JPS6153934U - - Google Patents
Info
- Publication number
- JPS6153934U JPS6153934U JP1984137689U JP13768984U JPS6153934U JP S6153934 U JPS6153934 U JP S6153934U JP 1984137689 U JP1984137689 U JP 1984137689U JP 13768984 U JP13768984 U JP 13768984U JP S6153934 U JPS6153934 U JP S6153934U
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- solder bump
- bump electrodes
- wiring
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/11013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the bump connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984137689U JPS6153934U (un) | 1984-09-11 | 1984-09-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984137689U JPS6153934U (un) | 1984-09-11 | 1984-09-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6153934U true JPS6153934U (un) | 1986-04-11 |
Family
ID=30696100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984137689U Pending JPS6153934U (un) | 1984-09-11 | 1984-09-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6153934U (un) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6359376U (un) * | 1986-10-07 | 1988-04-20 | ||
JP2010010611A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | プリント回路板及び電子機器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846866A (un) * | 1971-10-12 | 1973-07-04 | ||
JPS4983860A (un) * | 1972-12-22 | 1974-08-12 | ||
JPS49113163A (un) * | 1973-02-14 | 1974-10-29 |
-
1984
- 1984-09-11 JP JP1984137689U patent/JPS6153934U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4846866A (un) * | 1971-10-12 | 1973-07-04 | ||
JPS4983860A (un) * | 1972-12-22 | 1974-08-12 | ||
JPS49113163A (un) * | 1973-02-14 | 1974-10-29 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6359376U (un) * | 1986-10-07 | 1988-04-20 | ||
JP2010010611A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | プリント回路板及び電子機器 |