JPS6149468U - - Google Patents
Info
- Publication number
- JPS6149468U JPS6149468U JP13276084U JP13276084U JPS6149468U JP S6149468 U JPS6149468 U JP S6149468U JP 13276084 U JP13276084 U JP 13276084U JP 13276084 U JP13276084 U JP 13276084U JP S6149468 U JPS6149468 U JP S6149468U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist layer
- printed
- copper foil
- printing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13276084U JPS6149468U (pt) | 1984-09-03 | 1984-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13276084U JPS6149468U (pt) | 1984-09-03 | 1984-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6149468U true JPS6149468U (pt) | 1986-04-03 |
Family
ID=30691320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13276084U Pending JPS6149468U (pt) | 1984-09-03 | 1984-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149468U (pt) |
-
1984
- 1984-09-03 JP JP13276084U patent/JPS6149468U/ja active Pending