JPS6153359A - Light-transmitting resin composition - Google Patents

Abstract

PURPOSE:To obtain a light-transmitting resin composition having adjustable thermal expansion coefficient, by compounding a dimethylsiloxane resin with a metal oxide such as silica, alumina, etc. having an average particle size falling within a specific range. CONSTITUTION:(A) A varnish composed of a dimethylsiloxane resin is compounded with (B) one or more kinds of metal oxides selected from silica, alumina, MgO, BeO, Y2O3, ZrO2 and ZnO and having an average particle diameter of 0.001-0.1mum. The mixture is kneaded with a roller, dried e.g. at 100-105 deg.C for 5min, and formed to a desired form e.g. by compression molding, or integrated with another material having a specific thermal expansion coefficient. The amount of the component B is selected according to the desired thermal expansion coefficient.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a light-transmitting resin composition whose thermal expansion coefficient can be adjusted.

[Conventional technology]

In some types of semiconductor devices, such as EPROMs and optically coupled semi-solid devices, a case or covering made of a resin composition with a relatively low coefficient of thermal expansion containing a filler may be made of a different substance that has a light transmitting function. For example, inorganic glass or silicone resin alone may be used in an integrated manner. In this case, the fact that the coefficient of thermal expansion of the latter is different from that of the former causes mechanical or electrical reliability to deteriorate during use or due to heating.

Therefore, it has conventionally been possible to reduce the coefficient of thermal expansion of an organic polymer by adding inorganic particles with an average particle size of 1 μm or more to the organic polymer instead of the above-mentioned inorganic glass or silicone resin alone. Attempted.

[Problem that the invention seeks to solve]

In general, the organic polymer substances conventionally used as described above, that is, resins, contain aromatic, carboxyl, carbonyl,
If the resin contains heavy bonds, low-molecular ionic impurities, etc., it becomes impermeable to short wavelengths, particularly ultraviolet rays, used in semiconductor devices, and the number of resins available for this resin is extremely limited. In addition, the coefficient of thermal expansion of a resin alone is as large as I x 10'/°C, but in order to lower the coefficient of thermal expansion of a resin, which is generally done, it is necessary to improve the mechanical properties. However, when inorganic particles having an average particle size of 1 μm or more are added to a resin, there is a problem that the composition becomes transparent to light by 4 μm.

The present invention was made to solve these problems, and aims to provide a resin composition that has a light transmitting function and whose coefficient of thermal expansion can be adjusted.

c. Means for Solving Problems] The light-transmitting resin composition of the present invention contains dimethylsiloxane resin and metal oxides such as silica, alumina, MgO, and BeO having an average particle size of 0.001 to 0.1 μm. ,Y2O3,
1. containing at least one of ZrO2* and ZmO; Ru. .

[Problem... - Effect of means for solving] This invention
゛The dimethylsiloxane resin involved is light transparent.
, the average particle size according to this invention is 0.001 to 0.1. un
Silica, alumina, MgO, Boo
%Y20 ZrO2 and ZmO have a small coefficient of thermal expansion and are effective for light transmission), and their small particle diameters can reduce diffused reflection due to refraction. Therefore, at least one type of white metal oxide is added to dimethylsiloxane resin in 1. By doing so, it is possible to adjust the electrothermal expansion coefficient without impairing the optical transparency of the resin.

〔Example〕

Silica, alumina, MgO1Beo according to this invention
The average particle size of the metal oxides of , Y2O3, ZrO2 and ZmO should be in the range of U,OU1-0.1 μm. If it is 0.1 μm or more, it becomes opaque to light;
001 μm or less, the presence of porous substances increases rapidly,
This is not preferable because the light transmittance deteriorates. Among the metal oxides mentioned above, regarding silica, the commercially available product name is Aeroai.
1, Valron, Cub-0-sil, etc. are used, and other metal oxides can be easily obtained, for example, by a method of creating particles through two processes of nucleation and growth from corresponding ions or atoms. .

The dimethylsiloxane resin according to the present invention is a resin that is transparent to ultraviolet light on the short wavelength side (0.4 μm or less). In addition to dimethylsiloxane resins, polyvinylidene fluoride (PVE"2) and poly-4-methylpentene are also light-transparent resins on the short and long sides, but they all have the above metal oxidation properties. It is undesirable because it has poor compatibility with objects.

