JPS6141678B2 - - Google Patents
Info
- Publication number
- JPS6141678B2 JPS6141678B2 JP54057116A JP5711679A JPS6141678B2 JP S6141678 B2 JPS6141678 B2 JP S6141678B2 JP 54057116 A JP54057116 A JP 54057116A JP 5711679 A JP5711679 A JP 5711679A JP S6141678 B2 JPS6141678 B2 JP S6141678B2
- Authority
- JP
- Japan
- Prior art keywords
- slit
- pattern
- projection lens
- movable
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 2
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7025—Size or form of projection system aperture, e.g. aperture stops, diaphragms or pupil obscuration; Control thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Laser Beam Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】
本発明はパターン投影方式のレーザ加工装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern projection type laser processing apparatus.
第１図は従来のパターン投影方式のレーザ加工
装置の一例を示した図である。即ちレーザ発振器
１より出たレーザ光は凹レンズ２に入り、広げら
れ、コリメートレンズ３により平行光にされ、印
刷原画４を通過し、投影レンズ５に入る。印刷原
画４と被加工物６の加工面が投影レンズ５に関し
て共役像位置になるように印刷原画４、投影レン
ズ５、および被加工物が配置されている。従つて
レーザ発振器１から出たレーザ光によつて印刷原
画４のパターンが被加工物６の加工面上に縮小転
写される。 FIG. 1 is a diagram showing an example of a conventional pattern projection type laser processing apparatus. That is, a laser beam emitted from a laser oscillator 1 enters a concave lens 2, is expanded, is made into parallel light by a collimating lens 3, passes through an original printing image 4, and enters a projection lens 5. The original printing image 4, the projection lens 5, and the workpiece are arranged such that the processed surfaces of the original printing image 4 and the workpiece 6 are at conjugate image positions with respect to the projection lens 5. Therefore, the pattern of the printing original 4 is reduced and transferred onto the processing surface of the workpiece 6 by the laser light emitted from the laser oscillator 1.
しかしこの装置は、すでに存在する印刷原画４
をそのまま転写する以外の機能は有せず、任意の
パターンを投影することができない欠点を有す
る。 However, this device is not compatible with the already existing printed original 4
It has no function other than to directly transfer images, and has the disadvantage of not being able to project arbitrary patterns.
第２図は従来の加工巾を可変にした投影方式の
レーザ加工装置の一例を示した図である。即ちレ
ーザ発振器１から出たレーザ光は可動開口スリツ
ト７に入射し、これを通過したレーザ光は投影レ
ンズ５に入る。可動開口スリツト７の像が被加工
物６の加工面は共役像として結像するように投影
レンズ５が配置されており、開口スリツト７の縮
小パターンが被加工物６の加工面に転写される。
この装置においては開口スリツト７の巾が可能で
あるため、所望の巾に設定して加工することがで
きる。 FIG. 2 is a diagram showing an example of a conventional projection type laser processing apparatus with variable processing width. That is, the laser light emitted from the laser oscillator 1 enters the movable aperture slit 7, and the laser light that passes through this enters the projection lens 5. The projection lens 5 is arranged so that the image of the movable aperture slit 7 forms a conjugate image on the machined surface of the workpiece 6, and the reduced pattern of the aperture slit 7 is transferred to the machined surface of the workpiece 6. .
In this device, since the width of the opening slit 7 can be changed, it is possible to set the opening slit 7 to a desired width and process it.
しかしこの装置でも任意巾の平行パターンが加
工できるのみであり、仮りに開口スリツト７を二
組重ねて用いたとしても矩形パターンが加工でき
るだけであり、これ以上複雑な形状を加工するこ
とは困難である欠点を有する。 However, even this device can only process parallel patterns of arbitrary width, and even if two sets of opening slits 7 are stacked, it can only process rectangular patterns, and it is difficult to process more complex shapes. It has certain drawbacks.
本発明の目的は、上記した従来技術の欠点をな
くし、より複雑な任意の形状パターンを加工でき
るようにしたパターン投影方式のレーザ加工装置
を提供するにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a pattern projection type laser processing apparatus that eliminates the drawbacks of the above-mentioned conventional techniques and is capable of processing a more complex arbitrary shape pattern.
