JPS6142892Y2 - - Google Patents
Info
- Publication number
- JPS6142892Y2 JPS6142892Y2 JP1981196548U JP19654881U JPS6142892Y2 JP S6142892 Y2 JPS6142892 Y2 JP S6142892Y2 JP 1981196548 U JP1981196548 U JP 1981196548U JP 19654881 U JP19654881 U JP 19654881U JP S6142892 Y2 JPS6142892 Y2 JP S6142892Y2
- Authority
- JP
- Japan
- Prior art keywords
- foam
- conductive
- electronic components
- present
- carbon black
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006260 foam Substances 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 11
- 229920005672 polyolefin resin Polymers 0.000 claims description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 230000005611 electricity Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Conductive Materials (AREA)
- Buffer Packaging (AREA)
- Packages (AREA)
Description
【考案の詳細な説明】 本考案は導電性発泡体に関する。[Detailed explanation of the idea] The present invention relates to conductive foams.
IC，LSI等の集積回路、その他の電子部品を静
電気や衝撃による破損から保護する緩衝包装材に
は、近年、導電性を有する素材が用いられるよう
になつており、これら導電性緩衝包装材として
は、アルミ蒸着タイプインジエクシヨン成形品、
アルミ蒸着フイルム貼合シートによる製袋品、カ
ーボンブラツク含浸インジエクシヨン成形品、カ
ーボンブラツク含浸ウレタンフオーム等が用いら
れている。 In recent years, conductive materials have been used for cushioning packaging materials that protect integrated circuits such as ICs, LSIs, and other electronic components from damage caused by static electricity and shock. is an aluminum vapor deposition type injection molded product,
Bag products made from sheets laminated with aluminum vapor-deposited films, carbon black-impregnated injection molded products, carbon black-impregnated urethane foam, etc. are used.
しかしアルミ蒸着品は蒸着層が非常に薄い為、
使用中にアルミ蒸着層が剥れやすく、電気抵抗値
の上昇が起こる欠点がある。またカーボンブラツ
ク含浸インジエクシヨン成形品は硬く、緩衝性に
欠ける欠点があり、カーボンブラツク含浸ウレタ
ンフオームは、カーボンブラツクを混入した塗料
をウレタンフオームに含浸せしめたものである
が、単に含浸せしめたのにすぎない為使用中にカ
ーボンの浮遊が生じ、電気抵抗値の上昇や、浮遊
したカーボンにより集積回路等の電子部品が汚染
される等の問題がある。更にカーボンブラツク含
浸ウレタンフオームは集積回路等の電子部品の端
子ピンを、突き刺して使用する際や運搬時にウレ
タンフオームが崩れ、端子ピンが傷付き、またウ
レタンフオームに含まれる硫黄により端子ピンに
錆が発生し、更にフオームの気泡が粗く摩擦抵抗
が小さい為、電子部品が抜けやすい等の欠点があ
る。 However, since the vapor deposited layer of aluminum vapor-deposited products is very thin,
The disadvantage is that the aluminum vapor deposited layer easily peels off during use, resulting in an increase in electrical resistance. In addition, carbon black-impregnated injection molded products are hard and have the disadvantage of lacking cushioning properties, and carbon black-impregnated urethane foam is made by impregnating urethane foam with paint mixed with carbon black, but it is simply impregnated. As a result, carbon floats during use, causing problems such as an increase in electrical resistance and contamination of electronic components such as integrated circuits by the floating carbon. Furthermore, when carbon black-impregnated urethane foam is used to pierce terminal pins of electronic components such as integrated circuits, or during transportation, the urethane foam collapses and damages the terminal pins, and the sulfur contained in the urethane foam causes rust on the terminal pins. Furthermore, since the bubbles in the foam are coarse and the frictional resistance is low, there are drawbacks such as electronic parts easily coming off.
