JPS6139432Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a display device using light emitting diodes.

It is already known that a plurality of light emitting diode chips are arranged in parallel and the number of light emitting diode chips that emit light is changed depending on the input level to visually display the input level. In the conventional structure, a case made of light-transmitting resin is placed over the light-emitting diode chips (hereinafter simply referred to as chips) arranged in parallel, and a case made of non-light-transmitting resin or metal is placed on the surface of the case to cover each chip. A masking board with holes drilled in the corresponding locations was attached. According to this, the light from the chip is led out through the hole in the masking plate, so that it can be visually recognized from the outside. However, a masking board must be used. In addition, some display devices of this type use a reflector, but normally the inner wall surface of the reflection window of this type of reflector needs to be an inclined surface that slopes upward, so that the distance between adjacent light emitting diode chips In this case, there is a boundary portion on the reflecting plate where both sides are sloped surfaces. Therefore, the pitch interval of the light emitting diode chips cannot be shortened due to the existence of this boundary portion, and the size inevitably increases, making it impossible to manufacture a sufficiently small display device of this type. In order to solve this problem, the present inventor separately proposed a configuration in which the case is made opaque and a display window is formed therein. According to this, a masking plate is not required, and it can be manufactured in a small size.

On the other hand, in order to miniaturize this type of display device, the interval between adjacent chips may be set to about 1 mm. When the chips are arranged close to each other in this manner, light emitted from one chip may leak through the display window facing the adjacent chip. Therefore, there is a risk of misperception when viewed from the outside.

The purpose of this invention is to prevent misrecognition due to light leakage in a structure that uses a non-light-transmitting case equipped with a display device.

This invention attempts to prevent light leakage by forming a partition on the inner surface of the case to partition adjacent display windows.

An example of this invention will be explained with the help of diagrams: 1
is an insulating board such as a printed circuit board, 2 is a chip, multiple of which are arranged in parallel, 3 is a conductor, and 4 is a chip.
1 is a terminal, and 5 is a case made of black resin, in which a display window 6 is formed so as to face each chip when this is fixed at a predetermined position on the board 1.

However, according to this idea, the partition part 7 is formed so as to hang downward from the inner surface of the case 5. This partition section 7 is located between adjacent display windows 6. Therefore, when the case 5 is fixed on the substrate 1 as described above, the partition portion 7 will be located between the adjacent chips 2. The display window is filled with resin 8 containing a scattering agent. By doing so, the brightness becomes uniform over the entire surface of the display window 6, which is convenient.

In the above configuration, when the chip 2 emits light, the light from it is directed toward the display window 6 facing the chip 2. However, some of that light is
As mentioned above, if there is no light, the light will leak through the adjacent display window. However, if the partition 7 is provided, the light from the chip 2 will be cut off by the partition 7 and will not be directed toward the adjacent display window.
This allows the light emitted from one chip to exit only from the display window facing that chip.
This reliably prevents erroneous visual recognition caused by brightening of the display window facing the chip that is not emitting light.

In the illustrated embodiment, the partition portion 7 extends close to the surface of the substrate 1, but it may be separated from the surface of the substrate 1 within a range that allows light to pass through and block the light.
In short, the lower end of the partition section 7 is the light emitting diode chip 2.
It is only necessary to hang down between the surface of the substrate 1 and the substrate 1.

As detailed above, according to this invention, the pinch interval of the light emitting diode chips can be made shorter than in the case of using a conventional reflector having an inclined reflective wall surface. In addition, when a plurality of chips are arranged side by side, even if each chip is sufficiently close to each other, light from one chip will not leak through the adjacent display window, and therefore display errors will be avoided. With this, visibility can be easily prevented, and since the cover and the board are not integrated with translucent resin, etc., the structure can be easily configured. play.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing an embodiment of this invention;
The figure is an enlarged sectional view. 1...Substrate, 2...Light emitting diode chip, 5
...Cover, 6...Display window, 7...Partition section.

Claims (1)

[Scope of utility model registration request] A plurality of light emitting diode chips are arranged in parallel on the surface of the substrate, and a black cover is provided on the substrate, in which a plurality of display windows formed by filling resin containing a scattering agent are formed inside corresponding to the light emitting diode chips, a partition portion that is placed over the display window so as to face the light emitting diode chip, and for cutting off light from the light emitting diode chip toward the display window facing an adjacent light emitting diode chip from the inner surface of the cover; A display device in which the lower end thereof hangs downward to the extent that it reaches between the surface of the light emitting diode chip and the surface of the substrate.