JPS6140101B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern correction apparatus, and more particularly to a pattern correction apparatus for photomasks used in manufacturing printed boards and the like.

When creating circuit patterns for printed boards, etc.
First, a pattern to be created is formed in advance on a light-transmitting film using light-shielding ink, and a photoresist is applied onto the conductive layer of a substrate that will become a printed board, and the conductive layer is formed on the entire surface. Exposure through the formed photomask, and then
A conductive layer pattern corresponding to the exposed pattern is formed on the substrate by etching to form a printed circuit board.

In the work of correcting a pattern formed on such a photomask, first, the pattern part to be corrected (hereinafter referred to as a defect) is illuminated by lighting a lamp corresponding to the defect position among the lamps arranged in a matrix. The operator indicates the defective part of the photomask placed on top of the photomask, uses the illuminated part of the lamp as an indicator to know the defective part of the photomask, and uses a pattern correction tool to correct the pattern.

By the way, in such a pattern correction device, the lamp matrix is provided to irradiate the photomask from below, so when the pattern of the photomask is densely formed, the amount of transmitted light from the lamp is reduced. In addition to making it difficult to determine the location of defects on the photomask, in such pattern repair equipment, the lamp matrix is usually fixed to the workbench, so depending on the shape of the pattern to be corrected, it may be difficult for the operator to do so. The working posture becomes unnatural, leading to a decrease in work efficiency, and
There were defects such as difficulty in making accurate pattern corrections. The present invention has been made in view of this point, and even if a photomask having a pattern to be corrected is arbitrarily moved on a workbench during correction work,
The purpose of the present invention is to provide a pattern correction device configured to always correctly specify defective areas.
In a pattern correction device for correcting the pattern drawn on the inspection object into a desired shape by placing an inspection object on which a pattern to be corrected is drawn on a correction workbench, the inspection object is placed from above the workbench. The present invention is characterized in that the present invention further comprises means for projecting an optical mark clearly indicating the portion to be corrected onto the pattern portion to be corrected.

Preferred embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1a is a block diagram of an embodiment of the pattern correction apparatus according to the present invention, in which 1 is a defect position projector, 2 is a defect position projector;
is a photo mask, and 3 is a workbench. The photomask 2 is placed on a worktable T on a workbench 3, and the workbench T is mounted on a flexible ball stand B so that it can be freely moved and rotated on the workbench 3 according to correction work.
is placed on top. AS is a fixing column that fixes the defect location projector to the floor (not shown). Figure 1b
1 is a cross-sectional view of a main part of the pattern correction device shown in FIG. The light from the light source 1b passes through these holes V, and then is irradiated onto a defective site on the photomask 2 by the optical lens 1c. Ba allows the platform T to move freely using a ball. 1d is a housing. Therefore, since the defect position projector 1 illuminates the light spot only onto the defective area on the photomask 2, the operator can easily visually recognize the defective area on the photomask 2. In addition, the photomask stage T is provided with a hole W for transmitting light, and the light from the illumination light source N is passed through a light diffusing plate D, which has minute irregularities for light scattering formed on the surface of the light source N. The light from the photomask 2 on the stage T is illuminated with light having a substantially uniform intensity distribution.

Next, the operation of the apparatus shown in FIGS. 1a and 1b will be explained.

A photomask 2 placed on a stage T is illuminated by a light source N via a light diffusing plate D, and the pattern formed with light-shielding ink blocks the light from the light source N, and the photomask is illuminated by a light source N. Since the light-shielding ink is not applied to the non-patterned area and it is transparent, the light from the light source N passes through the hole W and enters the operator's eyes, so that the pattern shape drawn on the photomask 2 is Clearly observed by the worker.

In this state, the defect position projector 1 irradiates the photomask 2 with a light spot that clearly indicates the defect position, so that the operator performs the work of correcting the pattern at the location indicated by the defect projector 1. Since the stage T on which the photomask 2 is placed can be freely rotated and translated in parallel on the workbench 3, the stage T is placed at a position that facilitates the modification work in accordance with the pattern shape to be modified. This improves the efficiency of correction work.

