JPS6144820Y2 - - Google Patents
Info
- Publication number
- JPS6144820Y2 JPS6144820Y2 JP1981124719U JP12471981U JPS6144820Y2 JP S6144820 Y2 JPS6144820 Y2 JP S6144820Y2 JP 1981124719 U JP1981124719 U JP 1981124719U JP 12471981 U JP12471981 U JP 12471981U JP S6144820 Y2 JPS6144820 Y2 JP S6144820Y2
- Authority
- JP
- Japan
- Prior art keywords
- polystyrene foam
- foam board
- heat
- adhesive
- surface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920006327 polystyrene foam Polymers 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000000057 synthetic resin Substances 0.000 claims description 10
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 5
- 239000010408 film Substances 0.000 description 24
- 239000006260 foam Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
- Y02A40/10—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in agriculture
- Y02A40/25—Greenhouse technology, e.g. cooling systems therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
Landscapes
- Building Environments (AREA)
- Securing Of Glass Panes Or The Like (AREA)
- Laminated Bodies (AREA)
- Greenhouses (AREA)
Description
本考案は透光性、断熱パネルに関するものであ
る。従来、太陽光線を有効に利用して保健衛生や
生物の育成を促進するために、温室、窓、障子等
にガラス板、合成樹脂板及びフイルム等が用いら
れている。しかしながら、これらのパネルは日照
時の透光性に優れているが、夜間の外気温の低下
にしたがつて放熱がはげしく、せつかく蓄熱した
熱を短時間で放出してしまうばかりか、その表面
に結露が生ずるなどの問題があり、最近では採光
だけでなく、夜間の保温に関心が寄せられてい
る。
現在、透光性と断熱性に優れた材質として例え
ば、実開昭55−144034、実開昭56−5634ではアク
リル系発泡体にガラス繊維の織物や繊維補強熱硬
化性樹脂を積層した積層体が公知であるが、これ
らはアクリル系発泡体を使用しているので透光率
がせいぜい10％台で低いこと、アクリル発泡板は
高発泡が難かしく気泡が不均一であること、熱伝
導率は0.08Kcal／ｍ・hr・℃であり断熱性が低い
こと、および高価である欠点がある。然るに、本
考案者は透光性と断熱性のある発泡樹脂を探究し
た所、特定の構造を有するポリスチレン系発泡板
が、その目的を達成することを知見した。しかし
ながらポリスチレン系発泡板をパネルとしてその
まま使用すると光線中の紫外線により表面の劣化
現象を起すために、耐光性を付与した透明なポリ
アクリル系フイルムで表面を被覆することによ
り、長時間の使用に耐え得る光線透過性にすぐれ
た（約20〜45％）しかも断熱性および接着状態が
良好で安価な透光性、断熱パネルを提供すること
を本考案は目的とするものである。
即ち、紫外線吸収剤入りポリアクリル系フイル
ム１とスチレン系樹脂に対して熱接着性を有する
合成樹脂系層３を接着剤２を介して積層し成形し
た厚さ200μ以下の表面材５と、平均セルサイズ
0.8乃至10mmのポリスチレン系発泡板４とが熱接
着してなる透光性、断熱パネルに係わるものであ
り、表面材５はポリスチレン系発泡体４の片面ま
たは両面に熱接着されたものである。
次に図面に基づいて本考案を詳細に説明する。
第１図は、本考案の透光性、断熱パネルの１例を
示す断面図である。
本考案で使用する基材としてのポリスチレン系
発泡板４は、透光性と断熱性の優れたものであ
り、そのために発泡板中のセルサイズが特定され
たものでなければならず、平均セルサイズ0.8乃
至10mm、好ましくは１乃至６mmを有するポリスチ
レン系発泡板で光線透過率20％以上（障子の光線
透過率25〜40％）で総括熱伝導率λは0.05Kcal／
mhr℃以下の断熱性を有することが必要であり、
また発泡率は５〜30倍であり、発泡板中のセルは
ほぼ均一に分布していなければならない。ここに
平均セルサイズとは気泡径の寸法を板のよこ方
向、たて方向および板の厚み方向で測定した気泡
径の平均値である。気泡径にバラツキがある場合
には厚み方向の各気泡の平均セルサイズの平均値
で表わす。
本考案において使用するポリスチレン系発泡体
の平均セルサイズを0.8乃至10mmの範囲に選定し
た理由は、本考案のパネルの光線透過率を20％以