また静電気による集積回路等の電子部品の破損
を防止する為に、緩衝包装材の電気抵抗値は、半
導体の電気抵抗値である105Ω／cmが理想である
とされているが、従来の緩衝包装材は衝撃に対す
る緩衝性は優れていても、電気抵抗値が107Ω／
cm以上を示し、静電気の導電性に乏しいものが多
く、たとえ導電性に優れていても衝撃に対する緩
衝性に乏しいもの、導電性能を長期間保持できな
いもの等、電子部品を保護する為の緩衝包装材と
して充分な機能を有するものはなかつた。 In addition, in order to prevent damage to electronic components such as integrated circuits due to static electricity, the ideal electrical resistance value of the cushioning packaging material is 10 5 Ω/cm, which is the electrical resistance value of semiconductors. Although shock-absorbing packaging materials have excellent shock-absorbing properties, their electrical resistance is 10 7 Ω/
Cushioning packaging to protect electronic components, such as those that exhibit a static electricity conductivity of more than cm and have poor static electricity conductivity, and even if they have excellent conductivity, they have poor impact cushioning properties, and those that cannot maintain conductive performance for a long period of time. There was nothing that had sufficient functionality as a material.
本考案はこれらの点に鑑みなされたもので、衝
撃に対する緩衝性、及び静電気の導電性に優れた
導電性発泡体を提供せんとするものである。 The present invention has been devised in view of these points, and aims to provide a conductive foam that has excellent shock-absorbing properties and static electricity conductivity.
即ち、本考案は、ポリオレフイン系樹脂とエチ
レン−酢酸ビニル共重合体からなる発泡体に導電
性素材を含有せしめてなり且つ0.02〜0.50ｇ／cm3
の密度を有してなることを特徴とする導電性発泡
体を要旨とする。 That is, the present invention comprises a foam made of a polyolefin resin and an ethylene-vinyl acetate copolymer containing a conductive material and having a conductive material of 0.02 to 0.50 g/cm 3 .
The subject matter is a conductive foam characterized by having a density of .
以下、本考案の一実施例を図面に基き説明す
る。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図、第２図に示すごとく、本考案の導電性
発泡体１は集積回路等の電子部品２の端子ピン３
を突き刺して固定することにより、電子部品２を
保管、運搬中の振動、衝撃や、静電気による破損
より保護するものである。導電性発泡体１の材質
は、導電性素材を混練してなるポリオレフイン系
樹脂と、エチレン−酢酸ビニル共重合体との混合
物であり、その混合比はポリオレフイン系樹脂
100重量部に対しエチレン−酢酸ビニル共重合体
30〜100重量部が好ましい。ポリオレフイン系樹
脂としては例えば低密度ポリエチレン、高密度ポ
リエチレン、ポリプロピレン、エチレン−プロピ
レン共重合体等が挙げられる。導電性素材として
はカーボンブラツク、グラフアイト、アルミニウ
ム、銅、ニツケル等が挙げられるが、カーボンブ
ラツクの使用が好ましい。導電性素材の好ましい
添加量は、ポリオレフイン系樹脂100重量部に対
して５〜30重量部である。導電性発泡体１の電気
抵抗値は104〜106Ω／cmであり、106Ω／cmを越
えると静電気の帯電量が多くなる為、また104
Ω／cm未満では導電性が良くなり過ぎ、静電気が
一度に通電してしまう為、いずれの場合も電子部
品２の機能が破壊される。また導電性発泡体１の
密度は0.02〜0.50ｇ／cm3とする必要があり、密度
が0.02ｇ／cm3未満では電子部品２に対する保持性
や機械的強度が低下し、また密度が0.50ｇ／cm3を
越えると、衝撃に対する緩衝性が低下する。 As shown in FIGS. 1 and 2, the conductive foam 1 of the present invention is used for terminal pins 3 of electronic components 2 such as integrated circuits.
By piercing and fixing, the electronic component 2 is protected from damage caused by vibration, shock, and static electricity during storage and transportation. The material of the conductive foam 1 is a mixture of polyolefin resin made by kneading conductive materials and ethylene-vinyl acetate copolymer, and the mixing ratio is
Ethylene-vinyl acetate copolymer per 100 parts by weight
30 to 100 parts by weight is preferred. Examples of the polyolefin resin include low density polyethylene, high density polyethylene, polypropylene, and ethylene-propylene copolymer. Examples of the conductive material include carbon black, graphite, aluminum, copper, and nickel, but carbon black is preferably used. A preferable amount of the conductive material added is 5 to 30 parts by weight per 100 parts by weight of the polyolefin resin. The electrical resistance value of the conductive foam 1 is 10 4 to 10 6 Ω/cm, and if it exceeds 10 6 Ω/cm, the amount of static electricity will increase;
If it is less than Ω/cm, the conductivity will be too good and static electricity will be applied all at once, so the function of the electronic component 2 will be destroyed in either case. In addition, the density of the conductive foam 1 must be 0.02 to 0.50 g/cm 3 . If the density is less than 0.02 g/cm 3 , the retention property and mechanical strength for the electronic component 2 will decrease, and if the density is less than 0.50 g /cm 3 , the shock-absorbing properties decrease.