即ち本発明は、より複雑な任意の形状を投影加
工するために、開口スリツトを二段以上設け、こ
れらのスリツト面を中間投影レンズによつてつな
ぎ、最後に加工用投影レンズでこれら複数のスリ
ツト面によつて形成されたパターンを試料面上に
集光投影してレーザ加工するように構成したこと
を特徴とするものである。 That is, in order to project a more complex arbitrary shape, the present invention provides two or more stages of aperture slits, connects these slit surfaces with an intermediate projection lens, and finally projects these multiple slits with a processing projection lens. The present invention is characterized in that a pattern formed by a surface is condensed and projected onto a sample surface for laser processing.
以下本発明を図に示す実施例にもとづいて具体
的に説明する。 The present invention will be specifically described below based on embodiments shown in the drawings.
第３図は本発明のパターン投影方式のレーザ加
工装置の一実施例を示した図である。即ちレーザ
発振器１から出たレーザ光８はＸ方向可動スリツ
ト９とＹ方向可動スリツト１０の２組のスリツト
で構成された第１の開口スリツト１１の面に入射
し、矩形に形成されて、中間投影レンズ１２によ
つて第２の開口スリツト１３の面に等倍で投影さ
れる。 FIG. 3 is a diagram showing an embodiment of a pattern projection type laser processing apparatus of the present invention. That is, the laser beam 8 emitted from the laser oscillator 1 enters the surface of the first aperture slit 11, which is composed of two sets of slits 9 movable in the X direction and the slit 10 movable in the Y direction, and is formed into a rectangular shape. The projection lens 12 projects the image onto the surface of the second aperture slit 13 at the same magnification.
第２の開口スリツト１３の面はX′方向可動ス
リツト１４とY′方向可動スリツト１５の２組の
スリツトで構成されており、各々のスリツトは
X′、Y′両方向に任意の位置に設定することがで
きるだけでなく、光軸直角な平面内で独立にθX
′、θY′回転調整することができる。 The surface of the second opening slit 13 is composed of two sets of slits, a slit 14 movable in the X' direction and a slit 15 movable in the Y' direction.
Not only can it be set at any position in both the X′ and Y′ directions, but it can also be set independently in the plane perpendicular to the optical axis .
′, θ Y ′ rotation can be adjusted.
然るに第１の開口スリツト１１の面によつて矩
形に形成されたレーザ光は第２の開口スリツト１
３面に投影され、ここで、再び追加形成される。
そして、この最終形状は、加工用投影レンズ５に
より、被加工物６の加工通に縮小投影され、被加
工物６は最終形状に加工される。 However, the laser beam formed into a rectangular shape by the surface of the first aperture slit 11 passes through the second aperture slit 1.
It is projected onto three planes, where it is again additionally formed.
Then, this final shape is reduced and projected onto the workpiece 6 by the processing projection lens 5, and the workpiece 6 is processed into the final shape.
ところでX′、Y′方向をＸ、Ｙに対し45゜、60
゜など所望の角度に設定し、必要な位置にX′方
向可動スリツト１４及びY′方向可動スリツト１
５を調整することにより、第１の開口スリツト１
１の面で矩形に形成されたレーザ光の矩形の角の
一部を所望の角度で追加形成することができる。 By the way, the X' and Y' directions are 45 degrees and 60 degrees with respect to X and Y.
Set the desired angle, such as
5, the first opening slit 1
A portion of the rectangular corner of the laser beam formed into a rectangular shape on one surface can be additionally formed at a desired angle.
第４図は第３図に示す装置によつて得られた加
工パターンの例を示したものである。ａ，ｂ，
ｃ、ｄにおいて、第１の開口スリツト１１の面に
よる矩形パターン１６ａ，１６ｂ，１６ｃ，１６
ｄは、第２の開口スリツト１３の面によつて追加
形成され最終パターン７ａ，１７ｂ，１７ｃ，１
７ｄのようにかなり自由な形状が得られるように
なつた。特にｃは第１の矩形開口スリツト１１で
得た矩形パターン１６ｃを、第２の山形開口スリ
ツト１７ｃによつてＸ状に追加形成した例であ
り、直線のスリツトを用いずに必要な形状のスリ
ツトを用いることにより、自由度はさらに一段と
大きくなる。またｄは第２段に凸形の形状のパタ
ーン１７ｄを１つおくことによりこのような形状
の加工が得られている。 FIG. 4 shows an example of a processed pattern obtained by the apparatus shown in FIG. a, b,
In c and d, rectangular patterns 16a, 16b, 16c, 16 formed by the surface of the first opening slit 11
d is additionally formed by the surface of the second opening slit 13 and the final patterns 7a, 17b, 17c, 1
It became possible to obtain fairly free shapes like 7d. In particular, c is an example in which the rectangular pattern 16c obtained by the first rectangular opening slit 11 is additionally formed in an X shape by the second chevron opening slit 17c, and the slit of the required shape is formed without using a straight slit. By using , the degree of freedom becomes even greater. Further, in d, such a shape can be obtained by placing one convex pattern 17d in the second stage.
