JPS6150393A - Method of soldering terminal board to circuit substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an improvement in a method for soldering electronic components to a circuit board via DIP soldering and for soldering a terminal board later attached to a circuit pattern side.

[Prior art]

The conventional method for soldering terminal members is to solder the electronic components through a DIP solder tank while masking the mounting portion of the component with masking tape in a preliminary circuit pattern, and then peeling off the masking tape. The terminal member was fixed to the mounting portion by soldering. This is DIP
In the soldering process, if solder adheres to the terminal member attachment part on the circuit pattern in advance, it will require a lot of man-hours to make a uniform setting to face the solder attachment part, and the following will occur: This is done as a measure against the problem of poor workability as there is a risk of short-circuiting as the part protrudes outside the part where the member is attached. and.

Normally, when configuring components to be mounted on a circuit board, it is not suitable to clean the entire circuit board at the same time after DIP soldering.When attaching electrolytic condenser/non-waterproof type electronic tape, the circuit pattern is designed to reduce the number of work steps. At the same time, masking tape is customarily used for these retrofitting parts and soldering is used as one of the work processes, so it requires man-hours to apply and remove masking tape during assembly, and is This is noticeable when masking a complicated part with a limited circuit pattern design space.

〔the purpose〕

The present invention is intended to eliminate the above-mentioned drawbacks, and aims to streamline the soldering work of circuit boards using DIP soldering, which has components that can be retrofitted, by reducing the time required for masking work, as well as rationalizing circuit pattern design. do.

〔composition〕

The present invention will be explained below with reference to an embodiment shown in FIGS. 1 and 2.

1 is a circuit board, 2 is a circuit pattern part, 3 is a retrofit,
18 t'l#M-Pi 40 (fE11te
iJ11 is a positioning hole with a protrusion of 5"'"880.The circuit pattern portion 2 has a positioning hole 5 of the terminal board 4 fitted into the positioning hole 3 of the circuit board 1, and the terminal board is soldered. is formed to have a predetermined gap from the outer shape of the portion 6.

Note that in order to prevent solder from adhering to the terminal board mounting portion and the space of the gap in the circuit pattern during DIP soldering, a known resist treatment may be performed.

Solder is already attached to the circuit pattern portion 2 by DIP soldering (not shown).

Next, the terminal plate 4 is inserted into the positioning hole 3 of the circuit board 1 as described above.
After positioning the circuit board ^- by fitting the positioning protrusion 5 to the terminal board 4, position the soldering iron so that it touches the soldering part 6 of the terminal board 4 and the circuit pattern part 2. By applying the soldering iron to the soldering iron, the heat from the soldering iron was transferred to both parts, and the solder on the circuit pattern part 2, which had already been soldered, melted and flowed out, and the gap between the soldering iron and the two parts became liquid. Due to capillary action of solder, the terminal board 4
When soldering, the solder reaches part 6. Furthermore, since the soldering part 6 is already sufficiently heated, the solder spreads over the entire soldering part 6 due to the surface tension of the solder. Half [B
By releasing the soldering iron with the solder spread over the entire mounting portion 6, the subsequent mounting of the terminal member 4 is completed.

In addition, during this work, the space of the soldering part and
Preliminary solder may be added to improve solder flow. Furthermore, experiments have shown that when soldering the terminal board 4, if the gap between the part 6 and the circuit pattern part 2 is within twice the thickness of the part 6, the solder viscosity 1 is sufficient. From this, it was confirmed that the circuit pattern portion 2 and the soldering portion 6 were firmly attached.

Also, as in the embodiment, the circuit pattern portion 2 is soldered to the portion 6.
This is an example in which a gap is provided around the entire circumference.
As in other embodiments shown in FIGS. 3 and 4, a portion of the circuit pattern portion 2 may be soldered to form the circuit pattern portion 2 having the protrusion 2b so as to overlap the portion 6. In this case, solder also adheres to the protrusions 2b of the circuit pattern portion 2 due to DIP soldering, and the terminal plate 4 is tilted with respect to the circuit board 1 with the terminal plate 4 positioned on the circuit board 1, but the solder on the protrusions 2b The amount is small, and when soldering is done later on, sometimes by applying the soldering iron to the protrusion 2b and the terminal board 4 to the part 6, the solder in the core part melts and melts.
There is no problem because the inclination is corrected, but on the other hand, when soldering the protrusion 2b, the heat of the soldering iron sometimes causes the soldering to occur at the part 6.
Since it also acts as a flow path pattern flowing out to the circuit board, there is no need to apply preliminary soldering.Moreover, depending on the dimensional accuracy of the circuit board, as in the above embodiment, soldering can be done in a circuit pattern that leaves gaps around the entire circumference. In the case of two parts, if the gap becomes larger than the predetermined gap due to relative positional scratches, it may be difficult to fix the two parts together with only the viscosity of the solder. Providing this has the effect of improving soldering reliability.

[Effects] As described above, according to the present invention, in the conventional method for soldering terminal boards that requires retrofitting after DIP soldering, assembly work can be streamlined by reducing man-hours such as pasting and peeling off masking tape. In addition, in circuit pattern design, pasting maskinog tape does not require designing with consideration to work etc., and can be applied to miniaturization, which is highly effective.

[Brief explanation of the drawing]

1 and 2 show an embodiment of the terminal board soldering method according to the present invention, in which FIG. 1 is a perspective view, FIG. 2 □ is a plan view of FIG. 1 viewed from above, and FIG. 4 shows another embodiment, FIG. 3 is a perspective view, and FIG. 4 is a plan view of FIG. 3 viewed from above. 1: Circuit board 2: Circuit pattern part 3: Positioning hole 4: Terminal board 5: Positioning protrusion 6: Soldering part

Claims (1)

[Claims] In a method for soldering a terminal plate that is attached later after soldering electronic components to a circuit board using DIP soldering, solder does not adhere to the mounting portion of the terminal plate that is attached later to the circuit pattern side of the board during the DIP soldering. Alternatively, a resist treatment or a circuit pattern is formed to prevent the solder from adhering to any part other than a certain part, and by melting the solder near the terminal part that has adhered with the DIP solder, the molten solder can be removed. A method of soldering a circuit board and a terminal board, characterized by soldering the terminal board to the circuit board using viscosity.