上、即ち障子の光線透過率（25ないし40％）とほ
ぼ同程度以上にするためである。平均セルサイズ
が0.8mm以下、例えば0.6mmの場合には光線透過率
は低下して約15％となり好ましくなく、一方平均
セルサイズが10mm以上の場合は表面平滑性が低く
なり機械的強度が低下する。
発泡板の厚さは本考案のパネルを保温、透光板
として使用する場合、実用に耐え得る機械的特性
例えば熱収縮率、圧縮強度、曲げ強さ、釘打加工
性（割れ、穴ゆるみ）を考慮して、平均セルサイ
ズにより変動するが、例えば３〜60mm、好ましく
は５〜25mm、更に好ましくは10mm程度が望まし
い。
次に本考案で使用する紫外線吸収剤入りポリア
クリル系フイルム１は紫外線吸収剤として例えば
UV吸収剤等をポリアクリル系フイルムに含有さ
せたものであり、ポリアクリル系フイルム自体を
耐光性にすると共に、ポリスチレン発泡板４の光
劣化を防止する作用をする。
ポリアクリル系フイルムとしては、例えば、ア
クリル酸アルキルエステル、メタアクリル酸アル
キルエステル、又は必要に応じて前記単量体と共
重合可能なエチレン系単量体から重合されたも
の、又は前記の重合体を種々ブレンドした組成物
等、透明性の良いものならいかなるものでも使用
できる。又フイルムの厚さは100μ以下の薄層で
ある。
本考案で使用するスチレン系樹脂に対して熱接
着性を有する合成樹脂系層３は厚さ100μ以下の
透明なものであつて、例えばポリスチレン系フイ
ルム、エチレン−酢酸ビニル樹脂系フイルム等、
又はスチレン系樹脂、エチレン−酢酸ビニール系
樹脂等をポリアクリル系フイルム１にコーテイン
グしたものを使用するが、耐熱性、ポリスチレン
系発泡板との熱接着適性よりポリスチレン系フイ
ルムを使用するのがなお良い。
表面材５は100μ以下のポリアクリル系フイル
ム１と100μ以下のスチレン系樹脂に対して熱接
着性を有する合成樹脂系層３を接着剤２で接着し
た積層フイルムよりなり、その厚さは200μ以下
である。この厚さに特定することにより、うすい
フイルムのためフイルム加工に用いる通常のドラ
イラミネーター、コーターにより高速接着加工が
可能となり、更に透明性がそこなわれることな
く、耐熱性の良い二液反応型のウレタン系接着剤
を用いることが出来る利点を有する。接着剤２と
しては耐熱性のあるものなら何でも良いがウレタ
ン系接着剤が良い。
接着剤の使用量は少量で十分接着することがで
き、例えばウレタン系接着剤を使用した場合10
ｇ／m2以下で十分であり、透明性の良いしかも安
価な表面材を得ることができる。
本考案の特徴の１つである積層パネルにおいて
ポリアクリル系フイルム１を直接ポリスチレン系
発泡体４と接着しないで、ポリアクリル系フイル
ム１とポリスチレン発泡板４との間に合成樹脂系
層３を介在させた理由は次の如くである。ポリス
チレン系発泡板４は透光性、耐熱性に優れている
にもかかわらず、工業的製造において、表面に約
0.5mm程度の板内扁肉が生ずることはさけられな
いので表面平滑性が悪い欠点がある。かかるポリ
スチレン系発泡板４とポリアクリル系フイルム１
を直接に積層するためには200ｇ／m2以上の量の
接着剤を使用する必要があり、かかる多量の接着
剤を使用すると積層パネルの透明性は悪く、また
接着後直ちに固定しないと接着不良をきたしてフ
クレなどの現象が起る。これに対し本考案におい
ては、表面の平滑なポリアクリル系フイルム１と
スチレン系樹脂に対して熱接着性を有する合成樹
脂層３を少量の接着剤を使用することにより表面
材を形成することができると共に、ポリスチレン
系発泡板と表面材を熱融着すると接着後直ちに固
定されるためにフクレ等の現象が起ることなく、
透明度の高い製品を得ることができる。又、ポリ
スチレン系発泡板４の表面の凹凸に左右されるこ
となく表面材５を良好に熱接着させるためには合
成樹脂層３の厚みは15μ以上が良い。
本考案のパネル６の積層方法は、表面材５とポ
リスチレン系発泡板４とを重ね合わせて、加圧さ
れた170℃の加熱ロールとバツクアツプロールと
の間を線速度８ｍ／分で通し熱接着することによ
り容易に得られる。
次に本考案の効果を列挙すると次の如くであ
る。
１ 本考案の積層パネルは芯材としてポリスチレ
ン系発泡板を使用するために安価で、しかも同
一構成のポリアクリル系発泡板と比較して剛性
が低いので積層し易い。
２ ポリスチレン系発泡板の平均セルサイズを特
定値（0.8乃至10mm）に調整することによつて
透光性、断熱性、寸法安定性、および加工性に
優れたパネルが得られる。
３ 表面層に紫外線吸収剤入りポリアクリル系フ
イルムを使用することにより、ポリスチレン系
発泡板に耐光性を付与し透明度の良いパネルを
得ることができ、窓、障子、透光性ドア、温室
用等の広範囲の用途がある。なお、平均セルサ
イズ１〜６mmのポリスチレン系発泡板を用いた
パネルは障子の和紙の繊維が現出した様な模様
となり、非常に美感に豊んだものとなり良い。
更に、これに松、竹、キリ目模様の様な部分印
刷したものはなお良い。
次に本考案の実施例の１例及び比較例を示す。
実施例１〜４、および比較例１
熱ラミネーシヨンにより表面材をポリスチレン
系発泡板に積層したパネルを示す。
第１表に示す厚さ10mmのポリスチレン系発泡板
と、UV吸収剤入りポリアクリル系フイルム／ウ
レタン系接着剤／ポリスチレン系樹脂に対して熱
接着性を有する合成樹脂フイルムからなる表面材
を重ね合せて、加圧された170℃の加熱ロールと
バツクアツプロールとの間をラインスピード８
ｍ／分の速度で通して熱接着してパネルを得た。
その結果を第１表に示す。
比較例２〜５
接着剤でUV吸収剤入りポリアクリル系フイル