FIG. 2 is a configuration diagram of another embodiment of the present invention,
Parts equivalent to those in FIGS. 1a and 1b are given the same reference numerals.
In FIG. 2, the defect location projector 1 is fixedly attached to a stage T on which a photomask 2 is placed by a support arm As. Therefore, if the workpiece table T is moved to a position where the correction work is easier during pattern correction work, the defect position projector 1 will also move together with the workpiece table T on which the photomask 2 is placed, so that the defect position projector 1 will move along with the workpiece stand T on which the photomask 2 is placed. A light spot indicating the projected defect position is irradiated onto a predetermined position on the photomask 2.

FIG. 3 is a block diagram of another embodiment of the pattern correction apparatus according to the present invention, in which the same parts as in FIGS. 1a and 1b are given the same reference numerals.

In FIG. 3, reference numeral 4 denotes a light scanning means, in which a rotating polygon mirror 4a and a motor 4b are placed on a movable stage 4c that can move in the direction of arrow X. , and a scanning locus indicated by l ₁ or l ₂ is drawn on the photomask 2.

5 is another optical scanning means, which includes a rotating polygon mirror 5a.
and a motor 5b that is movable in the direction of arrow Y.
c, and the laser beam from the light source 5d is reflected by the rotating polygon mirror 5a to pass onto the photomask 2.
Draw a scanning trajectory indicated by l ₃ or l ₄ . 6a, 6b, 6
Numerals c and 6d are photodetectors placed on the scanning trajectories l ₁ and l ₂ , and 7a, 7b, 7c, and 7d are photodetectors placed on the optical scanning trajectories l ₃ and l ₄ .

8 is a mask position detection means, and 9 is a defect position projector driver. _L1 to _L8 are lead wires.
G is a glass plate on which the photomask is placed. Next, the operation of this device will be explained.

A defect map with defect positions marked thereon is projected from a defect position projector 1 onto a photomask 2 placed on a workbench 3, and the worker can see the map projected onto the photomask 2 by the defect position projector 1. The defective part of the photomask pattern is known by the pattern defective part indicating mark.

By the way, during the repair work, if the worker changes the position of the photomask 2 on the workbench 3 to facilitate the repair work, the defect position indication mark projected from the defect position projector 1 onto the photomask 2 Although the position shifts, at this time, the defect map projected image from the defect position projector 1 also changes in accordance with the positional change of the photomask 2 in the following manner.

First, as shown in FIG. 4, when the position of the photomask 2 on the workbench 3 is displaced from the normal position shown by the broken line and reaches the position shown by the solid line, the optical scanning means 4 and 5 scan the photomask. above l ₁ , l ₂ and
The light beam is scanned to have scanning trajectories indicated by l ₃ and l ₄ . At this time, the irradiated light is diffusely reflected at the edge portion of the photomask 2 as shown in FIG. 5, and is incident on the photodetector 6a provided. In this way, the positions of the edge portions P ₁ to _{P 4} of the photomask 2 are adjusted to the positions of the photodetectors 6a, 6b, 6c, 6d and 7a, 7b, 7.
c, 7d. The photomask position detection means 8 receives the outputs from these photodetectors and determines the displacement of the photomask 2. In other words, a linear equation representing one side H ₁ of the photomask 2 is obtained from the edge positions P 1 and P ₂ , a linear equation representing the other side H ₂ of the photomask ₂ is obtained from the edge positions P ₃ and P ₄ , and these two straight lines are Origin of photomask 2 after displacement from the intersection point P ₀
seek.

Therefore, when the position of the defect map stored in the defect inspection device is displaced and inputted to the defect projector 1 in accordance with the inclination of the photomask 2 represented by the origin position P ₀ and the side H ₁ , the projector 1 From
A mark indicating a defect is projected onto a predetermined defect site in accordance with the displacement of the photomask 2. Note that the optical scanning means may be provided below the workbench 3, the photomask may be placed on a glass plate, and the laser scanning light may be irradiated from below.

