JPS6142822A - Method of producing low dielectric constant copper-lined insulating film - Google Patents
Method of producing low dielectric constant copper-lined insulating filmInfo
- Publication number
- JPS6142822A JPS6142822A JP16438384A JP16438384A JPS6142822A JP S6142822 A JPS6142822 A JP S6142822A JP 16438384 A JP16438384 A JP 16438384A JP 16438384 A JP16438384 A JP 16438384A JP S6142822 A JPS6142822 A JP S6142822A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- low dielectric
- dielectric constant
- fluororesin
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processes Specially Adapted For Manufacturing Cables (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は高周波機器に使用される銅張り積層板等の低誘
電率銅張り絶縁皮膜の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for producing a low dielectric constant copper-clad insulating film such as a copper-clad laminate used in high-frequency equipment.
一般に高周波用プリント基板としては、誘電率の低いガ
ラス基材入りのフッ素樹脂基板が広く使用されているが
、これはガラス基材にエマルジョン化されたフッ素樹脂
を含浸した後予備乾燥し、その後フッ素樹脂含浸ガラス
基材を所定の厚みに積層し、さらに銅箔を重ねて50k
g/cJ程度の圧力で400℃付近の温度に数時間保持
して銅張り積層板を製造するか、あるいはフレキシブル
用の基板とするにはフッ素樹脂を所定の膜厚をもつシー
トに成形する工程、例えばフッ素樹脂原料を焼成してイ
ンゴットを作り、二九を切肖りしてフ□・ルム状にした
ものを圧延して、さらに加熱処理する工程を経て得られ
たシートの表面を活性化処理して接着性を向上させてか
ら、銅箔を連続的に貼ることにより銅張り基板とするか
、もしくはフィルムの加熱処理工程で銅箔を溶融接着し
て銅張り基板を製造する。In general, fluororesin substrates with a glass base material with a low dielectric constant are widely used as high-frequency printed circuit boards, but these are made by impregnating the glass base material with an emulsion of fluororesin, pre-drying it, and then applying fluorocarbon resin. Laminate resin-impregnated glass substrates to a specified thickness, and then layer copper foil to 50k.
A process in which copper-clad laminates are manufactured by holding the temperature at around 400°C for several hours under pressure of about g/cJ, or by molding fluororesin into a sheet with a predetermined thickness for flexible substrates. For example, a fluororesin raw material is fired to make an ingot, the ingot is cut into a film, rolled, and then heat treated to activate the surface of the sheet. After treatment to improve adhesion, a copper-clad board is manufactured by continuously pasting copper foil, or by melt-bonding the copper foil in a film heat treatment process.
しかるに、上記いずれの方法においても多くの工程が必
要であり、今後高周波用の基板としてフッ素樹脂基板が
広く採用されるためには、工程の簡略化による製造コス
トの低減が不可欠である。However, all of the above methods require many steps, and in order for fluororesin substrates to be widely adopted as high-frequency substrates in the future, it is essential to reduce manufacturing costs by simplifying the steps.
本発明は上記欠点を改善する目的でなされたもので、フ
ッ素樹脂の水性ディスパージョン中で。The present invention was made for the purpose of improving the above-mentioned drawbacks, and was made in an aqueous dispersion of a fluororesin.
高温で熱分解性の良好なビニル系モノマを乳化重合した
液を電着塗料として用い、繊維状基材を重合した銅箔上
に電着塗装法を利用して電着析出層を形成させ、次いで
必要により上記析出層を有機溶剤で処理した後、高温で
短時間加熱して析出層中のビニル系樹脂を分解揮発させ
ることにより。Using a liquid obtained by emulsion polymerization of a vinyl monomer that has good thermal decomposition properties at high temperatures as an electrodeposition coating, an electrodeposition layer is formed using an electrodeposition coating method on a copper foil that has been polymerized with a fibrous base material. Then, if necessary, the deposited layer is treated with an organic solvent, and then heated at a high temperature for a short time to decompose and volatilize the vinyl resin in the deposited layer.
経済的、高信頼性でかつ連続生産が可能な低誘電率銅張
り絶縁皮膜の製造方法を提案するものである。This paper proposes a method for manufacturing low dielectric constant copper-clad insulation films that is economical, highly reliable, and capable of continuous production.
