JPS6145115U - Plastic mold - Google Patents

Plastic mold

Info

Publication number
JPS6145115U
JPS6145115U JP12993984U JP12993984U JPS6145115U JP S6145115 U JPS6145115 U JP S6145115U JP 12993984 U JP12993984 U JP 12993984U JP 12993984 U JP12993984 U JP 12993984U JP S6145115 U JPS6145115 U JP S6145115U
Authority
JP
Japan
Prior art keywords
parting line
mold
plastic mold
packing
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12993984U
Other languages
Japanese (ja)
Inventor
満治 野々村
Original Assignee
岐阜プラスチック工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 岐阜プラスチック工業株式会社 filed Critical 岐阜プラスチック工業株式会社
Priority to JP12993984U priority Critical patent/JPS6145115U/en
Publication of JPS6145115U publication Critical patent/JPS6145115U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案を具体化したプラスチック成形用金型
の一実施例を示す縦断面図、第２図は第１図のＡ−Ａ綿
における断面図、第３図は第１図のＢ部分を拡大して示
す部分断面図である。 一 図において、２は固定型、４は可動型、５はキャビ
テイ、１４はパーティングライン、１５はパッキング、
１６はガス留り部、１７は排気通路、１８は真空源とし
ての真空ポンプである。Fig. 1 is a longitudinal cross-sectional view showing an example of a plastic molding die embodying this invention, Fig. 2 is a cross-sectional view taken along A-A cotton in Fig. 1, and Fig. 3 is a cross-sectional view taken along line B in Fig. 1. It is a partial sectional view which expands and shows a part. In the figure, 2 is a fixed type, 4 is a movable type, 5 is a cavity, 14 is a parting line, 15 is a packing,
Reference numeral 16 indicates a gas retention section, 17 indicates an exhaust passage, and 18 indicates a vacuum pump as a vacuum source.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固定型２と可動型４との間に形成されるキャビテイ５を
包囲するように両型２，４のパーティングライン１４上
にパッキング１５を設けるとともに、そのパッキング１
５よりもキャビテイ５側のパーテイングライン１４上に
は複数個のガス留り部１６を設け、それらのガス留り部
１６を真空源１８と接続するように固定型２には排気通
路１７を設けたことを特徴とするプラスチック成形用金
型。A packing 15 is provided on the parting line 14 of both the molds 2 and 4 so as to surround the cavity 5 formed between the fixed mold 2 and the movable mold 4, and the packing 1
A plurality of gas retention parts 16 are provided on the parting line 14 on the side of the cavity 5 than the parting line 14, and an exhaust passage 17 is provided in the fixed mold 2 so as to connect these gas retention parts 16 with a vacuum source 18. A mold for plastic molding characterized by the following:
JP12993984U 1984-08-28 1984-08-28 Plastic mold Pending JPS6145115U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12993984U JPS6145115U (en) 1984-08-28 1984-08-28 Plastic mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12993984U JPS6145115U (en) 1984-08-28 1984-08-28 Plastic mold

Publications (1)

Publication Number Publication Date
JPS6145115U true JPS6145115U (en) 1986-03-25

Family

ID=30688549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12993984U Pending JPS6145115U (en) 1984-08-28 1984-08-28 Plastic mold

Country Status (1)

Country Link
JP (1) JPS6145115U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0336425U (en) * 1989-08-10 1991-04-09
JP2016007702A (en) * 2014-06-20 2016-01-18 三島光産株式会社 Method for manufacturing microneedle array, and molding die for injection molding used therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130468A (en) * 1975-05-08 1976-11-12 Kanto Seiki Co Injection molding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130468A (en) * 1975-05-08 1976-11-12 Kanto Seiki Co Injection molding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0336425U (en) * 1989-08-10 1991-04-09
JP2016007702A (en) * 2014-06-20 2016-01-18 三島光産株式会社 Method for manufacturing microneedle array, and molding die for injection molding used therefor

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