本考案の導電性積層体１の厚みは電子部品２の
端子ピン３の突出長さ（電子部品底面から端子ピ
ン先端までの長さ）より厚ければいかなる厚みで
あつてもかまわないが、電子部品２の保護とコス
ト低減の両面から、３〜10mm程度が好ましい。 The thickness of the conductive laminate 1 of the present invention may be any thickness as long as it is thicker than the protruding length of the terminal pin 3 of the electronic component 2 (the length from the bottom of the electronic component to the tip of the terminal pin). From the viewpoint of both protection of the component 2 and cost reduction, the thickness is preferably about 3 to 10 mm.
本考案の導電性発泡体は例えば次の方法で得る
ことができる。即ちポリエチレン100重量部に対
し、エチレン−酢酸ビニル共重合体30〜100重量
部及びカーボンブラツク５〜30重量部、ブタン
（発泡剤）５〜30重量部を混練した混合物を押出
発泡成形することにより本考案の導電性発泡体を
製造することができる。 The conductive foam of the present invention can be obtained, for example, by the following method. That is, by extrusion foaming a mixture of 100 parts by weight of polyethylene, 30 to 100 parts by weight of ethylene-vinyl acetate copolymer, 5 to 30 parts by weight of carbon black, and 5 to 30 parts by weight of butane (foaming agent). The conductive foam of the present invention can be manufactured.
以上述べた如く本考案の導電性発泡体は、その
基材樹脂として、ポリオレフイン系樹脂とエチレ
ン−酢酸ビニル共重合体との混合物を用いたこと
により、導電性素材を含有せしめても発泡体が硬
くなることがなく導電性発泡体の割れ防止や、電
子部品の端子ピンの傷付きを防止できるととも
に、ポリオレフイン系樹脂発泡体の特徴である気
泡の細かい発泡構造を有し、電子部品の端子ピン
との摩擦抵抗が大きい為、ウレタンフオームのよ
うに固定した電子部品が振動により抜けることな
く、確実に電子部品を固定できる。また導電性素
材を樹脂中に練り込んだ後発泡させたものである
為、カーボン等の導電性素材の浮遊が起こる虞れ
がない為、電気抵抗値の上昇や、浮遊した導電性
素材により電子部品が汚染される等の問題もな
い。 As mentioned above, the conductive foam of the present invention uses a mixture of polyolefin resin and ethylene-vinyl acetate copolymer as its base resin, so that even if it contains a conductive material, the foam remains stable. It does not become hard and prevents cracking of conductive foam and prevents damage to terminal pins of electronic components.It also has a fine foam structure with fine cells, which is a characteristic of polyolefin resin foam, and is suitable for terminal pins of electronic components. Because of its high frictional resistance, electronic components can be securely fixed without coming off due to vibrations, such as with urethane foam. In addition, since the conductive material is kneaded into the resin and then foamed, there is no risk of floating conductive materials such as carbon. There are no problems such as parts being contaminated.
又、カーボンブラツク含浸ウレタンフオームの
如く、電子部品の端子ピンに錆が発生する、とい
う問題点もない。しかも発泡体の密度を0.02〜
0.50ｇ／cm3としたことにより、衝撃緩衝性及び電
子部品の保持性を更に一段と向上せしめることが
できる。 Furthermore, unlike carbon black impregnated urethane foam, there is no problem of rust occurring on the terminal pins of electronic components. Moreover, the density of the foam is 0.02 ~
By setting the weight to 0.50 g/cm 3 , the shock-absorbing properties and the ability to hold electronic components can be further improved.
しかして本考案の導電性発泡体によれば、電子
部品の運搬、保管に当つて電子部品を確実に保護
し、その破損や性能劣下を防止できる効果があ
る。 Therefore, the conductive foam of the present invention has the effect of reliably protecting electronic components during transportation and storage, and preventing their damage and performance deterioration.