本発明では銅箔上に繊維状基材を重合したものを被塗装
体とする。ここで使用される繊維状基材としではガラス
m I11+が主として使用され、低誘電率の点から石
英繊維が好適であり、例えばガラスクロス(有沢製作所
製、EPCO50,EPCI02、EPC160,LP
CO70,LPCIIOなど)が使用可能である。In the present invention, the object to be coated is a material obtained by polymerizing a fibrous base material on a copper foil. As the fibrous base material used here, glass m I11+ is mainly used, and quartz fiber is suitable from the viewpoint of low dielectric constant, such as glass cloth (manufactured by Arisawa Seisakusho, EPCO50, EPCI02, EPC160, LP).
CO70, LPCIIO, etc.) can be used.
本発明で使用されるフッ素樹脂としては、ポリテトラフ
ルオロエチレン、ポリトリフルオロクロロエチレン、ポ
リフッ化ビニル、ポリフッ化ビニリデン、ジクロルジフ
ルオロエチレンなどがあげられ、好適なものとしては、
ポリテトラプルオロエチレン、テトラフルオロエチレン
−ヘキサフルオロプロピレン共重合物などがあげられ、
その水性ディスパージョンが任意に用いられ1例えば三
井フロロケミカル社製のテフロン120やテフロン30
−Jなどがあげられる。Examples of the fluororesin used in the present invention include polytetrafluoroethylene, polytrifluorochloroethylene, polyvinyl fluoride, polyvinylidene fluoride, dichlorodifluoroethylene, etc., and preferred ones include:
Examples include polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, etc.
The aqueous dispersion is optionally used, such as Teflon 120 or Teflon 30 manufactured by Mitsui Fluorochemical Co., Ltd.
-J etc.
本発明において、フッ素樹脂の水性ディスパージョン中
で乳化重合するに用いられる。ビニルモノマとしては高
温で熱分解性の良好なものが使用され、例えばアクリル
酸エチル、アクリル酸ブチル、メタクリル酸メチル、メ
タクリル酸ブチルなどのアクリル酸エステル類やメタク
リル酸エステル類の1種または複数種のものが好適なも
のとしてあげら九る。これらのビニルモノマはフッ素樹
脂の水性ディスパージョンの電着にあたり、バインダ的
な役割を果たして、締まりの良い電着析出層の形成を助
け、かつ加熱時に皮膜形成を容易にする。In the present invention, it is used for emulsion polymerization in an aqueous dispersion of a fluororesin. The vinyl monomer used is one that is thermally decomposable at high temperatures, such as one or more of acrylic esters and methacrylic esters such as ethyl acrylate, butyl acrylate, methyl methacrylate, and butyl methacrylate. There are nine things that are suitable. These vinyl monomers play the role of a binder during electrodeposition of the aqueous dispersion of fluororesin, help form a tight electrodeposited layer, and facilitate film formation during heating.
ビニルモノマはフッ素樹脂の水性ディスパージョン10
0重量部(固形分)に対し3〜20重量部、好ましくは
5〜10重量部用いられる。3重量部未満であればバイ
ンダ的な効果が少なくて均一な皮膜が得られ難く、また
20重量部を超えると、加熱分解時に押発量が多くなり
、ピンホールを発生しやすくなる。The vinyl monomer is an aqueous dispersion of fluororesin 10
It is used in an amount of 3 to 20 parts by weight, preferably 5 to 10 parts by weight, based on 0 parts by weight (solid content). If it is less than 3 parts by weight, the binder effect will be small and it will be difficult to obtain a uniform film, and if it exceeds 20 parts by weight, the amount of extrusion will increase during thermal decomposition and pinholes will easily occur.