ムとポリスチレン系発泡板を積層したパネルを示
す。その結果を第１表に示す。
The present invention relates to a translucent, heat-insulating panel. Conventionally, glass plates, synthetic resin plates, films, etc. have been used for greenhouses, windows, shoji screens, etc. in order to promote health and hygiene and the growth of living things by effectively utilizing sunlight. However, although these panels have excellent translucency during sunlight, they dissipate heat rapidly as the outside temperature drops at night, and not only do they release the accumulated heat in a short period of time, but their surface Due to problems such as dew condensation, there has been recent interest in not only lighting but also heat retention at night. Currently, materials with excellent translucency and heat insulation properties are available, such as laminates made of acrylic foam laminated with glass fiber fabric or fiber-reinforced thermosetting resin. However, since these use acrylic foam, the light transmittance is low at around 10% at most, acrylic foam boards are difficult to foam to a high degree and the bubbles are uneven, and the thermal conductivity is low. is 0.08Kcal/m・hr・℃, which has the drawbacks of low heat insulation and high cost. However, the inventor of the present invention searched for a foamed resin that is transparent and heat insulating, and found that a polystyrene foam board with a specific structure can achieve the purpose. However, if a polystyrene foam board is used as a panel as it is, the surface will deteriorate due to the ultraviolet rays in the light, so by covering the surface with a transparent polyacrylic film that has added light resistance, it can withstand long-term use. An object of the present invention is to provide an inexpensive light-transmitting and heat-insulating panel that has excellent light transmittance (approximately 20 to 45%), good heat-insulating properties, and good adhesion. That is, a surface material 5 having a thickness of 200 μm or less formed by laminating and molding a polyacrylic film 1 containing an ultraviolet absorber and a synthetic resin layer 3 having thermal adhesive properties to styrene resin via an adhesive 2; cell size
This relates to a light-transmitting, heat-insulating panel formed by thermally bonding a polystyrene foam board 4 of 0.8 to 10 mm, and the surface material 5 is thermally bonded to one or both sides of the polystyrene foam 4. Next, the present invention will be explained in detail based on the drawings.
