JPS6152563B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite component formed by integrating a positive temperature coefficient thermistor and a variable resistor.

Conventionally, in a speaker circuit or the like as shown in FIG. 1, a positive temperature coefficient thermistor and a variable resistor have been constructed as separate components and used by electrically connecting them. In this case, the positive temperature coefficient thermistor is made to function as an overcurrent protection element. However, in a device that uses a positive temperature coefficient thermistor and a variable resistor as separate parts, if an excessive current flows into the variable resistor, the positive coefficient thermistor can protect it, but the variable resistor It was not possible to detect and protect against overheating (heat generation) of the resistor. For example, even if a variable resistor becomes overheated due to an amplifier failure, this protection cannot be provided by a positive temperature coefficient thermistor, and in reality, a fuse, thermostat, etc. must be used in combination, which significantly increases component costs. I was getting used to it. Furthermore, in the past, attempts were made to have the positive temperature coefficient thermistor protect the variable resistor from overheating by bringing the two close together or in contact with each other to thermally couple them, but this would not only result in an extremely complicated structure, but also However, the bonding condition was not very good, and it was still necessary to use a thermostat or the like. In addition, when a fuse is used together, once the fuse is activated, there is no return property, so that handling such as replacement is complicated. Furthermore, when a thermostat is used in conjunction with the thermostat, there are problems such as lack of reliability and generation of noise due to the presence of contacts.

The present invention has been made in view of the above points, and uses a positive temperature coefficient semiconductor substrate provided with at least one pair of ohmic electrodes to form a positive temperature coefficient thermistor as a substrate for a variable resistor. It is an object of the present invention to provide a composite component characterized in that a variable resistor is integrally constructed with a variable resistor.

Embodiments of the composite part of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a plan view showing an example, and FIG. 3 is a cross-sectional view taken along the line AA.

In the figure, reference numeral 1 denotes a positive characteristic semiconductor substrate made of barium titanate or the like, and a through hole 2 for rotatably fixing a rotor shaft, which will be described later, is provided approximately in the center of this substrate 1. . 3,3'
are ohmic electrodes provided on one end plane of this substrate 1, and are superposed on each other with the substrate 1 in between. These two electrodes 3, 3' constitute a positive temperature coefficient thermistor. Both electrodes 3, 3'
is formed into a roughly fan shape, and the through hole 2
It is given even to the periphery of. 4 is a resistor provided in an arc shape around the periphery of the through hole 2 on one plane of the substrate 1 so as not to be connected to the ohmic electrode 3; 5 and 5' are connected to both ends of the resistor 4; These are first and second extraction electrodes that are electrically connected and provided so as to lead out the resistor 4 to the end of the substrate 1. In this case, the extraction electrodes 5, 5'
Of course, the resistor 4 must be in non-ohmic contact with the substrate 1.
Reference numeral 6 designates a third lead-out electrode formed by applying the ohmic electrode 3' provided on the other plane of the substrate 1 so as to extend it to the end. It goes without saying that this extraction electrode 6 must also be in non-ohmic contact. This extraction electrode 6 is located between the extraction electrodes 5 and 5'. 7,
7' is a terminal connected and fixed to the extraction electrodes 5, 5', respectively; 8 is a terminal connected and fixed to the extraction electrode 6; for example, the extraction electrodes 5, 5', 6 at the end of the substrate 1; A small hole 9 provided at the position of
A portion is inserted through and fixed to 9' and 10, and bonded with solder S. Reference numeral 11 denotes a rotor shaft having a flange 12 near the center, one end of which is connected to the through hole 2 of the substrate 1.
A fixing ring 13 is fitted to the protruding base of the base plate 1, and the fixing ring 13 and the flange 12 rotatably fix the base plate 1 to the substrate 1. The protrusion of the rotor shaft 11 is further provided with a protrusion 11' having a smaller diameter, and a slider 14 that slides on the resistor 4 on the substrate 1 is fitted into this protrusion 11'. It is configured to slide on the resistor 4 in accordance with the rotation of the rotor shaft 11. In this case, the slider 14 is configured not only to contact the resistor 4 but also to contact the ohmic electrode 3 led out from the periphery of the through hole 2 . Furthermore, the third
In the figure, the left side of the flange 12 of the rotor shaft 11 is drawn long because the rotor shaft 11 is rotated beyond a certain level by the piece 8' protruding downward from the tip of the terminal 8 of the extraction electrode 6. Indicates that a locking part is provided to prevent the locking from occurring.

In the composite component configured in this way, the positive temperature coefficient thermistor is connected between the slider 14 and the terminal 8, and the positive coefficient thermistor and the variable resistor are integrated. Note that in the above structure, the slider 14 connects the resistor 4 and the ohmic electrode 3.
However, if another terminal (not shown) is connected to the ohmic electrode 3 by soldering or the like and pulled out, the slider 14 only needs to be brought into contact with the resistor 4. It is something. However, even in this case, it goes without saying that it is necessary to electrically connect the slider 14 in some way (without interfering with the connection being made outside the board 1).

FIG. 4 shows another embodiment of the substrate used in the composite part of the present invention. An insulating layer 15 is provided on the substrate 1 to be applied.If this insulating layer 15 is provided, not only will the electrical insulation with the substrate 1 be more reliable, but there will be no problem even if it is ohmic. This makes it easier to select materials. Naturally, the same can be said of the extraction electrode 6 on the other surface of the substrate 1. The resistor 4 is connected to the positive characteristic semiconductor substrate 1
Since it is relatively difficult to make non-ohmic contact with the substrate, it is preferable to provide at least the insulating layer 15 in this portion. Furthermore, by applying the insulating layer 15, it is possible to use an ohmic electrode material as the extraction electrode, so it can be applied at the same time as the ohmic electrode for forming the positive temperature coefficient thermistor, which is convenient for production. Become.

