JPS6139941U - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS6139941U
JPS6139941U JP1984124418U JP12441884U JPS6139941U JP S6139941 U JPS6139941 U JP S6139941U JP 1984124418 U JP1984124418 U JP 1984124418U JP 12441884 U JP12441884 U JP 12441884U JP S6139941 U JPS6139941 U JP S6139941U
Authority
JP
Japan
Prior art keywords
bonding equipment
tool holder
bonding arm
tool
holder side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984124418U
Other languages
English (en)
Japanese (ja)
Other versions
JPH025534Y2 (enrdf_load_stackoverflow
Inventor
芳春 中富
Original Assignee
東京測範株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京測範株式会社 filed Critical 東京測範株式会社
Priority to JP1984124418U priority Critical patent/JPS6139941U/ja
Publication of JPS6139941U publication Critical patent/JPS6139941U/ja
Application granted granted Critical
Publication of JPH025534Y2 publication Critical patent/JPH025534Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1984124418U 1984-08-16 1984-08-16 ボンデイング装置 Granted JPS6139941U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984124418U JPS6139941U (ja) 1984-08-16 1984-08-16 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984124418U JPS6139941U (ja) 1984-08-16 1984-08-16 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6139941U true JPS6139941U (ja) 1986-03-13
JPH025534Y2 JPH025534Y2 (enrdf_load_stackoverflow) 1990-02-09

Family

ID=30683145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984124418U Granted JPS6139941U (ja) 1984-08-16 1984-08-16 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6139941U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0438530U (enrdf_load_stackoverflow) * 1990-07-30 1992-03-31

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0438530U (enrdf_load_stackoverflow) * 1990-07-30 1992-03-31

Also Published As

Publication number Publication date
JPH025534Y2 (enrdf_load_stackoverflow) 1990-02-09

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