FIG. 1 is a sectional view showing an example of a translucent, heat-insulating panel of the present invention. The polystyrene foam board 4 used as a base material in this invention has excellent light transmittance and heat insulation properties, and for this reason, the cell size in the foam board must be specified, and the average cell size must be specified. A polystyrene foam board with a size of 0.8 to 10 mm, preferably 1 to 6 mm, with a light transmittance of 20% or more (light transmittance of shoji 25 to 40%) and an overall thermal conductivity λ of 0.05 Kcal/
It is necessary to have insulation properties of mhr℃ or less,
Further, the foaming rate must be 5 to 30 times, and the cells in the foam board must be distributed almost uniformly. Here, the average cell size is the average value of the bubble diameters measured in the horizontal direction, vertical direction, and thickness direction of the plate. If there is variation in the bubble diameter, it is expressed as the average value of the average cell size of each bubble in the thickness direction. The reason why we selected the average cell size of the polystyrene foam used in this invention in the range of 0.8 to 10 mm is that the light transmittance of the panel of this invention is 20% or more, that is, the light transmittance of shoji (25 to 40%). This is to make it approximately the same level or higher. When the average cell size is 0.8 mm or less, for example 0.6 mm, the light transmittance decreases to about 15%, which is undesirable. On the other hand, when the average cell size is 10 mm or more, the surface smoothness decreases and the mechanical strength decreases. do. The thickness of the foam board is determined by the mechanical properties that can withstand practical use, such as heat shrinkage rate, compressive strength, bending strength, and nailing workability (cracking, hole loosening) when using the panel of this invention as a heat-insulating or transparent board. In consideration of this, it varies depending on the average cell size, but is preferably about 3 to 60 mm, preferably about 5 to 25 mm, and more preferably about 10 mm. Next, the ultraviolet absorber-containing polyacrylic film 1 used in the present invention is, for example,
This is a polyacrylic film containing a UV absorber, etc., which makes the polyacrylic film itself light-resistant and also works to prevent the polystyrene foam board 4 from deteriorating due to light. Examples of polyacrylic films include those polymerized from acrylic acid alkyl esters, methacrylic acid alkyl esters, or ethylene monomers copolymerizable with the above monomers as necessary, or the above polymers. Any composition with good transparency can be used, such as a composition prepared by blending various types of esters. The thickness of the film is a thin layer of 100μ or less. The synthetic resin layer 3 having thermal adhesion to the styrene resin used in the present invention is a transparent material with a thickness of 100 μm or less, such as a polystyrene film, an ethylene-vinyl acetate resin film, etc.
Alternatively, use a polyacrylic film 1 coated with styrene resin, ethylene-vinyl acetate resin, etc., but it is better to use polystyrene film because of its heat resistance and suitability for thermal adhesion with polystyrene foam boards. . The surface material 5 consists of a laminated film in which a polyacrylic film 1 with a thickness of 100μ or less and a synthetic resin layer 3 having thermal adhesive properties for styrene resins with a thickness of 100μ or less are adhered with an adhesive 2, and its thickness is 200μ or less. It is. By specifying this thickness, it is possible to perform high-speed adhesion processing using ordinary dry laminators and coaters used for film processing because it is a thin film, and it is also possible to use a two-component reaction type with good heat resistance without losing transparency. It has the advantage that urethane adhesive can be used. Any heat-resistant adhesive may be used as the adhesive 2, but urethane adhesive is preferred. Adhesion can be achieved with a small amount of adhesive; for example, if urethane adhesive is used,
g/m 2 or less is sufficient, and a highly transparent and inexpensive surface material can be obtained. In the laminated panel, which is one of the features of the present invention, the polyacrylic film 1 is not directly bonded to the polystyrene foam 4, but the synthetic resin layer 3 is interposed between the polyacrylic film 1 and the polystyrene foam board 4. The reason for this is as follows. Although the polystyrene foam board 4 has excellent translucency and heat resistance, in industrial manufacturing, the surface
Since it is unavoidable that flattening of about 0.5 mm occurs within the plate, it has the disadvantage of poor surface smoothness. Such polystyrene foam board 4 and polyacrylic film 1
In order to directly laminate the panels, it is necessary to use an adhesive in an amount of 200 g/ m2 or more, and if such a large amount of adhesive is used, the transparency of the laminated panel will be poor, and if it is not fixed immediately after adhesion, it will lead to poor adhesion. This causes phenomena such as blisters. On the other hand, in the present invention, a surface material can be formed by using a small amount of adhesive to form a polyacrylic film 1 with a smooth surface and a synthetic resin layer 3 having thermal adhesive properties to styrene resin. In addition, when the polystyrene foam board and the surface material are heat-sealed, they are fixed immediately after bonding, so phenomena such as blistering do not occur.