フッ素樹脂の水性ディスパージョン中でビニルモノマを
乳化重合するにあたり、用いる乳化剤としては非イオン
、アニオン、カチオンなどの界面活性剤が用いられるが
、電着性の点からアニオン活性剤が好適に使用され1例
えばラウリル硫酸エステルナトリウム、ドデシル硫酸ナ
トリウム、オレイル硫酸ナトリウ、−,l+などの飽和
または不飽和高級アルコールの硫酸エステル塩、ドデシ
ルスルホン酸ナトリウム、ドデシルベンゼンスルホン酸
ナトリウムなどのスルホン酸塩があげられる。乳化剤の
使用量は特に制限はないが、電着性、乳化安定性の点か
らビニルモノマ100重量部に対して0.5〜5重量部
が好適である。When emulsion polymerizing a vinyl monomer in an aqueous dispersion of a fluororesin, nonionic, anionic, or cationic surfactants are used as emulsifiers, but anionic surfactants are preferably used from the viewpoint of electrodepositivity. Examples include sodium lauryl sulfate, sodium dodecyl sulfate, sodium oleyl sulfate, sulfate ester salts of saturated or unsaturated higher alcohols such as -, l+, and sulfonates such as sodium dodecyl sulfonate and sodium dodecylbenzenesulfonate. The amount of the emulsifier used is not particularly limited, but from the viewpoint of electrodepositivity and emulsion stability, it is preferably 0.5 to 5 parts by weight per 100 parts by weight of the vinyl monomer.
ビニルモノマを乳化重合するために用いる重合開始剤と
しては、通常のものが何ら制限なしに使用されるが、過
硫酸カリウム−亜硫酸水素ナトリウム、過硫酸アンモニ
ウム−亜硫酸水素ナトリウ11のレドックス系開始剤が
特に好適なものとしてあげられる。これらの重合開始剤
の量は、ビニルモノマ100重量部に対して0.01〜
10重量部の範囲で適宜用いられる。As the polymerization initiator used for emulsion polymerization of the vinyl monomer, ordinary initiators can be used without any restrictions, but redox initiators such as potassium persulfate-sodium hydrogen sulfite and ammonium persulfate-sodium hydrogen sulfite 11 are particularly preferred. It can be given as something. The amount of these polymerization initiators is 0.01 to 100 parts by weight of vinyl monomer.
It is used appropriately within a range of 10 parts by weight.
フッ素樹脂の水性ディスパージボン中でビニルモノマを
乳化重合すると、フン素樹脂を被覆するJ、うに付着し
たビニル系樹脂が得られ、そのまま電着塗料として用い
られる。フッ素樹脂の水性ディスパージョン中でビニル
モノマを乳化重合して得られた水分散液中に被塗装体を
浸して陽極とし、直流電流を対電極との間に流すと、電
着塗装が行われ、電気泳動により被塗装体に上記樹脂が
付着し、電着析出層が形成される。電着条件は必要な膜
厚に応じて、印加の電圧が5〜100v程度で、適宜実
施することができる。When a vinyl monomer is emulsion polymerized in an aqueous dispersion of a fluororesin, a vinyl resin that coats the fluororesin and adheres to the sea urchin is obtained, which can be used as it is as an electrodeposition paint. The object to be coated is immersed in an aqueous dispersion obtained by emulsion polymerization of a vinyl monomer in an aqueous dispersion of fluororesin to serve as an anode, and when a direct current is passed between it and the counter electrode, electrodeposition coating is performed. The resin adheres to the object to be coated by electrophoresis, forming an electrodeposited layer. Electrodeposition conditions can be suitably implemented with an applied voltage of about 5 to 100 V depending on the required film thickness.
上記により得られた電着析出層を加熱して連続皮膜を形
成させるにあたり、皮膜形成を容易にするために、加熱
前に、電着析出層中のビニル系樹脂を溶解または膨潤さ
せる親水性有機溶剤で処理することが有用である。好適
な親水性有機溶剤としては、N−メチルピロリドン、ジ
メチルホルムアミド、ジメチルアセトアミド、ジメチル
スルホンアミド、エチルセロソルブなどの極性溶剤があ
げられる。有機溶剤処理の方法としては、溶剤の液に浸
漬するか蒸気に接触させる方法がある。When heating the electrodeposited layer obtained above to form a continuous film, in order to facilitate film formation, a hydrophilic organic material that dissolves or swells the vinyl resin in the electrodeposited layer is used before heating. Solvent treatment is useful. Suitable hydrophilic organic solvents include polar solvents such as N-methylpyrrolidone, dimethylformamide, dimethylacetamide, dimethylsulfonamide, and ethyl cellosolve. Methods for organic solvent treatment include immersion in a solvent solution or contact with steam.