更に、本考案の導電性発泡体はその材質よりし
て極めて軽量であり、特に航空機による輸送には
好適であるとともに反復しての使用が可能であ
り、しかも安価に提供できる利点を有する。 Furthermore, the conductive foam of the present invention is extremely lightweight compared to the material it is made of, making it particularly suitable for transportation by aircraft, allowing for repeated use, and having the advantage of being inexpensive.
図面は本考案の一実施例を示すものであり、第
１図は、本考案導電性発泡体に電子部品を固定し
た状態を示す斜視略図、第２図は、第１図の−
線に沿う縦断面略図である。
１……導電性発泡体、２……電子部品、３……
端子ピン。
The drawings show one embodiment of the present invention, and FIG. 1 is a schematic perspective view showing a state in which electronic components are fixed to the conductive foam of the present invention, and FIG.
It is a longitudinal section schematic diagram along a line. 1... Conductive foam, 2... Electronic component, 3...
terminal pin.
Claims (1)
共重合体との混合物からなる発泡体に導電性素材
を含有せしめてなり、且つ0.02〜0.50ｇ／cm3の密
度を有してなることを特徴とする導電性発泡体。 A conductive material comprising a foam made of a mixture of a polyolefin resin and an ethylene-vinyl acetate copolymer containing a conductive material, and having a density of 0.02 to 0.50 g/cm 3 foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19654881U JPS58101847U (en) | 1981-12-28 | 1981-12-28 | conductive foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19654881U JPS58101847U (en) | 1981-12-28 | 1981-12-28 | conductive foam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58101847U JPS58101847U (en) | 1983-07-11 |
| JPS6142892Y2 true JPS6142892Y2 (en) | 1986-12-05 |
Family
ID=30109787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19654881U Granted JPS58101847U (en) | 1981-12-28 | 1981-12-28 | conductive foam |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58101847U (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4847958A (en) * | 1971-10-21 | 1973-07-07 | ||
| JPS5023908A (en) * | 1973-07-03 | 1975-03-14 | ||
| JPS5083470A (en) * | 1973-11-26 | 1975-07-05 | ||
| JPS5122951A (en) * | 1974-08-16 | 1976-02-24 | Yoshio Ihara | EAAENJIN |
| JPS5218232A (en) * | 1975-08-01 | 1977-02-10 | Misao Okabe | Two ways change over valve equipped with water timer |
| JPS5277174A (en) * | 1975-12-24 | 1977-06-29 | Japan Styrene Paper Corp | Process for foaming of polymer particle |
| JPS5589336A (en) * | 1978-12-27 | 1980-07-05 | Miyoshi Oil & Fat Co Ltd | Porous plastic with bactericidal activity |
| JPS5673804A (en) * | 1979-11-20 | 1981-06-18 | Dainichi Nippon Cables Ltd | Semiconductor composition |
| JPS5840326A (en) * | 1981-08-13 | 1983-03-09 | Asahi Chem Ind Co Ltd | Foamable polyolefin resin composition |
-
1981
- 1981-12-28 JP JP19654881U patent/JPS58101847U/en active Granted
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4847958A (en) * | 1971-10-21 | 1973-07-07 | ||
| JPS5023908A (en) * | 1973-07-03 | 1975-03-14 | ||
| JPS5083470A (en) * | 1973-11-26 | 1975-07-05 | ||
| JPS5122951A (en) * | 1974-08-16 | 1976-02-24 | Yoshio Ihara | EAAENJIN |
| JPS5218232A (en) * | 1975-08-01 | 1977-02-10 | Misao Okabe | Two ways change over valve equipped with water timer |
| JPS5277174A (en) * | 1975-12-24 | 1977-06-29 | Japan Styrene Paper Corp | Process for foaming of polymer particle |
| JPS5589336A (en) * | 1978-12-27 | 1980-07-05 | Miyoshi Oil & Fat Co Ltd | Porous plastic with bactericidal activity |
| JPS5673804A (en) * | 1979-11-20 | 1981-06-18 | Dainichi Nippon Cables Ltd | Semiconductor composition |
| JPS5840326A (en) * | 1981-08-13 | 1983-03-09 | Asahi Chem Ind Co Ltd | Foamable polyolefin resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58101847U (en) | 1983-07-11 |
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