JPS6151747U - - Google Patents
Info
- Publication number
- JPS6151747U JPS6151747U JP1984135763U JP13576384U JPS6151747U JP S6151747 U JPS6151747 U JP S6151747U JP 1984135763 U JP1984135763 U JP 1984135763U JP 13576384 U JP13576384 U JP 13576384U JP S6151747 U JPS6151747 U JP S6151747U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- frame
- main surface
- thick film
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の実施例の厚膜混成集積回路を
示す平面図、第２図は第１図の厚膜混成集積回路
を示す断面図、第３図は従来の厚膜混成集積回路
を示す断面図である。 尚図において、１……半導体チツプ、２……電
極引き出しリード、３……コーテイング剤、４…
…導体パターン、５……保護ガラス、６……基板
、７……エポキシ樹脂の帯状わく、８……保護ガ
ラスの帯状わく。
示す平面図、第２図は第１図の厚膜混成集積回路
を示す断面図、第３図は従来の厚膜混成集積回路
を示す断面図である。 尚図において、１……半導体チツプ、２……電
極引き出しリード、３……コーテイング剤、４…
…導体パターン、５……保護ガラス、６……基板
、７……エポキシ樹脂の帯状わく、８……保護ガ
ラスの帯状わく。
Claims (1)
- 厚膜基板の主面上に半導体チツプが設けられ、
前記半導体チツプを覆うコーテイング剤の流出を
防止するように前記半導体チツプの周囲の前記主
面にわくが設けられ、前記わく外の前記主面に絶
縁性の保護膜が設けられた厚膜混成集積回路にお
いて、前記わくが前記保護膜と同様な材料からな
ることを特徴とする厚膜混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135763U JPS6151747U (ja) | 1984-09-07 | 1984-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135763U JPS6151747U (ja) | 1984-09-07 | 1984-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6151747U true JPS6151747U (ja) | 1986-04-07 |
Family
ID=30694246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984135763U Pending JPS6151747U (ja) | 1984-09-07 | 1984-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151747U (ja) |
-
1984
- 1984-09-07 JP JP1984135763U patent/JPS6151747U/ja active Pending