JPS6142798U - Electromagnetic induction furnace for wafer heating - Google Patents
Electromagnetic induction furnace for wafer heatingInfo
- Publication number
- JPS6142798U JPS6142798U JP12759884U JP12759884U JPS6142798U JP S6142798 U JPS6142798 U JP S6142798U JP 12759884 U JP12759884 U JP 12759884U JP 12759884 U JP12759884 U JP 12759884U JP S6142798 U JPS6142798 U JP S6142798U
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic induction
- induction furnace
- spiral
- hot plate
- wafer heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- General Induction Heating (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは本考案一実施例の側断面図、第１図ｂは其の
ホットプレートの加熱時の温度分布図、第２図ａは従来
のウエハ加熱用電磁誘導炉の側断面図、第２図ｂは其の
ホットプレートの加熱時の温度分布図である。
１・・・半導体ウエハ、２・・・ホットプレート、３・
・・セラミックプレート、４・・・コイルプレート、５
・・・従来の均一捲線密度のスパイラルコイル、５ａ・
・・本考案に係るスパイラルブイル。Fig. 1a is a side sectional view of an embodiment of the present invention, Fig. 1b is a temperature distribution diagram during heating of the hot plate, Fig. 2a is a side sectional view of a conventional electromagnetic induction furnace for heating wafers, FIG. 2b is a temperature distribution diagram during heating of the hot plate. 1... Semiconductor wafer, 2... Hot plate, 3...
...Ceramic plate, 4...Coil plate, 5
・・・Conventional spiral coil with uniform winding density, 5a・
...Spiral buil related to this invention.
Claims (1)
トプレートを其の下方に螺旋面をプレート面に平行に配
設した螺旋状捲線に交流を流して電磁誘導で加熱するこ
とにより、ホットプレートを介して半導体ウエハを加熱
するウエハ加熱用電磁誘導炉において、前記螺旋状捲線
の半径方向単位長当たりの捲線数を、螺旋の中心近傍で
は少なく、螺旋の外周近傍では大きくしたことを特徴と
するウエハ加熱用電磁誘導炉。A semiconductor wafer is placed on a hot plate, and the hot plate is heated by electromagnetic induction by passing an alternating current through a spiral winding wire with a spiral surface parallel to the plate surface below the hot plate. In an electromagnetic induction furnace for heating semiconductor wafers, the number of turns per unit length in the radial direction of the spiral winding is small near the center of the spiral, and large near the outer periphery of the spiral. Electromagnetic induction furnace for heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12759884U JPS6142798U (en) | 1984-08-24 | 1984-08-24 | Electromagnetic induction furnace for wafer heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12759884U JPS6142798U (en) | 1984-08-24 | 1984-08-24 | Electromagnetic induction furnace for wafer heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6142798U true JPS6142798U (en) | 1986-03-19 |
Family
ID=30686240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12759884U Pending JPS6142798U (en) | 1984-08-24 | 1984-08-24 | Electromagnetic induction furnace for wafer heating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142798U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101060759B1 (en) * | 2008-12-18 | 2011-08-31 | 삼성엘이디 주식회사 | Chemical vapor deposition apparatus |
| JP2013232662A (en) * | 2013-06-20 | 2013-11-14 | Nikon Corp | Supporting apparatus, heating and pressing apparatus, and heating and pressing method |
-
1984
- 1984-08-24 JP JP12759884U patent/JPS6142798U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101060759B1 (en) * | 2008-12-18 | 2011-08-31 | 삼성엘이디 주식회사 | Chemical vapor deposition apparatus |
| JP2013232662A (en) * | 2013-06-20 | 2013-11-14 | Nikon Corp | Supporting apparatus, heating and pressing apparatus, and heating and pressing method |
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