JPS6136958A - Cooling structure of integrated circuit - Google Patents
Cooling structure of integrated circuitInfo
- Publication number
- JPS6136958A JPS6136958A JP15978584A JP15978584A JPS6136958A JP S6136958 A JPS6136958 A JP S6136958A JP 15978584 A JP15978584 A JP 15978584A JP 15978584 A JP15978584 A JP 15978584A JP S6136958 A JPS6136958 A JP S6136958A
- Authority
- JP
- Japan
- Prior art keywords
- thermal conducting
- integrated circuit
- cooling structure
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は集積回路の冷却構造、特に半導体チップから発
生する熱を機器外部に効率的に排出することのできるL
SIパッケージの冷却構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a cooling structure for integrated circuits, particularly an L-type cooling structure capable of efficiently discharging heat generated from semiconductor chips to the outside of the device.
This invention relates to a cooling structure for an SI package.
従来、プリント配線板あるいはセラミック基板等に実装
されたICを冷却する手段と(−では、ICのケースあ
るいけ該ケースて取り付けらね、た放熱板(以下ヒート
シンクと称す)に、ファンを用いて冷気もしくは冷却装
置によって温1(I’ f下げた空気を吹き付けるとい
う手段がとられるのが一般的であって、これによってI
Cからの発生熱を排除していた。しかしながらICから
発散される熱を機器外部に運び出す冷媒としての空気は
必ずしも最良のものではない。その第1の理由としては
、固体であるICのケースもしくは前記ヒートシンクと
空気との間の熱抵抗が大きく、この間の温度差が大きく
なってしまい、ICの温i(を下げるためには必然的に
冷媒としての空気の温度を下けなければならなず、この
ための設備がたいへんであることが挙げられる。情報処
理装置(以下学に装置と称す)を例にとれば、設置する
部屋の空気の温度を下げるために犬がかがすな空気調和
設備を必要とする。空気を冷媒とする欠点の第2の理由
は、空気は熱容量が小さく、少しの熱量で空気温度が上
ってしまうことであり、前記装置内部から大量の熱を運
び出すためには大量の空気を装置罠送り込まなければな
らない。しかしながら近年の高性能情報処理装置におい
ては、その処理速度を高めるために高集積度化、高電力
化によるICの動作速度の向上、あるいは実装の高密度
化による信号の伝播遅延時間の短縮が図られており、結
果とl−で発生熱量、発熱密度の増大を招いている。し
たがって従来手段で冷却するために前記装置を設置する
部屋においては高い冷却能力の空気調和設備を必要と1
7、前記装置内部においては実装密度の向−ヒに起因す
る装置内の空気通路の減少を補うため、および大量の熱
を装置外部へ排出するために、高風量、高吐出圧力の送
風機を必要とする。このことは前記装置から発生する送
風騒音を異状に大きくするのみでなく、大風量、高風速
の空気流を前記装置内部で均等に分布させることは非常
に回能なためICの冷却不足による温度上昇が生じ、装
置の信頼性をも低下させることになるといった欠点があ
った。Conventionally, a fan was used as a means to cool an IC mounted on a printed wiring board or a ceramic substrate, etc. It is common practice to blow cold air or air whose temperature has been lowered by 1 (I' f) using a cooling device.
The heat generated from C was eliminated. However, air is not necessarily the best refrigerant for carrying the heat dissipated from the IC to the outside of the device. The first reason is that the thermal resistance between the solid IC case or the heat sink and the air is large, and the temperature difference between them becomes large. The temperature of the air used as a refrigerant must be lowered, and the equipment required for this purpose is difficult.Take information processing equipment (hereinafter referred to as equipment) as an example, the temperature of the room in which it is installed must be lowered. In order to lower the temperature of the air, air conditioning equipment is required.The second reason for the disadvantage of using air as a refrigerant is that air has a small heat capacity, and a small amount of heat can raise the air temperature. In order to carry out a large amount of heat from inside the device, a large amount of air must be pumped into the device trap.However, in recent years, high-performance information processing devices have become highly integrated to increase their processing speed. Efforts have been made to improve the operating speed of ICs by increasing the power consumption, or to shorten the signal propagation delay time by increasing the density of packaging, resulting in an increase in the amount of heat generated and the heat density. In order to cool by conventional means, the room where the above device is installed requires air conditioning equipment with high cooling capacity.
