JPS6143155B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for brazing plates of the same or different metals, and is used, for example, to braze a copper plate to an aluminum terminal. The objective is to allow complete adhesion without allowing any contaminants to remain between the two surfaces, and to completely eliminate defects such as electrolytic corrosion.

[Conventional technology]

JP-A No. 52-32852 discloses a method of soldering the joint of two mechanically temporarily joined members by immersing them in liquid, but the surface oxide destroyed by ultrasonic waves is It is unavoidable that it remains at the seam. Furthermore, Japanese Patent Application Laid-Open No. 144444/1983 discloses a method in which two tubes are ultrasonically soldered separately, and then they are pulled up and overlapped and joined together before the solder solidifies on both tubes. However, as long as bonding is performed in the atmosphere, it is extremely difficult to completely eliminate the generation of oxides. None of these contribute to achieving the objectives of the present invention.

[Problem that the invention seeks to solve]

As long as two boards are bonded together in the atmosphere, there is no possibility of foreign matter adhering to the bonding surface. In the present invention, both surfaces to be bonded are cleaned in the same solution, and then they are overlapped and temporarily tightened in the solution, and then taken out into the atmosphere without any contact with the air, and pressed and solidified. In this way, the problem was solved.

〔Example〕

The drawings will be explained using an example in which a copper portion C is soldered to a battledore-shaped portion of an aluminum terminal A.

A melting furnace 1 contains a brazing metal solution 2. This furnace has an ultrasonic oscillation function. The aluminum terminal A is heated in the atmosphere to a higher temperature than the brazing material solution, immersed in the solution, and supported on the support 3. Copper plate C is similarly heated in the atmosphere and immersed while being held between scissors. The solution is subjected to ultrasonic oscillation. Cast aluminum terminals have a thick oxide film on their outer skin, making it difficult for brazing metal to adhere to them. On the other hand, since the adhesive surfaces of both base materials A and C are machined, the oxide film is thin and easily destroyed by ultrasonic waves. Therefore, this surface can be easily wetted with wax. The oxide destroyed at the adhesive surface of both base materials A and C is light, so it separates from the base metal and floats to the liquid surface. In order to completely remove the separated contaminants from the adhesive surface, the solution is allowed to flow or the base material is shaken in the solution. After cleaning the surface of the base material in this way, the copper plate C is placed on the surface of the terminal A in the same solution, and the two are temporarily tightened using scissor-like clamping tools 4, so that they are clamped without any room for air to enter. . This is pulled up and placed on the pedestal 5 of the hydraulic press P, and strongly pressed with the presser plate 6. This eliminates excess solution in both matrix materials, resulting in a thin layer. This layer consists of the presser plate 6 and the pedestal 5.
However, since pressurization continues, no defects are caused by shrinkage. Once solidified, finish by buffing the end face of the adhesive part and the equipment adhesive surface of the copper plate. As mentioned above, there is little brazing material adhering to surfaces other than the adhesive surface, so a simple brushing will clean it.

[Effects] In the present invention, there is no exposure to air during the soldering process, so an ideal bonding state can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an aluminum terminal, FIG. 2 is a front view of a melting furnace, FIG. 3 is an explanatory view of a clamping tool that holds both base bodies in a solution, and FIG. 4 is an explanatory view of a hydraulic press. 1...Melting furnace, 2...Solution, 3...Support, 4
...Pinching tool, 5...Receptacle, 6...Press plate, A...
...Aluminum terminal, C...Copper plate, P...Hydraulic press.

Claims (1)

[Claims] 1. Melt the wax in a melting furnace with an ultrasonic oscillation function, preheat both base materials to be soldered to a temperature appropriately higher than the liquidus temperature of the respective solder materials, and immerse both base materials in the wax solution. After applying ultrasonic oscillation to the solution and moving the solution and both base materials relative to each other to remove oxides from the surfaces to be joined of the base materials, the surfaces to be joined of both base materials are placed on top of each other in the solution, and the same solution is removed. A brazing method for metal plates that is temporarily clamped in a chamber, then pulled up and pressed to solidify.