Next, an example of a method for producing the light-transmitting resin composition of the present invention using the dimethylsiloxane resin and the metal oxide described above is shown below. That is, dimethyl siloxa; average content r'% 0.001'' 0.1 pm for varnish (viscosity: about 100 centimeters, solvent: luene, solid content: 5056) (I) Silica, alumina, S, gO, BeO, Y2 in the range of
If any one of O3, ZrO2, and ZmO (■) is deficient, a mixture of these (■) is mixed in an appropriate amount according to the predetermined coefficient of thermal expansion, and after kneading with a roller, the kneaded product (t ,)of,
For example, dry at 100 to 105°C for 5 minutes. To λ,
The dried mixture (ff) is molded into a desired shape by compression molding using a conventional molding method, for example λ, or integrally molded with a mating member having a predetermined coefficient of thermal expansion.

Hereinafter, the present invention will be concretely explained with reference to examples, but the present invention is not limited to these examples.

Example 1゜Silicone varnish (K R-220, mm silicone) 1
400 parts by weight of Aerosil (Japan Aerosil) were added to 00 parts by weight and kneaded with a roller. The kneaded product is heated and dried in an open air at 100 to 105°C for 5 minutes. Next, the dried mixture was put into a hot press,
Press cure was performed at 80° C. for 1 hour under a pressure of 100 kg/cal to produce a molded plate with a thickness of 1 mm. The ultraviolet (wavelength, 0.25 μm) transmittance of the molded plate is 50% or more, and its thermal expansion coefficient & is 2×10−″117°C.

Example 2 A ZrO2 ultrafine powder containing Y2O3 solid solution having a particle size of 0.02 μm is obtained from a mixed solution of Zroc12 and Yc13 by neutralization or hydrolysis using a conventional method. 100 parts by weight of the above inorganic particles were added to 100 parts by weight of dimethyl silicone resin (KE-1o6, Shin-Etsu Silicon), and kneaded with a roller. The kneaded material was heated to 10K using a hot press.
g, B - Under pressure at 80°C for 5 hours, then at 120°C
, and cured for 3 hours to produce a molded plate having a thickness of l+w.

The ultraviolet (wavelength, 0.30 μm) transmittance of the molded plate is 5
0 cm or more, and its thermal expansion coefficient is 5X10-5/"C
It is.

Example 3゜To 100 parts by weight of the silicone varnish of Example 1, an average particle size of 0 was added.
．． 200 parts by weight of 1 μm alumina abrasive powder was added to prepare a molded plate with a thickness of 1 fl according to the method of Example 1. The molded plate has a transmittance of short wavelength light a, <wavelength, 0.40 μm) of 50% or more, and its thermal expansion coefficient is 3xl□-s/
It is ℃.

From the above, while the coefficient of thermal expansion of polydimethylsiloxane resin is 30 Xi O-5 to 80X10-5/''C, the light-transmitting resin composition of the present invention has a polydimethylsiloxane resin containing the above-mentioned metal. It can be seen that by appropriately adding an oxide, the material has light transmittance in a wide wavelength range up to the short wavelength side, and the coefficient of thermal expansion can be adjusted to be lowered to a predetermined value.

Incidentally, the light-transmitting resin composition of the present invention is used, for example, in connection with semiconductor devices, but it can also be used for molding members with complex shapes that require one light-transmitting property and a low coefficient of thermal expansion. Moreover, it is not only used for integrating with a material having a relatively low coefficient of thermal expansion, but also can be used alone.

〔Effect of the invention〕

As explained above, this invention uses dimethylsiloxane resin and metal oxides such as silica, alumina, MgO□, BeO
, Y2O3, ZrO2 and ZmO, it is possible to obtain a light-transmitting resin composition whose thermal expansion coefficient can be adjusted.

Claims (1)

[Claims] Dimethylsiloxane resin and an average particle size of 0.001 to 0.
Silica, alumina, MgO, which are 1 μm metal oxides,
A light-transmitting resin composition containing at least one of BeO, Y_2O_3, ZrO_2 and ZmO.