In the above embodiment, the optical scanning means was used to read the position of the photomask 2, but as shown in FIG. The photomask 2 as shown in FIG. Since the edge position can be detected, this detected position is detected by the photomask position detection means 8.
The position of the defect map projected from the defect position projector 1 may be changed by inputting the defect map to the defect position projector 1.

Furthermore, in the present invention, an optical deflector equipped with a galvano mirror as shown in FIG. 7 may be used as the defect location projector.

In Fig. 7, J ₁ and J ₂ are galvano mirrors,
M ₁ and M ₂ are drive devices for these galvano mirrors, and S
is a laser light source, L is a condensing lens, and upon receiving the defect position information from the photomask defect inspection device 10 and the output signal from the film position detection means 8, the driving devices M ₁ and M ₂ drive the galvano mirror J _{1 .} ,J ₂
The light beam from the laser light source S indicates the defect position on the photomask 2 corresponding to the positional change of the photomask 2. Z ₁ and Z ₂ are lenses for expanding the beam diameter.

Furthermore, in the present invention, a cathode ray tube as shown in FIG. 8 may be used as the defect location projector. That is, defect data input from the defect inspection device 10 is displayed on the display surface of the cathode ray tube C, and this displayed image is projected by the wire connection lens L onto the photomask 2 placed on the workbench. The positional change of the photomask is received by the output of the position determining means 8, and the defect map position of the defect inspection device 10 is displaced in accordance with the positional change of the photomask and displayed on the display screen of the cathode ray tube C.

As is clear from the above description, since the pattern correction apparatus according to the present invention projects a defect map onto the top surface of the photomask to determine the correction position of the photomask having a pattern to be corrected, even if the pattern is densely drawn, In addition to being able to see the photomask correctly, the position of the photomask can be freely rotated and translated in accordance with the pattern shape to be corrected on the workbench, improving work efficiency. Furthermore, even if the photomask is moved arbitrarily on the workbench during work, the defect position projector is controlled by detecting the photomask position, so the defect position can always be correctly indicated on the photomask, increasing the efficiency of pattern correction work. This has the advantage of significantly improving

[Brief explanation of the drawing]

Figure 1a is a configuration diagram of an embodiment of the present invention, Figure 1b
1A is a sectional view of a main part of FIG. 1A, FIG. 2 is a block diagram of another embodiment of the present invention, and FIG. 3 is a block diagram of still another embodiment of the present invention. 4 and 5 are explanatory diagrams of a photomask position detection method, and FIGS. 6 to 8 are configuration diagrams of other embodiments of the present invention. 1: Defect location projector, 2: Photomask, 3:
Workbench, 4, 5: Optical scanning means, 6a to 6d, 7a
~7d: Photodetector, 8: Film position detection means,
9: Defect location projector driver.

Claims (1)

[Scope of Claims] 1. A pattern correction device for correcting the pattern drawn on the object to be inspected into a desired shape by placing an object to be inspected on which a pattern to be corrected is drawn on a correction workbench, comprising: A pattern correction apparatus comprising means for projecting, from above a workbench, onto the object to be inspected, an optical mark that clearly indicates a correction area on a pattern area to be corrected. 2. Claim 1, characterized in that the object to be inspected is provided with the object to be inspected stage that allows the object to be inspected to be freely moved, including rotational movement, on the workbench.
The pattern correction device described in Section. 3. The pattern correction according to claim 2, wherein the optical mark projection means and the inspection object stage are integrally provided so that their relative arrangement remains unchanged. Device. 4. means for detecting the position of the object to be inspected on the workbench;
In response to the output of the position detection means, the optical mark projection means projects an optical mark onto a pattern portion to be corrected on the object to be inspected in accordance with the position of the object to be inspected. 3. The pattern correction device according to claim 2, further comprising means for driving the pattern correction device.