JPS6150369B2 - - Google Patents
Info
- Publication number
- JPS6150369B2 JPS6150369B2 JP4382679A JP4382679A JPS6150369B2 JP S6150369 B2 JPS6150369 B2 JP S6150369B2 JP 4382679 A JP4382679 A JP 4382679A JP 4382679 A JP4382679 A JP 4382679A JP S6150369 B2 JPS6150369 B2 JP S6150369B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- unsaturated polyester
- acid
- varnish
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002966 varnish Substances 0.000 claims description 16
- 239000011342 resin composition Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- YTZSSJWXTPZULE-UHFFFAOYSA-N chloroethene;lead Chemical compound [Pb].ClC=C YTZSSJWXTPZULE-UHFFFAOYSA-N 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 13
- 229920006337 unsaturated polyester resin Polymers 0.000 description 10
- 239000002253 acid Substances 0.000 description 8
- 229920006305 unsaturated polyester Polymers 0.000 description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- -1 acrylic ester Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical group CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- XQOAKYYZMDCSIA-UHFFFAOYSA-N O1OO1 Chemical group O1OO1 XQOAKYYZMDCSIA-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- CHIHQLCVLOXUJW-UHFFFAOYSA-N benzoic anhydride Chemical class C=1C=CC=CC=1C(=O)OC(=O)C1=CC=CC=C1 CHIHQLCVLOXUJW-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- FSRYENDEMMDKMT-UHFFFAOYSA-N butoxy ethaneperoxoate Chemical group CCCCOOOC(C)=O FSRYENDEMMDKMT-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- MIJRFWVFNKQQDK-UHFFFAOYSA-N furoin Chemical compound C=1C=COC=1C(O)C(=O)C1=CC=CO1 MIJRFWVFNKQQDK-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Insulating Of Coils (AREA)
Description
不飽和ポリエステル樹脂は、電気的、機械的、
熱的特性、作業性、価格等にバランスがとれてい
るため、FRP、積層板をはじめ多用途に使用さ
れているが、電気絶縁用としても特性、作業性、
価格的など全体的にバランスがとれているためコ
イル含浸用、注型用などに多く使用されている。
しかし、スチレンモノマを使用した不飽和ポリ
エステル樹脂を電源トランスおよび螢光灯安定器
のコイル含浸用、注型用として使用する場合、こ
れらの口出し線として使用している塩化ビニルリ
ード線(以下リード線と略す。)がスチレンモノ
マの影響を受けるため、とくに寒冷時(5〜−10
℃)に機械的ストレスによつて容易にクラツチを
発生する欠点を有していた。このクラツクの発生
原因としては、
(1) 樹脂の硬化皮膜が硬い場合、リード線を折り
曲げた際、まず、樹脂硬化皮膜にクラツクを生
じ、その点に機械的応力が集中する結果、容易
に折れる、
(2) スチレンモノマ等中にリード線を浸漬すると
リード線に含有されている可そ剤がスチレンモ
ノマ等に抽出され、その結果としてリード線自
体が硬くなり折れやすくなる、
(3) 樹脂を硬化する際、含浸用では通常100〜120
℃に温度を上げるため、スチレンモノマ等がリ
ード線を膨潤し、リード線内部に浸入し、その
結果として樹脂を加熱し硬化すると、リード線
が硬くなり折れやすくなる、
などが考えられている。
このリード線の折れを防止するためには、(1)に
ついては不飽和ポリエステル樹脂を可とう化す
る、(2)については反応性モノマにスチレン等を用
いない、また、(3)については硬化温度を下げるな
どの方法が一般的に採用されている。
(1)の不飽和ポリエステル樹脂を可とう化する方
法は、一般的には樹脂組成物を植物油で変性した
り酸成分、アルコール成分に可とう性のある原料
を使用することにより改善できる。しかし、反応
性モノマにスチレン等を用いた場合には、前述し
た(2),(3)の問題があり樹脂組成の変更だけでは十
分に満足する結果が得られない。
(2)の反応性モノマにスチレン等を使用しない不
飽和ポリエステル樹脂は、リード線の折れに対し
ては良好の結果が得られるが、硬化性が遅く価格
が高いなどの難点があるため、現在のところ一般
的には使用されていない。
一方、(3)の硬化温度を下げる方法については樹
脂を速硬化性にする必要があるため、その結果と
して樹脂のポツトライフが極端に短くなるため、
含浸用としては作業性が悪くなり、あまり得策で
ない。
そこで本発明者らは、種々検討の結果、従来の
スチレン等を使用した不飽和ポリエステル樹脂を
使用しても、冬場でも電気機器のリード線の折れ
を大幅に改善できる電気機器の製造法を見出し
た。
すなわち本発明は、電気機器の熱硬化性のワニ
スが含浸されリード線の折れのおそれのある個所
に低温硬化できる光硬化性樹脂組成物を塗布し光
照射して短時間に硬化させることにより、スチレ
ン等のリード線に対する悪影響を減少し、その
後、電気機器全体を熱硬化性ワニスに浸漬し、加
熱硬化させ、電気機器の絶縁処理の目的を達成す
るものである。
本発明は、塩化ビニルリード線の熱硬化性ワニ
スが含浸される個所に光硬化性樹脂組成物を塗布
し、光硬化させた後、熱硬化性ワニスの含浸処理
を行なう絶縁処理された電気機器の製造法に関す
る。
本発明において光硬化に使用する光としては、
光の波長範囲として、2000Å〜6000Åの紫外線が
使用でき、光源としては高圧水銀灯、超高圧水銀
灯、ケミカルランプ,アーク灯などが使用でき
る。光硬化の条件については特に制限はない。光
硬化性樹脂組成物の塗布は、吹きつけ、はけ塗
り、含浸等によつて行なわれる。本発明に使用す
る光硬化性樹脂組成物は不飽和ポリエステル、架
橋性単量体、光増感剤、必要に応じてラジカル重
合開始剤、硬化促進剤、重合禁止剤を含有する不
飽和ポリエステル樹脂組成物である。
さらに詳しく述べれば、不飽和ポリエステルは
酸成分とアルコール成分から、場合によつては酸
成分、アルコール成分、変性成分とから合成さ
れ、その製造法には制限がない。酸成分として
は、マレイン酸,無水マレイン酸,フマル酸,イ
タコン酸,シトラコン酸,エンドメチレンテトラ
ヒドロ無水フタル酸,メチルエンドメチレンテト
ラヒドロ無水フタル酸,テトラヒドロ無水フタル
酸等の不飽和酸,フタル酸,無水フタル酸,イソ
フタル酸,テレフタル酸,アジピン酸,安息香酸
等の反応性の不飽和結合を有しない酸酸,大豆
油,トール油,ヤシ油,ヒマシ油等から得られる
植物油脂肪酸およびこれらの誘導体などが用いら
れる。
アルコール成分としては、エチレングリコー
ル,プロピレングリコール,ジエチレングリコー
ル,ジプロピレングリコール,ブタンジオール,
ネオペンチルグリコール,グリセリン,トリメチ
ロールプロパン,ペンタエリスリトールなどが使
用される。
変性成分としては、ジシクロペンタジエン,シ
クロペンタジエン,これらの誘導体などが使用で
きる。
架橋性単量体としては、スチレンおよびその誘
導体,ジビニルベンゼン,アクリル酸エステル,
メタクリル酸エステルなどが用いられ特に制限は
ない。
光増感剤としては、ベンゾイン,ベンゾインエ
チルエーテル,ベンゾインイソプロピルエーテ
ル,ベンゾインフエニルエーテルなどのベンゾイ
ルエーテル類,ベンゾインチオエーテル類,ベン
ゾフエノン,アセトフエノン,2―エチルアント
ラキノンフロイン,ベンゾインエーテル―ミヒラ
―ケトン系,塩化デシルなど任意のものが使用で
る。
ラジカル重合開始剤としては、ベンゾイルパー
オキサイド,アセチルパーオキサイド等のアシル
パーオキサイド,ターシヤリブチルパーオキサイ
ド,キユメンヒドロパーオキサイド等のヒドロパ
ーオキサイド,メチルエチルケトンパーオキサイ
ド,シクロヘキサノンパーオキサイド等のケトン
パーオキサイド,ジターシヤリブチルパーオキサ
イド,ジクミルパーオキサイド等のアルキルパー
オキサイド,ターシヤリブチルパーオキシアセテ
ート等のオキシパーオキサイドなどが用いられ
る。
硬化促進剤としては、鉄,コバルト,鉛,マン
ガン,ニツケル,スズ,亜鉛等のナフテン酸塩,
オクテン酸塩などが用いられる。
重合禁止剤としては、ハイドロキノン,パラタ
ーシヤリブチルカテコール,ピロガロール等のキ
ノン類、その他一般に使用されるものが用いられ
る。また光硬化後含浸する熱硬化性ワニスとして
は、一般に使用されている溶剤形ワニス,不飽和
ポリエステルワニス,エポキシワニスなどが用い
られるが、特にスチレンモノマタイプの不飽和ポ
リエステルワニスの場合に本発明は、特に効果が
ある。
実施例及び比較例を示す。部とあるのは重量
部、%とあるのは重量%である。
不飽和ポリエステル樹脂Aの製造
無水マレイン酸98g(1モル)、無水フタル酸
75g(0.5モル)、大豆油脂肪酸282g(0.5モル)
およびプロピレングリコール167.2g(2.2モル)
を四つ口フラスコに仕込み、窒素ガス吹き込み下
に撹拌し、180℃に1時間保ち、210〜220℃で反
応を続け、酸価20.0の不飽和ポリエステルAを得
た。この不飽和ポリエステルA50部に対し、スチ
レン50部を撹拌混合し、この樹脂に対しハイドロ
キノン0.01%,ナフテン酸マンガン(金属量8
%)0.2%および過酸化ベンゾイル1%を加え混
合撹拌し、均一なワニス,不飽和ポリエステル樹
脂Aを得た。
ワニスBの作成
不飽和ポリエステル樹脂A100部とベンゾイン
エチルエーテル1部を混合撹拌しワニスBを得
た。
ワニスCの作成
前記不飽和ポリエステルA50部に対し、スチレ
ン50部、ハイドロキノン0.01部、ナフテン酸マン
ガン(金属分8%)0.2部、ベンゾインエチルエ
ーテル1部を混合撹拌し均一な溶液ワニスCを得
た。
比較例 1
第1図に示すリード線の低温屈曲性試験片(75
×150×0.8mmの鉄板2に日立電線株式会社製の
UL1015橙色、UL1007橙色の塩化ビニルリード線
1を20本、ポリエステルフイルム製粘着テープ4
(幅10mm,厚さ0.05mm)で固定し、リード線が鉄
板をはさむように折り曲げ、さらに、塩化ビニル
リード線が動かないように、ポリエステルフイル
ム製粘着テープにて固定する。)を用い、ワニス
A中に浸漬10分、予滴滴下5分、100℃、3時間
で硬化させた。クラツクの試験条件は、0℃の低
温槽に4時間放置後、直ちに、リード線を180度
の角度まで広げ、リード線に発生したクラツクの
発生数を確認した。その結果UL1015リード線は
15本、UL1007リード線は20本クラツクが生じ
た。
実施例 1
比較例1で用いた試験片をワニスB中に浸漬10
分、予滴滴下5分したあと実施例1と同様に高圧
水銀灯(松下電工株式会社製1KW,1灯式)を
用いて200mmの距離から第1図に示すように、ワ
ニスの浸漬部を紫外線照射したところ3分間でリ
ード線表面が硬化した。さらに、この試験片をワ
ニスA中に10分間浸漬、5分間予滴滴下後100℃
の乾燥器に180分放置し硬化させた。この試験片
を比較例1と同一条件で試験を行なつたところ、
UL1015リード線で0本、UL1007リード線で5本
がクラツクを発生した。
以上の比較例、実施例をまとめて表1に示す。
Unsaturated polyester resin has electrical, mechanical,
Due to its well-balanced thermal properties, workability, price, etc., it is used for a variety of purposes including FRP and laminates, but it is also used for electrical insulation due to its properties, workability, and cost.
It is generally well-balanced in terms of price, so it is often used for coil impregnation, casting, etc. However, when unsaturated polyester resin using styrene monomer is used for impregnating or casting coils of power transformers and fluorescent lamp ballasts, the vinyl chloride lead wires (hereinafter referred to as lead wires) used as lead wires are ) is affected by the styrene monomer, especially in cold weather (5 to -10
℃), it had the disadvantage of easily causing clutching due to mechanical stress. The causes of this crack are as follows: (1) If the cured resin film is hard, when the lead wire is bent, cracks first occur in the cured resin film, and as a result of mechanical stress concentrated at that point, it easily breaks. (2) When a lead wire is immersed in a styrene monomer, etc., the softening agent contained in the lead wire is extracted into the styrene monomer, etc., and as a result, the lead wire itself becomes hard and easily breaks. When curing, it is usually 100 to 120 for impregnation.
It is thought that by raising the temperature to ℃, the styrene monomer etc. swells the lead wire and penetrates into the inside of the lead wire, and as a result, when the resin is heated and hardened, the lead wire becomes hard and easily breaks. In order to prevent this lead wire from bending, (1) the unsaturated polyester resin should be made flexible, (2) should not use styrene or the like as a reactive monomer, and (3) should be cured. Methods such as lowering the temperature are commonly employed. The method (1) of making an unsaturated polyester resin flexible can generally be improved by modifying the resin composition with vegetable oil or using flexible raw materials for the acid component and alcohol component. However, when styrene or the like is used as the reactive monomer, problems (2) and (3) mentioned above arise, and satisfactorily results cannot be obtained simply by changing the resin composition. Unsaturated polyester resin (2), which does not use styrene or the like as a reactive monomer, can provide good results in preventing lead wire breakage, but has drawbacks such as slow curing and high cost. However, it is not commonly used. On the other hand, regarding method (3) of lowering the curing temperature, it is necessary to make the resin fast-curing, which results in an extremely short pot life of the resin.
It is not a good idea for impregnation because it has poor workability. As a result of various studies, the present inventors have discovered a method for manufacturing electrical equipment that can significantly reduce the risk of lead wires breaking even in winter, even when using conventional unsaturated polyester resins made from styrene, etc. Ta. That is, the present invention applies a photocurable resin composition that can be cured at low temperature to the parts of electrical equipment impregnated with thermosetting varnish and where there is a risk of bending of the lead wires, and then irradiates the composition with light to cure the composition in a short time. This method reduces the negative impact on lead wires such as styrene, and then immerses the entire electrical device in thermosetting varnish and heats it to harden, achieving the purpose of insulating the electrical device. The present invention provides electrical equipment that has been insulated, in which a photocurable resin composition is applied to a portion of a vinyl chloride lead wire to be impregnated with a thermosetting varnish, and after photocuring, the thermosetting varnish is impregnated. Concerning the manufacturing method. The light used for photocuring in the present invention is as follows:
Ultraviolet light with a wavelength range of 2000 Å to 6000 Å can be used, and a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a chemical lamp, an arc lamp, etc. can be used as a light source. There are no particular restrictions on the conditions for photocuring. The photocurable resin composition is applied by spraying, brushing, impregnation, or the like. The photocurable resin composition used in the present invention is an unsaturated polyester resin containing an unsaturated polyester, a crosslinkable monomer, a photosensitizer, and optionally a radical polymerization initiator, a curing accelerator, and a polymerization inhibitor. It is a composition. More specifically, unsaturated polyester is synthesized from an acid component and an alcohol component, or in some cases from an acid component, an alcohol component, and a modified component, and there are no restrictions on the method of production. Acid components include maleic acid, maleic anhydride, fumaric acid, itaconic acid, citraconic acid, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, tetrahydrophthalic anhydride, and other unsaturated acids, phthalic acid, and anhydride. Acids that do not have reactive unsaturated bonds such as phthalic acid, isophthalic acid, terephthalic acid, adipic acid, and benzoic acid, vegetable oil fatty acids obtained from soybean oil, tall oil, coconut oil, castor oil, etc., and derivatives thereof, etc. is used. Alcohol components include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, butanediol,
Neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol, etc. are used. As the modifying component, dicyclopentadiene, cyclopentadiene, derivatives thereof, etc. can be used. Examples of crosslinking monomers include styrene and its derivatives, divinylbenzene, acrylic ester,
A methacrylic acid ester or the like is used, and there are no particular limitations. Examples of photosensitizers include benzoyl ethers such as benzoin, benzoin ethyl ether, benzoin isopropyl ether, and benzoin phenyl ether, benzointhioethers, benzophenone, acetophenone, 2-ethylanthraquinone furoin, benzoin ether-Michler-ketone series, and chloride. You can use anything you like, such as decile. Examples of radical polymerization initiators include acyl peroxides such as benzoyl peroxide and acetyl peroxide, hydroperoxides such as tertiary butyl peroxide and kyumene hydroperoxide, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, Alkyl peroxides such as tertiary butyl peroxide and dicumyl peroxide, and oxyperoxides such as tertiary butyl peroxyacetate are used. As hardening accelerators, naphthenates of iron, cobalt, lead, manganese, nickel, tin, zinc, etc.
Octenoic acid salts and the like are used. As the polymerization inhibitor, quinones such as hydroquinone, paratertiary butylcatechol, pyrogallol, and other commonly used ones are used. In addition, as the thermosetting varnish to be impregnated after photocuring, commonly used solvent-based varnishes, unsaturated polyester varnishes, epoxy varnishes, etc. can be used, but the present invention is particularly suitable for styrene monomer type unsaturated polyester varnishes. , is particularly effective. Examples and comparative examples are shown. Parts are parts by weight, and % are weight %. Production of unsaturated polyester resin A Maleic anhydride 98g (1 mol), phthalic anhydride
75g (0.5mol), soybean oil fatty acid 282g (0.5mol)
and propylene glycol 167.2g (2.2mol)
The mixture was charged into a four-necked flask, stirred under nitrogen gas blowing, kept at 180°C for 1 hour, and the reaction continued at 210-220°C to obtain unsaturated polyester A with an acid value of 20.0. 50 parts of styrene was stirred and mixed with 50 parts of this unsaturated polyester A, and 0.01% of hydroquinone and manganese naphthenate (metal content: 8
%) and 1% benzoyl peroxide were added and mixed and stirred to obtain a uniform varnish and unsaturated polyester resin A. Preparation of Varnish B Varnish B was obtained by mixing and stirring 100 parts of unsaturated polyester resin A and 1 part of benzoin ethyl ether. Preparation of Varnish C To 50 parts of the unsaturated polyester A, 50 parts of styrene, 0.01 part of hydroquinone, 0.2 parts of manganese naphthenate (metal content 8%), and 1 part of benzoin ethyl ether were mixed and stirred to obtain a uniform solution varnish C. . Comparative Example 1 A test piece (75
×150×0.8mm iron plate 2 made by Hitachi Cable Co., Ltd.
20 UL1015 orange, UL1007 orange vinyl chloride lead wires 1, polyester film adhesive tape 4
(width: 10 mm, thickness: 0.05 mm), bend the lead wires to sandwich the iron plate, and then secure with polyester film adhesive tape to prevent the vinyl chloride lead wires from moving. ), immersed in Varnish A for 10 minutes, pre-dropped for 5 minutes, and cured at 100°C for 3 hours. The crack test conditions were as follows: After being left in a low temperature chamber at 0° C. for 4 hours, the lead wire was immediately expanded to an angle of 180 degrees, and the number of cracks that had occurred in the lead wire was checked. As a result, the UL1015 lead wire is
Cracks occurred on 15 wires and 20 on UL1007 lead wires. Example 1 The test piece used in Comparative Example 1 was immersed in Varnish B for 10 minutes.
After pre-dropping for 5 minutes, as in Example 1, the immersed part of the varnish was exposed to ultraviolet light using a high-pressure mercury lamp (manufactured by Matsushita Electric Works Co., Ltd., 1KW, 1-lamp type) from a distance of 200 mm as shown in Figure 1. When irradiated, the surface of the lead wire was cured in 3 minutes. Furthermore, this test piece was immersed in varnish A for 10 minutes, and after pre-dropping for 5 minutes, it was heated to 100°C.
Leave it in a dryer for 180 minutes to harden. When this test piece was tested under the same conditions as Comparative Example 1,
Cracks occurred in 0 of the UL1015 lead wires and 5 of the UL1007 lead wires. The above comparative examples and examples are summarized in Table 1.
【表】
クラツクの発生本数
表中の数字は[Table] Number of cracks in the table The numbers in the table are
Claims (1)
される個所に光硬化性樹脂組成物を塗布し、光硬
化させた後、熱硬化性ワニスの含浸処理を行なう
ことを特徴とする絶縁処理された電気機器の製造
法。1. An insulation-treated insulation-treated vinyl chloride lead wire characterized in that a photocurable resin composition is applied to a portion of a vinyl chloride lead wire to be impregnated with thermosetting varnish, and after photocuring, impregnation treatment with thermosetting varnish is performed. Method of manufacturing electrical equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4382679A JPS55143019A (en) | 1979-04-10 | 1979-04-10 | Method of fabricating electric device insulated |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4382679A JPS55143019A (en) | 1979-04-10 | 1979-04-10 | Method of fabricating electric device insulated |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55143019A JPS55143019A (en) | 1980-11-08 |
JPS6150369B2 true JPS6150369B2 (en) | 1986-11-04 |
Family
ID=12674553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4382679A Granted JPS55143019A (en) | 1979-04-10 | 1979-04-10 | Method of fabricating electric device insulated |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55143019A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62170273U (en) * | 1986-04-17 | 1987-10-28 | ||
JPS6340879U (en) * | 1986-09-01 | 1988-03-17 | ||
JPS63161878U (en) * | 1987-04-09 | 1988-10-21 | ||
JPS6442176U (en) * | 1987-09-08 | 1989-03-14 | ||
JPH0227375U (en) * | 1988-08-08 | 1990-02-22 | ||
JPH0347167U (en) * | 1989-09-19 | 1991-05-01 | ||
JPH0350478U (en) * | 1989-09-26 | 1991-05-16 | ||
JPH0350476U (en) * | 1989-09-25 | 1991-05-16 | ||
JPH0726163U (en) * | 1994-05-24 | 1995-05-16 | 庸良 落合 | Phone card |
WO2020161976A1 (en) * | 2019-02-08 | 2020-08-13 | 株式会社ワコム | Electromagnetic coupling-type electronic pen |
-
1979
- 1979-04-10 JP JP4382679A patent/JPS55143019A/en active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62170273U (en) * | 1986-04-17 | 1987-10-28 | ||
JPS6340879U (en) * | 1986-09-01 | 1988-03-17 | ||
JPS63161878U (en) * | 1987-04-09 | 1988-10-21 | ||
JPS6442176U (en) * | 1987-09-08 | 1989-03-14 | ||
JPH0227375U (en) * | 1988-08-08 | 1990-02-22 | ||
JPH0347167U (en) * | 1989-09-19 | 1991-05-01 | ||
JPH0350476U (en) * | 1989-09-25 | 1991-05-16 | ||
JPH0350478U (en) * | 1989-09-26 | 1991-05-16 | ||
JPH0726163U (en) * | 1994-05-24 | 1995-05-16 | 庸良 落合 | Phone card |
WO2020161976A1 (en) * | 2019-02-08 | 2020-08-13 | 株式会社ワコム | Electromagnetic coupling-type electronic pen |
Also Published As
Publication number | Publication date |
---|---|
JPS55143019A (en) | 1980-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6150369B2 (en) | ||
MXPA06014368A (en) | Impregnating resin formulation. | |
CN104995822A (en) | Stator coil for rotating electric machine, method for manufacturing said stator coil, and rotating electrical machine | |
JPS5943068B2 (en) | Photocurable resin composition for electrical insulation | |
JP4697511B2 (en) | Resin composition, resin composition for electrical insulation, and method for producing electrical equipment insulator | |
JPS6140259B2 (en) | ||
JP2011116879A (en) | Unsaturated polyester resin composition | |
JPS61277107A (en) | Resin composition for insulating electric appliance | |
JPS5960816A (en) | Electrically insulating resin composition | |
JP4590675B2 (en) | Resin composition for electrical insulation and electrical equipment | |
JPH0356558A (en) | Resin composition for electrical insulating treatment, electrical insulating treatment and stator coil | |
JPH0151488B2 (en) | ||
CA2282412A1 (en) | Process for coating mouldings with polyester resin compounds or solutions | |
JP2835847B2 (en) | Resin composition | |
CN110760057A (en) | Low-dielectric-loss high-pressure-resistant moisture-proof unsaturated polyester resin and preparation method thereof | |
JPS6257045B2 (en) | ||
JPS63251454A (en) | Electrical insulating resin composition | |
JPS5936805B2 (en) | Electrical equipment sealed and impregnated with a resin composition | |
JPS6011052B2 (en) | Curable resin composition | |
JPS61101917A (en) | Manufacture of self-bonding insulated wire | |
JPS5815931B2 (en) | Manufacturing method for insulated electrical equipment coils | |
JP2010229355A (en) | Insulating varnish | |
JPH05331411A (en) | Resin composition for insulation of electrical equipment | |
JP2002348452A (en) | Resin composition for electrical insulation | |
JP2000178424A (en) | Resin composition for electric insulation and electric device using the composition |