7. Inside the device, a blower with high air volume and high discharge pressure is required to compensate for the decrease in air passages within the device due to the increase in packaging density and to exhaust a large amount of heat to the outside of the device. shall be. This not only makes the air blowing noise generated from the device abnormally large, but also causes the temperature to rise due to insufficient cooling of the IC, since it is extremely difficult to evenly distribute a large volume and high speed air flow inside the device. There was a drawback that this caused an increase in the temperature and also reduced the reliability of the device.
これらの欠点を解決すべく、第2図に示すような液体を
冷媒とした冷却構造が提案されている。In order to solve these drawbacks, a cooling structure using liquid as a refrigerant as shown in FIG. 2 has been proposed.
第2図は半導体チップの液体冷却構造の縦断面図であっ
て、基板20に実装された半導体チップ21には、熱伝
導板2G内に収容された圧縮ばね25によってピストン
23が押圧されており、チップ21で発生した熱は、ピ
ストン23から該ピストンと熱伝導板26との微少間隙
24を介して熱伝導板26へと伝えら力1、さらに熱伝
導板26は、冷媒取入口28から注入され排出1]29
から排出される液体冷媒27に:よって冷却されるとい
う構成である。22は半導体チップ21を基板20に取
り付けるための接続用はんだである。FIG. 2 is a longitudinal cross-sectional view of a liquid cooling structure for a semiconductor chip, in which a piston 23 is pressed against a semiconductor chip 21 mounted on a substrate 20 by a compression spring 25 housed in a heat conduction plate 2G. , the heat generated in the chip 21 is transmitted from the piston 23 to the heat conduction plate 26 through a small gap 24 between the piston and the heat conduction plate 26, and the heat conduction plate 26 is further transferred from the refrigerant intake port 28. Injected and discharged 1] 29
It is configured to be cooled by the liquid refrigerant 27 discharged from. 22 is a connecting solder for attaching the semiconductor chip 21 to the substrate 20.
しかし第2図に示す液体手段による冷却構造も以下のよ
うな重大な欠点が存在する。それけ1ず第1罠、半導体
チップ21と金属製ピストン23とが機械的に接触して
いるため冷媒27とチップ21間が電気的に絶縁できな
いことである。冷媒27は熱交換器等を経て圧縮機や冷
媒送出ポンプ(いずれも図示省略)のアースにつながっ
ているが、このアースは非常てノイズが多く、冷媒に水
以外の絶縁体を使用しない限り半導体チップにとっては
非常に危険な状態となる。第2には、@記ピストン23
が前記ばね25の弾発力で押されているために、該ピス
トン23とばね25とでω6 == s”k / m
なる振動系を形成してしまいチップ21に対して機械
的な影響を与えることである。However, the cooling structure using liquid means shown in FIG. 2 also has the following serious drawbacks. The first problem is that since the semiconductor chip 21 and the metal piston 23 are in mechanical contact, the refrigerant 27 and the chip 21 cannot be electrically insulated. The refrigerant 27 is connected to the ground of the compressor and refrigerant delivery pump (both not shown) through a heat exchanger, etc., but this ground is very noisy, and unless an insulator other than water is used for the refrigerant, it is connected to the ground of the compressor and refrigerant delivery pump (both not shown). This is a very dangerous situation for the chip. Second, @mentioned piston 23
is pushed by the elastic force of the spring 25, so the piston 23 and the spring 25 produce ω6 == s”k/m
This creates a vibration system that mechanically affects the chip 21.
ここでω0は共振角周波数、にはげね25のばね定数1
mはピストン23の質量である。つまり共振周波数成分
を含む衝撃等の外力が装置に加わった場合、ピストン2
3が振動してこれと接触している半導体チップ21を破
壊しかねない。さらに第3の理由として基板20との接
続用のけんだ22に常に圧力がかかるため、クリープ変
形を生ずることである。特に低温はんだを使用した場合
にこれが著しい。Here, ω0 is the resonance angular frequency, and the spring constant of the spring 25 is 1
m is the mass of the piston 23. In other words, if an external force such as an impact containing a resonance frequency component is applied to the device, the piston 2
3 may vibrate and destroy the semiconductor chip 21 that is in contact with it. Furthermore, the third reason is that pressure is constantly applied to the solder 22 for connection to the substrate 20, which causes creep deformation. This is particularly noticeable when low temperature solder is used.
