JPS6153935U - - Google Patents
Info
- Publication number
- JPS6153935U JPS6153935U JP13891684U JP13891684U JPS6153935U JP S6153935 U JPS6153935 U JP S6153935U JP 13891684 U JP13891684 U JP 13891684U JP 13891684 U JP13891684 U JP 13891684U JP S6153935 U JPS6153935 U JP S6153935U
- Authority
- JP
- Japan
- Prior art keywords
- board
- microwave
- integrated circuit
- gold
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984138916U JPH0351900Y2 (https=) | 1984-09-13 | 1984-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984138916U JPH0351900Y2 (https=) | 1984-09-13 | 1984-09-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153935U true JPS6153935U (https=) | 1986-04-11 |
| JPH0351900Y2 JPH0351900Y2 (https=) | 1991-11-08 |
Family
ID=30697307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984138916U Expired JPH0351900Y2 (https=) | 1984-09-13 | 1984-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351900Y2 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6428634U (https=) * | 1987-08-13 | 1989-02-20 |
-
1984
- 1984-09-13 JP JP1984138916U patent/JPH0351900Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6428634U (https=) * | 1987-08-13 | 1989-02-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351900Y2 (https=) | 1991-11-08 |