こうして処理された電着祈出層を加熱するとビニルポリ
マが分解揮発するとともに水分も除去され、連続皮膜が
形成される。加熱温度は用いたビニル系樹脂の熱分解温
度およびフッ素樹脂の溶射温度により異なφが、400
〜600℃の範囲で適宜選択される。加熱方法としては
種々の方法が採用されるが、電着析出層中のビニル系樹
脂を速やかに分解揮発させるために通電加熱、誘導加熱
、オーブン加熱などが好適な方法としてあげられる。When the electrodeposited prayer layer thus treated is heated, the vinyl polymer is decomposed and volatilized, and water is also removed, forming a continuous film. The heating temperature varies depending on the thermal decomposition temperature of the vinyl resin used and the thermal spraying temperature of the fluororesin.
The temperature is appropriately selected within the range of ~600°C. Various methods can be employed as the heating method, but suitable methods include electrical heating, induction heating, oven heating, etc. in order to rapidly decompose and volatilize the vinyl resin in the electrodeposited layer.
以下、本発明の実施例を図について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図は本発明の一実施例による製造方法を示す系統図であ
る。Wi造方法は、銅箔(1)および繊維状基材(ガラ
スクロス)(2)が送り出され、ローラ(3)。The figure is a system diagram showing a manufacturing method according to an embodiment of the present invention. In the Wi-making method, a copper foil (1) and a fibrous base material (glass cloth) (2) are sent out, and then rolled to a roller (3).
(4)により重合された状態で、ローラ(5)を介して
表面が絶縁されたローラ(6)により対向電極(7)を
設けた電着槽(8)に送り込まれ、ローラ(6)に接し
た点から直流電1(13)により電圧が印加され電着析
出層が形成される。次いで、有機溶剤蒸気槽(9)で電
着析出層が処理された後、加熱炉(10)で水分、有機
溶剤およびバインダが分解揮発されて銅張り絶縁皮膜が
形成され、冷却後ローラ(11)を介して巻取M&(1
2)に巻取ら九る6
参考例:電着塗料の製造
本発明に使用する電着塗料の製造法の一例を次に述べる
。まず、四つロフラスコにポリテ1−ラフルオロエチレ
ンディスバージョン(テフロン 30− J 、 ’e
jN分60%、三井フロロケミカル社製)20Q、イオ
ン交換水102、ラウリル硫酸エステルソーダ6gを加
え、窒素ガスを通じて30分間かくはんし、70℃に昇
温し、過硫酸アンモニウム6g、亜硫酸水素ナトリウム
2gをイオン交換水20gに溶解させた液を加え、直ち
にメチルメタクリレート600gを30分かかつて滴下
し、滴下終了後70℃で2時間反応させる。次にイオン
交換水を加え、全不揮発分20%の水分散液を得る。The polymerized state obtained by (4) is sent via a roller (5) to an electrodeposition bath (8) provided with a counter electrode (7) by a roller (6) whose surface is insulated, and then A voltage is applied by the DC voltage 1 (13) from the point of contact, and an electrodeposited layer is formed. Next, after the electrodeposited layer is treated in an organic solvent vapor tank (9), water, organic solvent, and binder are decomposed and volatilized in a heating furnace (10) to form a copper-clad insulating film, and after cooling, the electrodeposited layer is heated to a roller (11). ) through winding M&(1
2) Winding up and rolling 6 Reference example: Manufacture of electrodeposition paint An example of a method for manufacturing the electrodeposition paint used in the present invention will be described below. First, polytetrafluoroethylene dispersion (Teflon 30-J, 'e
jN content 60%, manufactured by Mitsui Fluorochemical Co., Ltd.) 20Q, ion exchange water 102, and lauryl sulfate ester soda 6 g were added, stirred for 30 minutes through nitrogen gas, heated to 70 ° C., and added 6 g of ammonium persulfate and 2 g of sodium hydrogen sulfite. A solution dissolved in 20 g of ion-exchanged water is added, and 600 g of methyl methacrylate is immediately added dropwise over 30 minutes. After the addition is complete, the mixture is reacted at 70° C. for 2 hours. Next, ion-exchanged water is added to obtain an aqueous dispersion with a total nonvolatile content of 20%.