また開口スリツトの代りに開口スリツトと印刷
原画の組合せまたは複数の印刷原画を各スリツト
面において得られる加工パターンの自由度を増や
せることは明らかである。 It is also clear that instead of using an aperture slit, a combination of an aperture slit and a printing original or a plurality of printing originals can be used to increase the degree of freedom in the processing pattern obtained on each slit surface.
第５図は本発明のパターン投影方式のレーザ加
工装置他の一実施例を示したものである。 FIG. 5 shows another embodiment of the pattern projection type laser processing apparatus of the present invention.
即ち第３図に示す装置に更に中間投影レンズ１
８及び可動スリツト１９，２０を設けて３段、ま
たはそれ以上の多段のパターン成形面を設けるこ
とにより、複数な形状を得ることができる。 That is, the apparatus shown in FIG. 3 is further provided with an intermediate projection lens 1.
8 and movable slits 19 and 20 to provide a pattern forming surface of three or more stages, a plurality of shapes can be obtained.
以上設明したように本発明は、中間投影レンズ
によつてつないで複数段で投影するように構成し
たものであるから、加工形状の自由度を著しく向
上することができる効果を有する。 As set forth above, the present invention is configured to project in multiple stages connected by an intermediate projection lens, and therefore has the effect of significantly improving the degree of freedom in processing shapes.
第１図及び第２図は従来のパターン投影方式の
レーザ加工装置の概略構成を示す図、第３図は本
発明のパターン投影方式のレーザ加工装置の一実
施例を示した概略構成図、第４図は第３図に示す
装置によつて形成されるパターン形状を示した
図、第５図は本発明のパターン投影方式のレーザ
加工装置の他の一実施例を示す概略構成図であ
る。
符号の説明、１……レーザ発振器、５……投影
レンズ、６……被加工物、９……Ｘ方向可動スリ
ツト、１０……Ｙ方向可動スリツト、１２，１８
……中間投影レンズ、１４……X′方向可動スリ
ツト、１５……Y′方向可動スリツト。
1 and 2 are diagrams showing a schematic configuration of a conventional pattern projection type laser processing device, and FIG. 3 is a schematic configuration diagram showing an embodiment of a pattern projection type laser processing device of the present invention. FIG. 4 is a diagram showing a pattern shape formed by the apparatus shown in FIG. 3, and FIG. 5 is a schematic diagram showing another embodiment of the pattern projection type laser processing apparatus of the present invention. Explanation of symbols: 1... Laser oscillator, 5... Projection lens, 6... Workpiece, 9... X direction movable slit, 10... Y direction movable slit, 12, 18
...Intermediate projection lens, 14...X' direction movable slit, 15...Y' direction movable slit.
Claims (1)
ターンを中間投影レンズによつてつないで投影し
てレーザ加工するように構成したことを特徴とす
るパターン投影方式のレーザ加工装置。1. A pattern projection type laser processing apparatus characterized in that a pattern to be projected is formed in multiple stages, and each pattern is connected by an intermediate projection lens and projected to perform laser processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5711679A JPS55149788A (en) | 1979-05-11 | 1979-05-11 | Laser working apparatus of pattern projection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5711679A JPS55149788A (en) | 1979-05-11 | 1979-05-11 | Laser working apparatus of pattern projection system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55149788A JPS55149788A (en) | 1980-11-21 |
| JPS6141678B2 true JPS6141678B2 (en) | 1986-09-17 |
Family
ID=13046559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5711679A Granted JPS55149788A (en) | 1979-05-11 | 1979-05-11 | Laser working apparatus of pattern projection system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55149788A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04258394A (en) * | 1991-02-05 | 1992-09-14 | Fanuc Ltd | Machining head of laser beam machine |
| JP4805954B2 (en) * | 2006-01-27 | 2011-11-02 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | Variable slitting device and laser processing device |
| KR100766300B1 (en) | 2006-07-12 | 2007-10-12 | (주)미래컴퍼니 | Laser slit and laser machining apparatus |
-
1979
- 1979-05-11 JP JP5711679A patent/JPS55149788A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55149788A (en) | 1980-11-21 |
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