A highly transparent product can be obtained. Further, in order to thermally bond the surface material 5 well without being affected by the unevenness of the surface of the polystyrene foam board 4, the thickness of the synthetic resin layer 3 is preferably 15 μm or more. The method of laminating the panel 6 of the present invention is to overlap the surface material 5 and the polystyrene foam board 4, and heat them by passing them between a pressurized heating roll of 170°C and a back-up roll at a linear speed of 8 m/min. It can be easily obtained by gluing. Next, the effects of the present invention are listed as follows. 1 The laminated panel of the present invention uses a polystyrene foam board as a core material, so it is inexpensive, and it is easy to laminate because it has lower rigidity than a polyacrylic foam board with the same structure. 2. By adjusting the average cell size of the polystyrene foam board to a specific value (0.8 to 10 mm), a panel with excellent translucency, heat insulation, dimensional stability, and workability can be obtained. 3 By using a polyacrylic film containing an ultraviolet absorber in the surface layer, it is possible to impart light resistance to the polystyrene foam board and obtain a panel with good transparency, making it suitable for windows, shoji screens, translucent doors, greenhouses, etc. It has a wide range of uses. In addition, a panel using polystyrene foam board with an average cell size of 1 to 6 mm has a pattern that resembles the appearance of Japanese paper fibers in a shoji screen, and is very aesthetically pleasing.
Furthermore, it is even better to have pine, bamboo, or cut-edge patterns printed on it. Next, an example of an embodiment of the present invention and a comparative example will be shown. Examples 1 to 4 and Comparative Example 1 Panels in which a surface material is laminated to a polystyrene foam board by thermal lamination are shown. A polystyrene foam board with a thickness of 10 mm as shown in Table 1 is laminated with a surface material consisting of a polyacrylic film containing a UV absorber, a urethane adhesive, and a synthetic resin film that is thermally adhesive to polystyrene resin. The line speed is 8 between the pressurized heating roll at 170°C and the back-up roll.
A panel was obtained by thermal bonding by passing at a speed of m/min.
The results are shown in Table 1. Comparative Examples 2 to 5 Panels are shown in which a polyacrylic film containing a UV absorber and a polystyrene foam board are laminated with an adhesive. The results are shown in Table 1.
【表】【table】
【表】【table】
第１図は本考案の透光性、断熱パネルの１例を
示す断面図である。
１……紫外線吸収剤入りポリアクリル系フイル
ム、２……接着剤層、３……スチレン系樹脂に対
して熱接着性を有する合成樹脂系層、４……ポリ
スチレン系発泡板、５……表面材、６……本考案
のパネル。
FIG. 1 is a sectional view showing an example of a translucent, heat-insulating panel of the present invention. 1... Polyacrylic film containing ultraviolet absorber, 2... Adhesive layer, 3... Synthetic resin layer having heat adhesive properties to styrene resin, 4... Polystyrene foam board, 5... Surface Material, 6...Panel of the present invention.
Claims (1)
とスチレン系樹脂に対して熱接着性を有する合
成樹脂系層３を接着剤２を介して積層した厚さ
200μ以下の表面材５と、平均セルサイズ0.8乃
至10mmのポリスチレン系発泡板とが熱接着され
てなることを特徴とする透光性、断熱パネル。 ２ ポリスチレン系発泡板４の片面または両面に
表面材５を熱接着してなる実用新案登録請求の
範囲第１項記載の透光性、断熱パネル。[Scope of claims for utility model registration] 1 Polyacrylic film containing ultraviolet absorber 1
and a synthetic resin layer 3 having thermal adhesive properties to styrene resin are laminated via adhesive 2.
A translucent, heat-insulating panel characterized in that a surface material 5 of 200μ or less and a polystyrene foam board with an average cell size of 0.8 to 10 mm are thermally bonded. 2. A translucent, heat-insulating panel according to claim 1, which is made by thermally adhering a surface material 5 to one or both sides of a polystyrene foam board 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981124719U JPS5831129U (en) | 1981-08-25 | 1981-08-25 | Translucent, heat-insulating panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981124719U JPS5831129U (en) | 1981-08-25 | 1981-08-25 | Translucent, heat-insulating panels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831129U JPS5831129U (en) | 1983-03-01 |
| JPS6144820Y2 true JPS6144820Y2 (en) | 1986-12-17 |
Family
ID=29918579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981124719U Granted JPS5831129U (en) | 1981-08-25 | 1981-08-25 | Translucent, heat-insulating panels |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831129U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58181728U (en) * | 1982-05-28 | 1983-12-03 | 積水化成品工業株式会社 | Daylight insulation board |
| JPS61177245A (en) * | 1985-01-31 | 1986-08-08 | 積水化学工業株式会社 | Manufacture of laminated sheet |
-
1981
- 1981-08-25 JP JP1981124719U patent/JPS5831129U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5831129U (en) | 1983-03-01 |
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