂材、1b……第2の合
成樹脂材、7……小孔、8……薄板、15……ピ
ン、18……凸部。
FIG. 1 is a front view of an electric shaver equipped with a housing formed by the insert molding method of the present invention, and FIG.
The figure is a sectional view of the same as above, FIG. 3 is a plan view of the cavity showing the shape of the pin, FIGS. 4 to 7 are sectional views taken along line X-X in FIG. FIG. 8 is an exploded perspective view showing a conventional example. 1a...First synthetic resin material, 1b...Second synthetic resin material, 7...Small hole, 8...Thin plate, 15...Pin, 18...Convex portion.

Claims (1)

【特許請求の範囲】[Claims] 1 熱伝導材からなる薄板の片面から予め注入す
る第1の合成樹脂材と該薄板の他面から注入する
第2の合成樹脂材で該薄板を埋設して成るインサ
ート成形法において、前記薄板に小孔を形成する
とともに、ピンの先端に周方向に突出する凸部を
複数個形成し、前記ピンの凸部で前記薄板の小孔
の周縁を支持して第1の合成樹脂材を注入し薄板
の片面をモールドした後、第2の合成樹脂材を注
入して前記小孔内に充填するとともに前記薄板の
他面をモールドしたことを特徴とするインサート
成形法。
1 In an insert molding method in which a thin plate made of a thermally conductive material is embedded with a first synthetic resin material injected in advance from one side of the thin plate and a second synthetic resin material injected from the other side of the thin plate, the thin plate is A small hole is formed, and a plurality of protrusions protruding in the circumferential direction are formed at the tip of the pin, and the first synthetic resin material is injected with the protrusions of the pin supporting the periphery of the small hole of the thin plate. An insert molding method characterized in that after one side of the thin plate is molded, a second synthetic resin material is injected to fill the small holes and the other side of the thin plate is molded.
JP3128882A 1982-02-26 1982-02-26 Insert molding method Granted JPS58147330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3128882A JPS58147330A (en) 1982-02-26 1982-02-26 Insert molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3128882A JPS58147330A (en) 1982-02-26 1982-02-26 Insert molding method

Publications (2)

Publication Number Publication Date
JPS58147330A JPS58147330A (en) 1983-09-02
JPS6153936B2 true JPS6153936B2 (en) 1986-11-20

Family

ID=12327114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3128882A Granted JPS58147330A (en) 1982-02-26 1982-02-26 Insert molding method

Country Status (1)

Country Link
JP (1) JPS58147330A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4301444C2 (en) * 1993-01-20 1995-08-31 Pelz Ernst Empe Werke Method for producing a lining part and in particular a lining part produced according to it
GB0014495D0 (en) * 2000-06-15 2000-08-09 Smithkline Beecham Gmbh & Co Process

Also Published As

Publication number Publication date
JPS58147330A (en) 1983-09-02

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