実施例1〜7
表1に示す電着塗料を用いて、図の製造方法により1幅
500mm、厚さ35μmの連続した銅箔に表1の繊維
状基材を重合して、銅箔側を陽極とし直流電圧50Vを
印加し、電着析出層を形成する。次いでこの析出層を有
機溶剤蒸気で処理した後、通電加熱により表1に示す最
高温度下で熱処理し、冷却後、巻取ることにより銅張り
絶縁皮膜を得る。特性を表1に併記する。なお銅箔の速
度は1〜1oIl/minが好適に使用されるが、これ
に限定されるものではない。Examples 1 to 7 Using the electrodeposition paint shown in Table 1, the fibrous base material shown in Table 1 was polymerized on a continuous copper foil of 500 mm width and 35 μm thickness according to the manufacturing method shown in the figure, and the copper foil side was A DC voltage of 50 V is applied to the anode to form an electrodeposited layer. Next, this deposited layer is treated with organic solvent vapor, then heat-treated by electrical heating at the maximum temperature shown in Table 1, cooled, and then rolled up to obtain a copper-clad insulating film. The characteristics are also listed in Table 1. Note that the speed of the copper foil is preferably 1 to 1 oIl/min, but is not limited to this.
表1の実施例で明らかなように、本発明による絶縁皮膜
は、vI電電率比較例のガラス/エポキシ皮膜に比べて
低く、また誘電正接も非常に低いものである。さらに本
実施例では、より高周波側(I M)lz以上)では、
さらにガラス/エポキシに沈入て差が大きくなることが
予想される。As is clear from the examples in Table 1, the insulating film according to the present invention has a lower vI electric current than the glass/epoxy film of the comparative example, and also has a very low dielectric loss tangent. Furthermore, in this embodiment, on the higher frequency side (IM)lz or higher),
Further, it is expected that the difference will become larger due to precipitation in glass/epoxy.
なお、以上の説明において、フッ素樹脂の水性アイスバ
ージョン、ビニルモノマ、加熱方法等は前記例示のもの
に限らず、変更可能である。また本発明は高周波用プリ
ント基板に限らず、他の用途の銅張り絶縁皮膜の製造に
適用可能である。In the above description, the water-based ice version of the fluororesin, the vinyl monomer, the heating method, etc. are not limited to those exemplified above, and may be changed. Furthermore, the present invention is applicable not only to high-frequency printed circuit boards but also to the production of copper-clad insulating films for other uses.
本発明によれば、バインダを含むフッ素樹脂溶液により
電着析出層を形成した後、バインダを揮発させるように
したので、経済的、高信頼性で連続的に低誘電率銅張り
絶縁皮膜を製造することができる。According to the present invention, after forming an electrodeposited layer using a fluororesin solution containing a binder, the binder is volatilized, so that a low dielectric constant copper-clad insulation film can be manufactured continuously, economically and with high reliability. can do.
図はこの発明の一実施例を示す系統図であり、(1)は
銅箔、(2)は繊維状基材、(3)〜(6)、(11)
はローラ、(7)は対向電極、(8)は電着槽、(9)
は有機溶剤蒸気槽、 (io)は加熱炉である。The figure is a system diagram showing one embodiment of the present invention, in which (1) is a copper foil, (2) is a fibrous base material, (3) to (6), and (11).
is a roller, (7) is a counter electrode, (8) is an electrodeposition bath, (9)
is an organic solvent vapor tank, and (io) is a heating furnace.
Claims (4)
性ディスパージョン中で熱分解性の良好なビニルモノマ
を乳化重合した液を電着塗料として、電着塗装により電
着析出層を形成させ、加熱によりビニルポリマを分解揮
発させ、絶縁皮膜を形成することを特徴とする低誘電率
銅張り絶縁皮膜の製造方法。(1) An electrodeposited layer is formed on a copper foil with a polymerized fibrous base material by electrodeposition using a liquid obtained by emulsion polymerization of a vinyl monomer with good thermal decomposition in an aqueous dispersion of fluororesin as an electrodeposition coating. 1. A method for producing a low dielectric constant copper-clad insulating film, which comprises forming an insulating film by decomposing and volatilizing a vinyl polymer by heating.
