JPS6146058U - Automatic solder feeder - Google Patents

Automatic solder feeder

Info

Publication number
JPS6146058U
JPS6146058U JP12695984U JP12695984U JPS6146058U JP S6146058 U JPS6146058 U JP S6146058U JP 12695984 U JP12695984 U JP 12695984U JP 12695984 U JP12695984 U JP 12695984U JP S6146058 U JPS6146058 U JP S6146058U
Authority
JP
Japan
Prior art keywords
solder
flow conduit
float
valve
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12695984U
Other languages
Japanese (ja)
Inventor
三津夫 禅
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to JP12695984U priority Critical patent/JPS6146058U/en
Publication of JPS6146058U publication Critical patent/JPS6146058U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案実施例の正面断面図、第２図は要部拡大
正面断面図、第３図は流導管にフロートの挿通を説明す
る一部破断斜視図である。 １・・・主はんだ槽、５・・・補助はんだ槽、６・・・
弁座、７・・・流導管、８・・・弁、９・・・フロート
。FIG. 1 is a front sectional view of an embodiment of the present invention, FIG. 2 is an enlarged front sectional view of the main part, and FIG. 3 is a partially cutaway perspective view illustrating insertion of a float into a flow conduit. 1... Main solder tank, 5... Auxiliary solder tank, 6...
Valve seat, 7...Flow conduit, 8...Valve, 9...Float.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）主はんだ槽の上方に補助はんだ槽を設置し補助は
んだ槽の下部に先端が弁座となった流導管を取付けてし
かも該先端を主はんだ槽の液面下に没入させ、没入した
流導管近傍のはんだ液面に弁の付設されたフロートを浮
かべるとともに該弁を前記流導管の弁座に適合させたこ
とを特徴とする自動はんだ供給装置。(1) An auxiliary solder tank was installed above the main solder tank, and a flow conduit with a valve seat at the tip was attached to the bottom of the auxiliary solder tank, and the tip was immersed under the liquid level of the main solder tank. An automatic solder supply device characterized in that a float equipped with a valve is floated on the solder liquid surface near the flow conduit, and the valve is adapted to a valve seat of the flow conduit. （２）前記フロートはドーナツツ状でその中央孔に流導
管を挿通してはんだ液面上に浮かべたことを特徴とする
実用新案登録請求の範囲第（１）項記載の自動はんだ供
給装置。(2) The automatic solder supply device according to claim 1, wherein the float is shaped like a donut and has a flow conduit inserted through its central hole to float above the solder liquid surface.
JP12695984U 1984-08-23 1984-08-23 Automatic solder feeder Pending JPS6146058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12695984U JPS6146058U (en) 1984-08-23 1984-08-23 Automatic solder feeder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12695984U JPS6146058U (en) 1984-08-23 1984-08-23 Automatic solder feeder

Publications (1)

Publication Number Publication Date
JPS6146058U true JPS6146058U (en) 1986-03-27

Family

ID=30685613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12695984U Pending JPS6146058U (en) 1984-08-23 1984-08-23 Automatic solder feeder

Country Status (1)

Country Link
JP (1) JPS6146058U (en)

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