本発明の目的は、半導体チップから発生する熱を、該チ
ップ自体もしくは該チップのケースに固体物を接触させ
ることなく、しかも冷媒として効率の悪い空気を介在さ
せることなく、効率よく装置外部へ排出することができ
、かつ熱抵抗が小さく、上記従来の欠点をすべて除去し
た冷却構造を提供することにある。An object of the present invention is to efficiently discharge heat generated from a semiconductor chip to the outside of a device without bringing any solid object into contact with the chip itself or the case of the chip, and without intervening air, which is inefficient as a refrigerant. It is an object of the present invention to provide a cooling structure that is capable of cooling, has low thermal resistance, and eliminates all of the above-mentioned conventional drawbacks.
この目的のために本発明罠よる冷却構造は、基板に実装
された集積回路に熱伝導棒の第1の而即ち熱伝導、棒片
端面を微少な間隙を隔てて対向させ、基板に垂直な方向
に穿たれた熱伝導板の穴の内面と熱伝導棒の第2の而た
る側面とで形成されるすべり対偶を前記の微少間隙調整
後に固着剤にて固着して成るものであり、ざらに好1し
くは前記熱伝導板を液体冷媒で冷却するようにしたもの
である。For this purpose, the cooling structure based on the trap of the present invention is such that the first end face of the heat conduction rod is opposed to the integrated circuit mounted on the board with a small gap in between, and The sliding pair formed by the inner surface of the hole in the heat conduction plate drilled in the direction and the second side surface of the heat conduction rod is fixed with a bonding agent after the minute gap adjustment described above. Preferably, the heat conductive plate is cooled with a liquid refrigerant.
次に、本発明を、一実施例について図面を参照して説明
する。Next, one embodiment of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例を示した断面図である。第1
図を参照すると、基板2Vc実装された半導体チップな
どの集積回路1に微少間隙4を隔てて熱伝導棒5の片端
面が対向しており、該熱伝導棒5の側面と熱伝導板7に
穿たれた穴の内面とのすきまにはけんだもしくは接着剤
等の固着剤6が充てんされ、これによって前記熱伝導棒
5および熱伝導板7が互いに同定されている。しかし、
集積回路1については接続用はんだ3によって基板2に
取り付けられるためはんだの厚みが大きくばらつき、そ
の範囲は100μmを超えるのが通常であり、集積回路
1の熱伝導棒5との対向面位置が正確に定まらない。そ
こで本発明罠おいては、基板2に集積回路1をはんだ付
けした後、集積回路1の一ヒに極薄膜をのせ、基板枠8
と熱伝導板7とをねじ9にて固定し、熱伝導棒5を挿入
して集積回路1上の極薄膜に押し付けたま捷、はんだも
しくは接着剤等の固着剤6にて熱伝導棒5及び熱伝導板
7を固着した後5ねじ9をはずして熱伝導板7および基
板枠8を分離(−1極薄膜を取り去った後再度組み立て
ることにより、極薄膜の厚みと同じ微少間隙を集積回路
1と熱伝導棒5との間に実現することが可能となる。FIG. 1 is a sectional view showing an embodiment of the present invention. 1st
Referring to the figure, one end surface of a heat conduction rod 5 faces an integrated circuit 1 such as a semiconductor chip mounted on a substrate 2Vc with a minute gap 4 in between, and the side surface of the heat conduction rod 5 and a heat conduction plate 7 The gap between the drilled hole and the inner surface is filled with a fixing agent 6 such as solder or adhesive, thereby identifying the heat conductive rod 5 and the heat conductive plate 7 with each other. but,
Since the integrated circuit 1 is attached to the substrate 2 by the connecting solder 3, the thickness of the solder varies greatly, and the range is usually over 100 μm, so the position of the face of the integrated circuit 1 facing the heat conductive rod 5 is accurate. It is not determined. Therefore, in the present invention, after the integrated circuit 1 is soldered to the substrate 2, an extremely thin film is placed on one side of the integrated circuit 1, and the substrate frame 8 is
and the heat conduction plate 7 are fixed with screws 9, and the heat conduction rod 5 is inserted and pressed onto the ultra-thin film on the integrated circuit 1 with a tamper, and the heat conduction rod 5 and After fixing the heat conduction plate 7, remove the screws 9 and separate the heat conduction plate 7 and the board frame 8 (-1. By removing the ultra-thin film and reassembling it, the integrated circuit 1 has the same minute gap as the thickness of the ultra-thin film. and the heat conductive rod 5.