Figures 5 and 6 show still another embodiment of the composite component of the present invention, in which the variable resistor is replaced with a sliding type instead of a rotating type as shown in the previous example. This is what I did. Figure 5 is a plan view, Figure 6
The figure is a cross-sectional view taken along line AA.

In both figures, 21 is a rectangular positive characteristic semiconductor substrate, and 22 and 22' are ohmic electrodes provided above both planes of this substrate 21 by overlapping each other with the substrate 21 in between. ′ constitutes a positive characteristic thermistor. 23 is the substrate 21
A resistor provided in an elongated shape below one plane of the ohmic electrode 22 so as not to be connected to the ohmic electrode 22;
Reference numerals 24 and 24' designate extraction electrodes which are electrically connected to both ends of the resistor 23.
This resistor 23 and extraction electrodes 24, 24' are
It is in non-ohmic contact with the substrate 21. Reference numeral 25 denotes an extraction electrode connected to a part of the ohmic electrode 22' provided on the other plane of the substrate 21, and provided so as to lead out to the lower end of the substrate 21. Electrode 25 must also be in non-ohmic contact. Terminals 26 and 26' are connected and fixed to the extraction electrodes 24 and 24', respectively, and terminals 27 are connected and fixed to the extraction electrode 25. For example, the extraction electrodes 24 and 24' at the lower end of the substrate 21, Small hole 2 provided at position 25
8, 28' and 29, a portion thereof is inserted and fixed, and is bonded with solder. Reference numeral 30 denotes an electrically insulating slider fitted across the upper and lower ends of the substrate 21, and on its inner wall is a contact 31 that abuts both one ohmic electrode 22 and the resistor 23. , 31' are bonded with adhesive 33, for example, and even if this slider 30 moves in the left-right direction, the contacts 31, 31' are always on the electrode 21 and the resistor 23. 31' are configured to be slid into abutment. Even a composite component configured in this manner has an equivalent circuit similar to the above-mentioned rotary type component. In this sliding embodiment,
The remaining points similar to those of the previous rotary embodiment will be omitted with reference to the explanation thereof.

Note that each drawing shows an embodiment of the present invention.
The present invention is not limited to these, and various design changes may be made without departing from the spirit of the present invention. For example, an ohmic electrode for forming a positive temperature coefficient thermistor is provided only on one surface of the substrate, and a resistor is provided on the other surface, so that the positive temperature coefficient thermistor and the variable resistor are separated on both planes of the substrate. It may be configured in such a state. Further, the shape of the substrate is completely arbitrary, and any shape that makes it easy to form a rotary or sliding variable resistor may be adopted. It is also optional to form the positive temperature coefficient thermistor and the variable resistor on the substrate so that they are structurally completely independent. That is, for example, a variable resistor is formed on one half of the substrate, and a positive temperature coefficient thermistor is formed spaced apart on the other half. Furthermore, the shape and structure of the slider, rotor shaft, etc. can be easily modified in various ways to match other shapes. Further, the slider may be fixed to the shaft not only by fitting or adhesion, but also by using other fixing tools. Furthermore, the shape and attachment means of each terminal attached to each extraction electrode are arbitrary, and may be provided as necessary.

As described above, the composite component of the present invention is characterized in that a positive temperature coefficient semiconductor substrate is used as a substrate for a variable resistor, and a variable resistor and a positive temperature coefficient thermistor are integrally configured on this board. In addition to quickly detecting the inflow of overcurrent into the variable resistor, abnormal overheating (heat generation) can also be quickly detected and controlled, providing excellent protection functions and preventing other protective components such as fuses and thermostats. It has a remarkable effect that there is no need to use it together. Furthermore, in the present invention, since the positive temperature coefficient thermistor and the variable resistor can be compactly configured on one board, it is possible not only to promote the miniaturization of the set, but also to eliminate the trouble of wiring, and to reduce the assembly cost. It also has the effect of being able to.

[Brief explanation of the drawing]

Fig. 1 is a general speaker circuit diagram, Fig. 2 is a plan view showing an embodiment of the composite component of the present invention, Fig. 3 is a sectional view taken along the line A--A of Fig. 2, and Fig. 4 is a diagram of the composite component of the present invention. 5 is a sectional view showing an example of the substrate used, FIG. 5 is a plan view showing another embodiment of the composite component of the present invention, and FIG. 6 is FIG. 5A.
-A cross-sectional view taken along line A. 1... Positive characteristic semiconductor substrate, 3, 3'... Ohmic electrode, 4... Resistor, 5, 5', 6... Extracting electrode, 7, 7', 8... Terminal, 11... Rotating shaft ,1
2...Flame portion, 13...Fixing ring, 14...Slider, 15...Insulating layer.

Claims (1)

[Scope of Claims] 1. A positive characteristic semiconductor substrate, first and second lead-out electrodes, a resistor whose both ends are conductively connected to the first and second lead-out electrodes, and which slides on the resistor. a pair of ohmic electrodes facing each other, one of which is conductively connected to the slider, and a third lead-out electrode that is conductively connected to the other of the pair of ohmic electrodes. Composite parts characterized by: