JPS6150156B2 - - Google Patents

Description

[Detailed description of the invention]

(a) Technical Field of the Invention The present invention relates to a method of manufacturing a metal plate having a plurality of microholes, and particularly to providing a manufacturing method that is highly accurate and suitable for mass production when the metal plate has a large number of microholes. (b) Prior Art and Problems Recently, inkjet printers, especially drop-on-demand type inkjet printers, have been actively developed and put into practical use as silent printers. In this type of ink jet head, a thin metal plate with a number of holes of about 0.05 mm in diameter and 0.2 mm in depth arranged at regular intervals is fixed to the ink ejection part and used as an ink nozzle plate. be. Conventional methods for machining the microholes include electric discharge machining, micro-drilling, and laser beam methods. In the electrical discharge machining method, the fine metal wire used for the discharge electrode is easily bent and it is difficult to maintain it stably, so there is a drawback that there is a lot of variation in dimensions, the surface inside the hole is rough, and mass productivity is low. The micro-drill method has the disadvantage that the drill diameter is small, making it easy to break. The laser beam method processes the metal by melting the irradiated part with laser energy, so it has the drawback that the surface inside the hole is often uneven and the cross-sectional shape of the hole tends to be irregular. As mentioned above, each of the conventional microhole processing methods has its own drawbacks, and in particular, there have been problems with precision and mass production. (c) Purpose of the Invention The present invention has been made in view of the above-mentioned points, and an object thereof is to provide a manufacturing method with high precision and suitable for mass production by forming micropores using electroforming. This is what I did. (d) Structure of the Invention In order to achieve the above-mentioned object, the present invention arranges and fixes a wire rod having the same external shape as the micropore diameter on a metal substrate made of a material different from that of the wire rod while maintaining a predetermined position.
The wire rod and the metal substrate are electroformed into one body by electrodeposition, and the electroformed metal block is cut in a direction perpendicular to the wire rod to form a plate with a predetermined thickness. This is characterized in that desired microholes are formed in the metal plate by removing the wire. (e) Embodiments of the invention Preferred embodiments of the invention will be described below with reference to the drawings. FIG. 1 is a perspective view conceptually showing an example of the ink nozzle plate 1 of the ink jet head.
are arranged in a line with pitch p. An example of these dimensions is t=0.2mm, d=0.05mm, p
=0.4mm. FIGS. 2 to 7 are conceptual schematic diagrams and perspective views showing the manufacturing process of a metal plate having a large number of microholes for the nozzle plate 1 according to the present invention in accordance with the process order. First, as shown in the perspective view of FIG. 2, the nozzle plate 1 is placed on a substrate 11 made of stainless steel (SUS304).
Phosphor bronze wires 13 having the same external dimensions as the inner diameter d of the nozzle holes 3 and the same number as the number of nozzle holes 3 are arranged at the same pitch as the pitch p of the nozzle holes 3, and then a synthetic resin adhesive 14 such as Araldite is applied. The electrodeposited material 10 is formed by fixing the electrodeposited material 10 using the electrodeposited material. Next, the process moves to a pretreatment process for electrodeposition. In other words, sufficient purification treatment is required to bring the metal substrate 11 and the electroformed ingot 31 (see Fig. 5) into close contact with each other.
, Sodium carbonate 30g/, Sodium silicate
After degreasing at 70°C for 10 minutes using a mixture of 20 gr/g/surfactant and 1 gr/surfactant, nickel strike plating is applied through the various steps of water washing, acid treatment, and water washing. Next, as shown in the schematic view of FIG. 3 and the perspective view of FIG. 4, the pretreated electrodeposited material 10 is fixed to the cathode hanger 22, and at the same time, unevenness in the thickness of the electrodeposition is reduced. Shielding plate 2 made of vinyl chloride board
3 as shown in Figure 3. The appropriate distance between the two is 2 to 3 times the expected thickness of the electroformed ingot. On the other hand, the metal to be electrodeposited, in this case a nickel metal lump, is used as an anode 24 and connected to a DC power source 25. The composition of the plating solution and electrodeposition conditions in this example are shown in Table 1.

[Table] As shown in FIG. 5, the substrate 11 is formed by the electrodeposition described above.
After washing and drying the nickel electroformed ingot 31 deposited above, it is machined into a rectangular parallelepiped 32 as shown in FIG. Thus, a member 1a for the nozzle plate 1 is obtained. This is finished to the predetermined dimensions and surface roughness by wrapping processing, and then immersed in a copper alloy chemical polishing agent containing hydrogen peroxide for 10 to 30 minutes at 20 to 25°C to remove the embedded phosphor bronze wire 13. If it is dissolved and removed to form a hole,
Nozzle plate 1 is completed. The process explained above is an example of an embodiment, and
The material of the wire 13 is not limited to phosphor bronze alloy, but any material may be used as long as it is combined with the material of the metal substrate 11 so that only the wire can be chemically dissolved from the last nozzle plate member 1a. Furthermore, phosphor bronze wire 1
3 may be a synthetic resin wire, such as a nylon wire. In this case, to remove the wire from the nozzle plate member Ia, it is sufficient to heat it in an air oven; for example, if nylon wire is used, heating it at 800°C for 30 minutes in an electric oven is sufficient. . In addition, the phosphor bronze wire 13 in the first step of the above embodiment
A method for fixing the metal substrate 11 to the metal substrate 11 will be described. The method shown in FIG. 8 is to fit two metal substrates together, attach them to a small winding machine with a chuck not shown in the figure, rotate them around X-X, and wind up the phosphor bronze wire 13 at a predetermined pitch p. , a method in which the synthetic resin adhesive 14 is applied to a position 14a indicated by a dotted line.
As can be imagined from the figure, this method is excellent in mass production and can be easily expanded to produce multiple pieces. In the method shown in FIG. 9, when the precision of the pitch p of the nozzle hole 3 is strictly required, guide grooves 42 of the pitch p are provided at both ends of the jig 41 with high precision, and the phosphor bronze wire 13 is guided using the guide grooves 42 as guides. It is an expansion of
The metal substrate 11 is inserted between this wire and the jig 41 A, and the phosphor bronze wire 13 is attached to the metal substrate 1 with an adhesive 14.
1 and then separated using a jig 41. Therefore, in this case, the jig can be used repeatedly. When the nozzle holes 3 of the nozzle plate 1 are arranged in two rows, the thickness of the metal substrate 11 is made the same as the dimension between both hole rows, and the phosphor bronze wires 13 are fixed to both sides of the substrate. Just follow the process. When there are three or more rows of nozzle holes 3, the purpose can be easily achieved by stretching the phosphor bronze wire in the space at a predetermined relative position using a jig. In the above description, phosphor bronze wire is used as an example of the material of the wire, but other types of metal wire or synthetic resin wire may be used. Up to this point, the method of manufacturing an ink ejection nozzle plate for an ink jet head has been described as an example, but the present invention can be widely applied to the manufacture of metal plates having micropores used for other purposes. (f) Effects of the invention When manufacturing metal plates with micro holes, for example, about 0.05 mm, the present invention can be applied to produce high quality micro holes with smooth inner surfaces with much higher precision than conventional processing methods. In addition to being able to process holes, this processing method is highly suitable for mass production, provides high yields, and has the effect of reducing cost.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing the nozzle plate of the ink ejection part in an inkjet printer, and Figures 2 to 7.
The figures show the steps according to an embodiment of the present invention in the order of steps, and FIG. 2 is a perspective view of the electrodeposited part, FIG. 3 is a schematic diagram of the electrodeposition apparatus, and FIG. 4 is the structure of the cathode. Fig. 5 is a perspective view showing the ingot after electrodeposition is completed, Fig. 6 is a perspective view showing a rectangular nozzle plate base material cut out from the ingot by cutting, and Fig. 7 is a cut of the nozzle plate member. FIG. FIGS. 8 and 9 are perspective views showing a modification of the method of fixing the phosphor bronze wire to the metal substrate. In the figure, 1 is a nozzle plate, 1a is a nozzle plate member, 3 is a nozzle hole,
10 is the assembly of the electrodeposited part, 11 is the metal substrate, 12
13 is a phosphor bronze wire, 14 is a synthetic resin for fixing, 21 is a plating tank, 2 is a hole for attaching to a cathode hanger,
2 is a cathode hanger, 23 is an electrodeposition shielding plate, 24 is an anode made of the metal to be electrodeposited, 25 is a power source for electrodeposition, 26 is an insulating coating layer, 31 is an electrodeposited ingot,
32 is a rectangular parallelepiped, 41 is a jig, and 42 is a pitch guide groove.

Claims (1)

[Claims] 1. In manufacturing a metal plate having microholes, a wire having the same outer diameter as the inner diameter of the microhole is placed and fixed in a predetermined position on a metal substrate made of a material different from that of the wire, and then the wire is A metal of a material different from the material of is thickly electrodeposited on the substrate, the wire rod and the metal substrate are integrated with the electroformed metal lump, and then the electroformed metal lump is plated into a predetermined size in the direction perpendicular to the wire rod. A metal plate having micropores, characterized in that desired micropores are formed in the metal plate by cutting the metal plate into shapes and then removing the wire contained inside the metal plate formed by cutting. Production method.