さら九本実施例では、前述の方法ですべての集積回路に
対して微少間隙4を設定した後、熱伝導板7の上面に水
冷ジャケット1oを固定12、該水冷ジャケット内に注
水口11から排水口12へ水13を流して冷却すること
によって集積回路1に対(7て微少間隙4を隔てて水と
け電気的に絶縁された構造の、しかも振動系を含んでぃ
々いため機械的に安全な低熱抵抗の冷却構造を実現する
ことができる。また微少間隙4に電気絶縁性の熱伝導性
光てん剤を充てんすれば、さらに熱抵抗の低い冷却構造
を実現することも可能である。Furthermore, in this embodiment, after setting minute gaps 4 for all integrated circuits by the method described above, a water cooling jacket 1o is fixed 12 on the upper surface of the heat conduction plate 7, and water is drained from the water inlet 11 into the water cooling jacket. By flowing water 13 to the opening 12 and cooling it, the integrated circuit 1 (7) has an electrically insulated structure with a small gap 4 in between, and is mechanically safe because it includes a vibration system. It is possible to realize a cooling structure with a low thermal resistance.Furthermore, by filling the minute gap 4 with an electrically insulating and thermally conductive optical filler, it is also possible to realize a cooling structure with an even lower thermal resistance.
第1図f′i不発明の一実施例て係る集積回路冷却構造
の縦断面図、第2図は従来の液体冷却構造の縦断面図で
ある。
]・・・集積回路、 2・・基板、3・・・接
続用はんだ、 4・・・微少間隙、5・・・熱伝導
棒、 6・・・固着剤、7・・・熱伝導板、
8・・基板枠。
9・・・固定ねし、 10・・・水冷ジャケット
5】3・・水。FIG. 1 is a vertical cross-sectional view of an integrated circuit cooling structure according to an embodiment of the invention, and FIG. 2 is a vertical cross-sectional view of a conventional liquid cooling structure. ]... Integrated circuit, 2... Board, 3... Solder for connection, 4... Minute gap, 5... Heat conductive rod, 6... Adhesive, 7... Heat conductive plate,
8... Board frame. 9... Fixed screw, 10... Water cooling jacket 5] 3... Water.
Claims (2)
前記集積回路に微少間隙をへだてて対向する第1の面お
よび前記基板と垂直な方向に摺動可能なすべり対偶の一
機素となる第2の面を備えた熱伝導棒と、前記熱伝導棒
を収容しかつ該熱伝導棒の前記第2の面とですべり対偶
を形成する熱伝導棒挿通穴を備えた冷却板と、前記すべ
り対偶部位に充てんされて該部位を固着する固着剤とを
有することを特徴とする冷却構造。(1) a substrate, an integrated circuit mounted on the substrate,
a heat conductive rod having a first surface facing the integrated circuit with a small gap therebetween and a second surface serving as an element of a sliding pair capable of sliding in a direction perpendicular to the substrate; a cooling plate having a heat conduction rod insertion hole that accommodates the rod and forms a sliding pair with the second surface of the heat conductive rod; and a fixing agent that is filled in the sliding pair part and fixes the part. A cooling structure characterized by having.
液体冷媒で冷却されることを特徴とする特許請求の範囲
第1項に記載した冷却構造。(2) The cooling structure according to claim 1, wherein the cooling plate is provided with a liquid refrigerant jacket and is cooled by the liquid refrigerant.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15978584A JPS6136958A (en) | 1984-07-30 | 1984-07-30 | Cooling structure of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15978584A JPS6136958A (en) | 1984-07-30 | 1984-07-30 | Cooling structure of integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6136958A true JPS6136958A (en) | 1986-02-21 |
Family
ID=15701217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15978584A Pending JPS6136958A (en) | 1984-07-30 | 1984-07-30 | Cooling structure of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6136958A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349989A (en) * | 1992-12-21 | 1994-12-22 | Internatl Business Mach Corp <Ibm> | Heat-conducting cooling device |
JP2009085526A (en) * | 2007-10-01 | 2009-04-23 | Daikin Ind Ltd | Air conditioner |
-
1984
- 1984-07-30 JP JP15978584A patent/JPS6136958A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349989A (en) * | 1992-12-21 | 1994-12-22 | Internatl Business Mach Corp <Ibm> | Heat-conducting cooling device |
JP2009085526A (en) * | 2007-10-01 | 2009-04-23 | Daikin Ind Ltd | Air conditioner |
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