第1項記載の製造方法。(2) The manufacturing method according to claim 1, wherein the fibrous base material is glass cloth.
請求の範囲第1項または第2項記載の製造方法。(3) The manufacturing method according to claim 1 or 2, wherein the vinyl monomer is methyl methacrylate.
し第3項のいずれかに記載の製造方法。(4) The manufacturing method according to any one of claims 1 to 3, wherein the heating is electrical heating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16438384A JPS6142822A (en) | 1984-08-06 | 1984-08-06 | Method of producing low dielectric constant copper-lined insulating film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16438384A JPS6142822A (en) | 1984-08-06 | 1984-08-06 | Method of producing low dielectric constant copper-lined insulating film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6142822A true JPS6142822A (en) | 1986-03-01 |
JPH0419655B2 JPH0419655B2 (en) | 1992-03-31 |
Family
ID=15792081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16438384A Granted JPS6142822A (en) | 1984-08-06 | 1984-08-06 | Method of producing low dielectric constant copper-lined insulating film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6142822A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4974447A (en) * | 1987-12-23 | 1990-12-04 | Wella Aktiengesellschaft | Method and apparatus for the shaping treatment of hair wound onto rollers, including human hair |
-
1984
- 1984-08-06 JP JP16438384A patent/JPS6142822A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4974447A (en) * | 1987-12-23 | 1990-12-04 | Wella Aktiengesellschaft | Method and apparatus for the shaping treatment of hair wound onto rollers, including human hair |
Also Published As
Publication number | Publication date |
---|---|
JPH0419655B2 (en) | 1992-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4824511A (en) | Multilayer circuit board with fluoropolymer interlayers | |
US5585147A (en) | Process for a surface treatment of a glass fabric | |
CN101277816A (en) | Copper-clad laminate, printed wiring board, multilayer printed wiring board, and methods for producing those | |
CN101024315A (en) | Laminate and its producing method | |
WO2020071382A1 (en) | Dispersion and method for manufacturing resin-coated metal foil | |
CN110066557A (en) | A kind of resin coated copper foil and preparation method thereof, the copper-clad plate comprising it and printed circuit board | |
JPS6142822A (en) | Method of producing low dielectric constant copper-lined insulating film | |
JP2797488B2 (en) | Manufacturing method of thin copper foil-clad circuit board | |
WO2022110389A1 (en) | Method for preparing flexible insulation board and flexible insulation board obtained using same, flexible laminate and method for preparing same, and application | |
GB2264457A (en) | Internal composite layer for a multilayer circuit board | |
CN115075057B (en) | Low dielectric loss non-woven fabric and preparation method and application thereof | |
CN115071226B (en) | Fluorine-containing resin copper-clad plate and multilayer circuit board | |
WO2022061971A1 (en) | Insulating plate and preparation method therefor, laminated plate and preparation method therefor, and application thereof | |
CN116218008A (en) | Polypropylene metallized film and metallized film capacitor | |
JPH02299291A (en) | Method of covering sidewall of cavity of substrate | |
CN112770489B (en) | Teflon double-sided copper-clad plate and preparation method thereof | |
CN115028868A (en) | Multilayer bonding material and preparation method and application thereof | |
KR100641341B1 (en) | Flexible copper clad laminate using coducting polymer and the method for producing the same | |
JPS63179936A (en) | Production of fluororesin substrate | |
JP2007294873A (en) | Manufacturing method of flexible printed wiring board | |
Taki et al. | Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer | |
WO2010140432A1 (en) | Laminate of ceramic insulating layer and metal layer, and method for producing same | |
KR102489778B1 (en) | Manufacturing method of Flexible Flat Cable or Flexible Printed Circuit capable of spontaneous double side etching and composition of double sided tape for double side etching | |
CN115703913B (en) | Fluorine-containing resin composition and application thereof | |
JPH1154919A (en) | Multilayered printed wiring board and its manufacture |